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公开(公告)号：JPS63119295A
公开(公告)日：1988-05-23
申请号：JP26388786
申请日：1986-11-07
Applicant: CANON KK , CANON COMPONENTS KK
Inventor： KOBAYASHI TATSUMI
IPC: H05K3/46
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公开(公告)号：JP2016003370A
公开(公告)日：2016-01-12
申请号：JP2014124671
申请日：2014-06-17
Applicant: CANON COMPONENTS KK
Inventor： IWASHITA TASUKE
Abstract: 【課題】低コストで樹脂製品上に所望のパターンを有する金属皮膜を形成する。【解決手段】樹脂製品110の表面の一部分120に紫外線を照射する。樹脂製品110の表面に、樹脂製品110と無電解めっき触媒とのバインダー材を付与する。バインダー材が付与された樹脂製品110をアルカリ溶液で洗浄する。洗浄後の樹脂製品110の表面に、無電解めっき触媒を付与する。無電解めっき触媒が付与された樹脂製品110を無電解めっき液に浸漬する。【選択図】図1
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23.发明专利
公开(公告)号：JP2002271571A
公开(公告)日：2002-09-20
申请号：JP2001066895
申请日：2001-03-09
Applicant: CANON KK , CANON COMPONENTS KK
Inventor： SAIGA TOSHIHIRO
IPC: H01L27/146 , H04N1/028 , H04N1/031 , H04N1/191 , H04N5/335 , H04N5/341 , H04N5/343 , H04N5/345 , H04N5/369 , H04N5/374
Abstract: PROBLEM TO BE SOLVED: To easily switch high resolution reading and low resolution reading (or block reading and full pixel reading). SOLUTION: In the multichip type image sensor system, provided with a multichip type image sensor where a plurality of image sensor chips, having a selecting means for reading the signal of a photodetector by time sequentially selecting a plurality of photosensors, are arrayed and a pulse supplying means for supplying a synchronizing pulse for driving the selecting means, the pulse- supplying means is capable of switching the pulse width of the synchronizing pulse; and when reading any arbitrary photodetector among a plurality of photodetectors, a pulse width T12 of the synchronizing pulse, when selecting a photodetector except for the arbitrary photodetector, for which signal reading is not required, is made narrower than a pulse width T11 of the synchronizing pulse, when selecting the arbitrary photodetecter, for which signal reading is required.
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公开(公告)号：JP2001169053A
公开(公告)日：2001-06-22
申请号：JP34801899
申请日：1999-12-07
Applicant: CANON COMPONENTS KK
Inventor： SAITO NAOTO
Abstract: PROBLEM TO BE SOLVED: To make illumination light sufficiently insure light quantity at a position to be read on a surface of original in an ultra-thin typed linear image sensor for color using a rod lens array having a fast reading rate and high resolution. SOLUTION: A light source unit composed of light sources 1 which have high luminance and a line-shaped optical path and are respectively independent about three wavelengths of red, green and blue is housed in the housing 2 also operating as an aperture 3 and a reflector 4. Thus, the light source unit is made to have directivity and light collectivity and linear light of high luminance is efficiently supplied at the position to be read on the surface of the original.
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25.发明专利
公开(公告)号：JP2001053440A
公开(公告)日：2001-02-23
申请号：JP22453199
申请日：1999-08-06
Applicant: CANON COMPONENTS KK
Inventor： AMAMIYA HIROICHI
IPC: H05K3/46
Abstract: PROBLEM TO BE SOLVED: To freely realize impedance in a prescribed period by extremely easily and accurately normalizing the interlayer interval of the wiring layers of a multilayer substrate, selecting interlayer joining materials as necessary, and adjusting the interlayer interval to a desired value as necessary. SOLUTION: Hard insulating particles 22 shaped like spheres with prescribed particle diameters are spread in flowable insulating materials 21 having joining functions such as epoxy resin or polyimide, and the insulating particles 22 are made of materials whose qualities are the same as those of the insulating materials 21, and a substrate 1 and a copper foil 17 are pressurized by using interlayer joining materials 16 made of polymer with the high degree of polymerization compared with that of the insulating materials 21, and the shortest interval of the interlayer intervals is normalized by one insulating particle 22.
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Patent Agency Ranking
公开(公告)号：JPH11123844A
公开(公告)日：1999-05-11
申请号：JP28972297
申请日：1997-10-22
Applicant: CANON KK , CANON COMPONENTS KK
Inventor： OTSUBO TOSHIHIKO , AMIMOTO MITSURU , SHIRAISHI MITSUO , TANIOKA HIROSHI , SHOJI KAORU , KAKIMOTO SEIJI , WATANABE NOBUHIKO
Abstract: PROBLEM TO BE SOLVED: To obtain a high quality image by mounting a recording array on a pattern formed on a glass substrate or a ceramic substrate through a conductive paste. SOLUTION: A pattern 104 is formed on a glass substrate 100 by applying a copper foil or depositing copper or aluminum and a recording element array chip 101 is mounted on the pattern 104 while being connected electrically and mechanically therewith through silver paste. The pattern 104 is provided as a power supply pattern. Since the recording element array chip 101 is mounted on the glass substrate 100, the glass substrate is not deformed thermally like a conventional glass epoxy substrate even if heat is applied at the time of connection through silver paste and thereby linear arrangement of the recording element array chip 101 is not deformed thermally. According to the arrangement, a recorded image is prevented from deteriorating and a high quality recording image can be obtained.
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公开(公告)号：JPH09145420A
公开(公告)日：1997-06-06
申请号：JP30892895
申请日：1995-11-28
Applicant: CANON KK , CANON COMPONENTS KK
Inventor： TANIOKA HIROSHI , OTSUBO TOSHIHIKO , AMIMOTO MITSURU , HATAKE SHIGEO , SHOJI KAORU , KAKIMOTO SEIJI , WATANABE NOBUHIKO
Abstract: PROBLEM TO BE SOLVED: To provide a recording head capable of easily applying metal plating to the independent wiring patterns on a board corresponding to driving circuits for high-density packaging via wire bonding by providing a recording element array chip and a driving IC chip. SOLUTION: This recording head is provided with a recording element array chip, a driving IC chip 105, and a driving means connected to the recording element array chip via wiring patterns 100, 102 on a board mounted with at least the chip 105 and driving the recording element array chip. A connecting pattern electrically connecting multiple wiring patterns 100, 102 facing the chip 105 on the board correspondingly to the bonding pads 106, 107 provided on the edge of the chip 105 is formed on the board. After metal plating is applied to the wiring patterns 100, 102, the connecting pattern is removed from the surface of the board, the chip 105 is fitted, and the pads 106, 107 and the wiring patterns 100, 102 are connected via bonding wires 108, 109.
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公开(公告)号：JPH06244540A
公开(公告)日：1994-09-02
申请号：JP19406592
申请日：1992-07-21
Applicant: CANON KK , CANON COMPONENTS KK
Inventor： TAKAHASHI TAKEO
Abstract: PURPOSE:To visually discriminate a mounting position for an electronic component without printing a symbol mark. CONSTITUTION:A chip component provided with two terminals is soldered to a mounting face on a printed-circuit board 1. Lands 2, for two-terminal component, two of which constitute one set of land groups are formed. Triangular protrusions 2a whose respective tips face nearly the center O1 of the land groups are formed at end parts on the side of the center O1 of the land groups to which the individual lands 2, for two-terminal component, belong in the individual lands 2 for two-terminal component. Thereby, even when a symbol mark is not printed on the printed-circuit board, it becomes clear at a glance which land belongs to which land group.
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公开(公告)号：JPH05142779A
公开(公告)日：1993-06-11
申请号：JP33262991
申请日：1991-11-21
Applicant: ADOTETSUKU ENG KK , CANON COMPONENTS KK
Inventor： SANNOMIYA KATSUYA , SUGANO WATARU
Abstract: PURPOSE:To enable highly precise exposure by supplying fluid to the back of the film mask which abuts on an object and pressing the film mask against the object. CONSTITUTION:A table 50 is elevated to make a printed wiring board W abut on the film mask 1 and the air from a fluid source 11 is sent from an air inlet 3. At this time, the pressure is increased uniformly and gradually by a pressure accumulation tank 12, so the film mask 1 is never elongated. Further, pressure control can optionally be performed by a current proportional type air pressure reduction valve 13, so the pressure can be raised up to specific pressure in a short time. Consequently, specific high pressure is produced between the film mask 1 and a glass plate 2 with atmospheric pressure and the film mask 1 contacts the printed wiring board W. In this state, the top surface of the glass plate 2 is irradiated with light from a light source device 40 from above to print the pattern of the film mask 1 on the printed wiring board W and then the table 50 is moved down to taken the printed writing board W out.
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公开(公告)号：JPS6424491A
公开(公告)日：1989-01-26
申请号：JP17990687
申请日：1987-07-21
Applicant: CANON KK , CANON COMPONENTS KK
Inventor： TAKAHASHI TAKEO , DOI KAZUO
Abstract: PURPOSE:To make a wiring pattern section small in area so as not only to increase a component mounting in density but also enable a assured soldering of a SMD to a land by a method wherein a through-hole, filled with solder, of which one side is covered and the other side is adhered to a SMD is provided in a surface mounting device (SMD) land. CONSTITUTION:For instance, wiring patterns 104 and 105 and film resists 105 and 205 are formed on a front and a rear face of a substrate 1 respectively, where the wiring pattern 104 on the front side and the pattern 204 on the rear side are connected with each other through holes 8 and 9. And, SMD lands 103a and 103b are provided on the front face of the substrate 1. The through- hole 8 connecting the SMD land 103a with the wiring pattern 204 on the rear side is positioned just under the SMD land 103a, and its inside is filled with solder and its rear entrance is covered with the film resist 205. With this structure, a cream solder 7 is prevented from flowing into the through-hole 8, so that a SMD 2 is soldered in a excellent condition.
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