公开(公告)号：JP2001053441A

公开(公告)日：2001-02-23

申请号：JP22453299

申请日：1999-08-06

Applicant: CANON COMPONENTS KK

Inventor： AMAMIYA HIROICHI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To freely realize an initial impedance by extremely easily and accurately normalizing the interlayer interval of the wiring layers of a multilayer substrate, selecting interlayer joining materials as necessary, and adjusting the interlayer interval to a desired value as necessary. SOLUTION: Hard insulating particles 22 shaped like spheres with prescribed particle diameters are spread in flowable insulating materials 21 having joining functions such as epoxy resin or polyimide, and the insulating particles 22 are made of materials whose qualities are the same as those of the insulating materials 21 (they can be made of different materials), and a substrate 1 and a copper foil 17 are pressurized by using interlayer joining materials 16 made of polymer with the high degree of polymerization compared with that of the insulating materials 21, and the shortest interval of the interlayer intervals is normalized by one insulating particle 22.

公开(公告)号：JP2001053440A

公开(公告)日：2001-02-23

申请号：JP22453199

申请日：1999-08-06

Applicant: CANON COMPONENTS KK

Inventor： AMAMIYA HIROICHI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To freely realize impedance in a prescribed period by extremely easily and accurately normalizing the interlayer interval of the wiring layers of a multilayer substrate, selecting interlayer joining materials as necessary, and adjusting the interlayer interval to a desired value as necessary. SOLUTION: Hard insulating particles 22 shaped like spheres with prescribed particle diameters are spread in flowable insulating materials 21 having joining functions such as epoxy resin or polyimide, and the insulating particles 22 are made of materials whose qualities are the same as those of the insulating materials 21, and a substrate 1 and a copper foil 17 are pressurized by using interlayer joining materials 16 made of polymer with the high degree of polymerization compared with that of the insulating materials 21, and the shortest interval of the interlayer intervals is normalized by one insulating particle 22.