中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

50 records (took 0.041 seconds)

    METHODS FOR MANUFACTURING A MICROSTRUCTURE
    21.
    发明申请
    METHODS FOR MANUFACTURING A MICROSTRUCTURE 审中-公开
    制造微结构的方法

    公开(公告)号：WO2009048321A2

    公开(公告)日：2009-04-16

    申请号：PCT/NL2008/000217

    申请日：2008-10-03

    Applicant: MICRONIT MICROFLUIDICS B.V. ,  VAN'T OEVER, Ronny ,  BLOM, Marko, Theodoor ,  OONK, Johannes

    Inventor： VAN'T OEVER, Ronny ,  BLOM, Marko, Theodoor ,  OONK, Johannes

    IPC: B81C1/00

    CPC classification number: B81C1/00119 ,  B81B2203/0376 ,  B81C1/00103 ,  B81C2201/0146

    Abstract: Methods for manufacturing a microstructure, wherein use is made of powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, characterized in that the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of 'vertical' erosion, i.e. parallel to the thickness direction, and 'horizontal' erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure. By selecting the size of the mask openings and the mask structures in a correct manner the mask layer in a region with smaller mask structures will be fully worn away at a given point in time, while in another region with larger structures the mask layer still has sufficient thickness to serve as protection against the powder blasting or etching.

    Abstract translation: 用于制造微结构的方法，其中使用粉末喷射和/或蚀刻以及具有不同尺寸的开口和结构的单个掩模层，其特征在于，所述掩模层至少在一个给定点 随着时间的推移，在至少一个区域内被掩模侵蚀完全磨损，而微观结构尚未完全实现。 可以使用“垂直”侵蚀（即平行于厚度方向）和掩模层的“水平”侵蚀（即垂直于厚度方向）的组合。 水平掩模腐蚀发生在掩模结构的边缘处。 通过以正确的方式选择掩模开口和掩模结构的大小，具有较小掩模结构的区域中的掩模层将在给定时间点完全磨损，而在具有较大结构的另一区域中，掩模层仍然具有 足够的厚度以防止粉末喷射或蚀刻。

    DEVICE AND METHOD FOR FLUIDIC COUPLING OF FLUIDIC CONDUITS TO A MICROFLUIDIC CHIP, AND UNCOUPLING THEREOF
    22.
    发明申请
    DEVICE AND METHOD FOR FLUIDIC COUPLING OF FLUIDIC CONDUITS TO A MICROFLUIDIC CHIP, AND UNCOUPLING THEREOF 审中-公开
    流体连接流体耦合到微流控芯片的装置和方法及其解决方案

    公开(公告)号：WO2009002152A1

    公开(公告)日：2008-12-31

    申请号：PCT/NL2008/000156

    申请日：2008-06-23

    Applicant: MICRONIT MICROFLUIDICS B.V. ,  VAN'T OEVER, Ronny ,  BLOM,Marko, Theodoor ,  BUESINK, Wilfred

    Inventor： VAN'T OEVER, Ronny ,  BLOM,Marko, Theodoor ,  BUESINK, Wilfred

    IPC: B01L9/00

    CPC classification number: B01L3/502715 ,  B01L3/565 ,  B01L9/527 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2300/0816 ,  Y10T29/49945 ,  Y10T29/5367 ,  Y10T29/53678 ,  Y10T29/53709 ,  Y10T29/53783 ,  Y10T29/53943 ,  Y10T29/53983 ,  Y10T29/53987 ,  Y10T29/53996

    Abstract: A system for fluidic coupling and uncoupling of fluidic conduits (2,2') and a microfluidic chip (3), wherein the fluidic conduits are connected mechanically to a first structural part (7) and the microfluidic chip is carried by a second structural part (8), which structural parts are moved according to the invention perpendicularly toward and away from each other by means of a mechanism (4) provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to an outer surface of the microfluidic chip and connecting openings present in the outer surface of the microfluidic chip, this enabling accurate realization of fluidic couplings and uncouplings without the occurrence of undesirable moments of force and with a minimal risk of damage to the fluidic conduits or the connecting openings. With such a system requirements which can be set in respect of convenience of use, speed of operation, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.

    Abstract translation: 一种用于流体连接和解耦流体导管（2,2'）和微流体芯片（3）的系统，其中流体导管机械地连接到第一结构部件（7），并且微流体芯片由第二结构部件 （8），根据本发明，结构部件通过为此目的设置的机构（4）垂直地彼此移动并远离彼此。 因此，流体导管的外端可以基本上垂直于微流体芯片的外表面确定的距离和存在于微流体芯片的外表面中的连接开口移动，这使得能够精确地实现流体耦合和解耦，而不会发生 不期望的力矩和对流体导管或连接开口的破坏风险最小。 可以实现在使用方便性，操作速度，耐温性，密封性，耐化学性，再现性等方面可以设定的这种系统要求。

    METHOD OF DIVIDING A SUBSTRATE INTO A PLURALITY OF INDIVIDUAL CHIP PARTS
    23.
    发明申请
    METHOD OF DIVIDING A SUBSTRATE INTO A PLURALITY OF INDIVIDUAL CHIP PARTS 审中-公开
    将基材分成多个个体芯片部件的方法

    公开(公告)号：WO2003051765A2

    公开(公告)日：2003-06-26

    申请号：PCT/NL2002/000850

    申请日：2002-12-19

    Applicant: MICRONIT MICROFLUIDICS B.V. ,  VAN'T OEVER, Ronny

    Inventor： VAN'T OEVER, Ronny

    IPC: B81C1/00

    CPC classification number: B81C1/00888

    Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.

    Abstract translation: 本发明涉及一种将基板分割为多个单独的芯片部件的方法，包括以下步骤：在基板中形成多个芯片部件，每个芯片部分包括在基板中设置用于容纳流体的凹槽 沿着各个芯片部分沿着单个芯片部分布置一个或多个断裂槽到基板上，以沿着断裂槽破坏基板。 本发明还涉及基板以及芯片部分。

    METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE
    24.
    发明公开
    METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE 审中-公开
    VERFAHREN ZUR HERSTELLUNG EINES ELEKTRISCH LEITENDEN DURCHGANGS BEI EINEM SUBSTRAT

    公开(公告)号：EP2915188A1

    公开(公告)日：2015-09-09

    申请号：EP13801864.3

    申请日：2013-11-05

    Applicant: Micronit Microfluidics B.V.

    Inventor： VAN'T OEVER, Ronny ,  BLOM, Marko Theodoor ,  HANEVELD, Jeroen ,  OONK, Johannes ,  TIJSSEN, Peter

    IPC: H01L21/48 ,  H01L23/14 ,  H01L21/683

    Abstract: A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

    Abstract translation: 本发明涉及一种用于在衬底中形成导电通孔的方法，并且这种衬底包括导电的方法，所述方法包括以适当顺序执行的步骤：a）提供作为所述衬底的第一衬底; b）在所述第一衬底中形成通孔; c）提供第二基底; d）使所述第二基板的第一表面与所述第一基板的所述第一表面接触，使得所述第一基板中的所述通孔被所述第二基板的所述第一表面覆盖; e）通过用于形成所述导电通孔的电镀用导电材料填充所述第一衬底中的所述通孔，以及f）去除所述第二衬底，其中所述第一衬底的所述第一表面和所述第二衬底的所述第一表面 每个表面粗糙度R a小于2nm，优选小于1nm，更优选小于0.5nm，并且在步骤（d）中，所述第一衬底的所述第一表面和所述第二衬底的所述第一表面是 导致彼此直接接触，从而在其间形成直接粘结。

    Method of dividing a substrate into a plurality of individual chip parts
    29.
    发明公开
    Method of dividing a substrate into a plurality of individual chip parts 审中-公开
    Methode zur Abtrennung eines底物在mehreren einzelnen Anordnungen

    公开(公告)号：EP2390225A2

    公开(公告)日：2011-11-30

    申请号：EP11178879.0

    申请日：2002-12-19

    Applicant: Micronit Microfluidics B.V.

    Inventor： Van't Oever, Ronny

    IPC: B81C1/00 ,  B41J2/00

    CPC classification number: B81C1/00888

    Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of:
    forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid;
    arranging one or more breaking grooves in the substrate along individual chip parts;
    applying mechanical force to the substrate to break the substrate along the breaking grooves;

    wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously,
    wherein the substrate comprises a first and a second substrate part, and the method comprises the steps of:
    a) arranging in the first substrate part at least one recess for containing fluid;
    b) arranging in the second substrate part passages to the recess in the first substrate part, wherein a first passage forms a fluid feed and a second passage forms a fluid discharge;
    c) arranging one or more breaking grooves in at least one of the substrate parts;
    d) placing the second substrate part on the first substrate part;
    e) breaking the substrate along the breaking grooves.

    Abstract translation: 本发明涉及一种将基板分割成多个单独芯片部件的方法，包括以下步骤：在基板中形成多个芯片部件，每个芯片部分包括在基板中设置用于容纳流体的凹槽 ; 沿着各个芯片部分在基板中布置一个或多个断开槽; 向基板施加机械力以沿着断裂槽破坏基板; 其特征在于，基板上同时进行在基板上排列凹部并配置断开槽的工序，其特征在于，所述基板包括第一基板部和第二基板部，所述方法包括以下工序：a）在所述第一基板部 至少一个用于容纳流体的凹槽; b）将第二基板部分通道布置在第一基板部分中的凹部中，其中第一通道形成流体进料，第二通道形成流体排放; c）在至少一个所述衬底部分中布置一个或多个断开槽; d）将第二基板部分放置在第一基板部分上; e）沿断裂槽破坏基板。

    Micromixing chamber, micromixer comprising a plurality of such micromixing chambers and methods for manufacturing thereof
    30.
    发明授权
    Micromixing chamber, micromixer comprising a plurality of such micromixing chambers and methods for manufacturing thereof 有权
    微混合室微混合器具有多个这样的微观混合腔室和工艺及其生产

    公开(公告)号：EP2089144B1

    公开(公告)日：2011-10-05

    申请号：EP07834592.3

    申请日：2007-11-05

    Applicant: Micronit Microfluidics B.V.

    Inventor： BLOM, Marko, Theodoor ,  MULDER, Michaël Christiaan ,  MACLEOD MACINNES, Jordan ,  ALLEN, Raymond William Kenneth

    IPC: B01F5/00 ,  B01F13/00 ,  B01F5/06

    CPC classification number: B01F13/0064 ,  B01F5/0057 ,  B01F5/0646 ,  B01F5/0652 ,  Y10T29/49826

    Abstract: Micromixing chamber, roughly in the form of an hourglass which is provided at a first outer end with a tangential inflow opening (3a, 3c) and at a second outer end with a tangential outflow opening (5a, 5d), which mixing chamber in the overall flow direction first narrows more or less gradually and subsequently widens more or less abruptly. Also micromixer comprising a plurality of such micromixing chambers connected fluidically in series. Also methods for manufacturing such a micromixing chamber or such a micromixer. Also methods for mixing by means of such a micromixing chamber or by means of such a micromixer. A circulating flow in the form of a helix is formed in such a micromixing chamber. A circulating movement forming the beginning of the helix is created in a first part. The circulating movement is gradually accelerated by the more or less gradual narrowing. The gradualness is important in keeping the overall pressure drop over the micromixing chamber within limits. A more or less abrupt widening of the rapidly rotating helix then takes place which is found to provide an additionally good mixing. It is thus found possible to achieve a very efficient and rapid mixing. A micromixing chamber or micromixer according to the invention compatible with known microfluidic devices can be manufactured here from materials usual for the purpose, such as glass, preferably by means of techniques usual in the relevant field, such as powder blasting, etching and bonding.

Patent Agency Ranking