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    Device and Method for Measuring a Volume of a Liquid and Method and Device for Calibrating a Liquid Dispensing System
    2.
    发明申请
    Device and Method for Measuring a Volume of a Liquid and Method and Device for Calibrating a Liquid Dispensing System 审中-公开
    用于测量液体体积的装置和方法以及用于校准液体分配系统的方法和装置

    公开(公告)号：US20160231163A1

    公开(公告)日：2016-08-11

    申请号：US15029847

    申请日：2014-12-24

    Applicant: MICRONIT MICROFLUIDICS B.V.

    Inventor： Ronny Van 't Oever ,  Marko Theodoor Blom ,  Adriaan Johannes Nutma ,  Herman Jacobus Blok

    IPC: G01F25/00 ,  G01F13/00

    CPC classification number: G01F25/0007 ,  G01B13/00 ,  G01F13/00 ,  G01F25/0092

    Abstract: The invention relates to a device for measuring a volume of a liquid, said device comprising:—a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and—a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein:—the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and—a length of a liquid slug in the capillary channel is a measure for said volume. The invention further relates to a method for measuring a volume of a liquid using such a device, a method for calibrating a liquid dispensing system using such a device, a calibrating system for calibrating a liquid dispensing system using such a device and a support for supporting a plurality of such devices.

    Abstract translation: 本发明涉及一种用于测量液体体积的装置，所述装置包括： - 用于接收所述液体的容器，所述容器包括入口和出口，以及具有毛细管作用的毛细通道，所述毛细通道具有 预定的内部横截面，其中在其第一端处的毛细通道的入口通过与所述容器的出口开口的流动连接处于液体中，并且其中所述毛细通道的另一个第二端包括开口; 其中： - 所述容器的入口开口具有比所述毛细通道的入口更大的横截面，并且所述毛细通道中的液体塞的长度是所述体积的量度。 本发明还涉及使用这种装置测量液体体积的方法，使用这种装置校准液体分配系统的方法，使用这种装置校准液体分配系统的校准系统和用于支撑 多个这样的设备。

    Method of fabrication of a microfluidic device
    3.
    发明申请
    Method of fabrication of a microfluidic device 有权
    微流体装置的制造方法

    公开(公告)号：US20030226604A1

    公开(公告)日：2003-12-11

    申请号：US10440515

    申请日：2003-05-16

    Applicant: MICRONIT MICROFLUIDICS B.V.

    Inventor： Stefan Schlautmann ,  Albert Van den Berg ,  Johannes Gerardus Elisabeth Gardeniers

    IPC: F15C001/04

    CPC classification number: B81C1/00119 ,  B01L3/502707 ,  B01L2200/10 ,  B01L2300/0874 ,  B01L2300/0883 ,  B01L2300/0887 ,  B01L2400/0418 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/0104 ,  G01N33/48707 ,  Y10T137/2191

    Abstract: The present invention relates to a method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of: a) etching at least a channel and one or more fluid ports in a first and/or a second substrate; b) depositing a first layer on a surface of the second substrate; c) partially removing the first layer in accordance with a predefined geometry; d) depositing a second layer on top of the first layer and the substrate surface; e) planarizing the second layer so as to smooth the upper surface thereof; f) aligning the first and second substrate; g) bonding the first substrate on the planarized second layer of the second substrate.

    Abstract translation: 本发明涉及一种制造微流体装置的方法，该微流体装置包括具有流体通道的至少两个基板，包括以下步骤：a）至少蚀刻第一和/或第二基板中的通道和一个或多个流体端口 ; b）在第二基板的表面上沉积第一层; c）根据预定几何部分去除第一层; d）在第一层和衬底表面的顶部上沉积第二层; e）平面化第二层以平滑其上表面; f）对准所述第一和第二基板; g）将第一衬底接合在第二衬底的平坦化的第二层上。

    METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE
    4.
    发明申请
    METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE 有权
    通过基板形成电导通的方法

    公开(公告)号：US20150262874A1

    公开(公告)日：2015-09-17

    申请号：US14440814

    申请日：2013-11-05

    Applicant: MICRONIT MICROFLUIDICS B.V.

    Inventor： Ronny Van'T Oever ,  Marko Theodoor Blom ,  Jeroen Haneveld ,  Johannes Oonk ,  Peter Tijssen

    IPC: H01L21/768 ,  H01L23/498 ,  H01L21/48

    CPC classification number: H01L21/76879 ,  B81C1/00095 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and in that in step (d) said first surface of said first substrate and said first surface of said second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

    Abstract translation: 本发明涉及一种用于在衬底中形成导电通孔的方法，并且这种衬底包括导电的所述方法，所述方法包括以适当顺序执行的以下步骤：a）提供作为所述衬底的第一衬底; b）在所述第一衬底中形成通孔; c）提供第二衬底; d）使所述第二基板的第一表面与所述第一基板的所述第一表面接触，使得所述第一基板中的所述通孔被所述第二基板的所述第一表面覆盖; e）通过用于形成所述导电通孔的电镀用导电材料填充所述第一衬底中的所述通孔，以及f）去除所述第二衬底，其中所述第一衬底的所述第一表面和所述第二衬底的所述第一表面 每个表面粗糙度R a小于2nm，优选小于1nm，更优选小于0.5nm，并且在步骤（d）中，所述第一衬底的所述第一表面和所述第二衬底的所述第一表面是 导致彼此直接接触，从而在其间形成直接粘结。

    METHOD FOR MANUFACTURING MICROFLUIDIC CHIPS, DEVICE FOR FUNCTIONALIZING MICROFLUIDIC CHIPS, MICROFLUIDIC CHIP AND DEVICE FOR HOLDING A MICROFLUIDIC CHIP
    5.
    发明申请
    METHOD FOR MANUFACTURING MICROFLUIDIC CHIPS, DEVICE FOR FUNCTIONALIZING MICROFLUIDIC CHIPS, MICROFLUIDIC CHIP AND DEVICE FOR HOLDING A MICROFLUIDIC CHIP 有权
    用于制造微流感药液的方法，用于功能化微流感药剂的装置，用于保持微流感芯片的微流感芯片和装置

    公开(公告)号：US20140246801A1

    公开(公告)日：2014-09-04

    申请号：US13782752

    申请日：2013-03-01

    Applicant: MICRONIT MICROFLUIDICS B.V.

    Inventor： Marinus Bernardus OLDE RIEKERINK ,  Wilfred BUESINK ,  Arenda Hendrika Jacoba KOELEWIJN-HUBERS ,  Marko Theodoor BLOM ,  Ronny VAN 'T OEVER

    IPC: B29C63/00

    CPC classification number: B01L3/502707 ,  B01J2219/00286 ,  B01J2219/00585 ,  B01J2219/00637 ,  B01L9/527 ,  B01L2300/0816 ,  B01L2300/0883 ,  B01L2300/16 ,  B29C69/005 ,  B29C70/545 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/0063 ,  B81B2201/058 ,  B81C1/00206 ,  Y10T137/8593 ,  Y10T156/1052

    Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply.The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

    Abstract translation: 本发明涉及一种用于制造具有至少一个用于流体流通的毛细管的微流体芯片的方法，包括以下步骤：（a）提供起始材料; （b）在原料中形成至少一个共用毛细管，所述共用毛细管包括流体入口和流体出口; （c）通过向共用毛细管提供官能化流体来使芯片功能化; 和（d）将原料分成单独的碎片。 本发明还涉及一种用于对具有至少一个用于流体流通的毛细管进行功能化的微流体芯片的装置，所述装置包括用于在官能化期间将起始材料保持在固定位置的材料保持器，所述材料保持器包括至少一个入口 连接器，用于将形成在起始材料中的至少一个共用毛细管连接到功能化流体供应源。 本发明还涉及微流控芯片和用于保持微流控芯片的装置。

    METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE
    9.
    发明申请
    METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE 审中-公开
    通过基板形成电导通的方法

    公开(公告)号：WO2014070017A1

    公开(公告)日：2014-05-08

    申请号：PCT/NL2013/050787

    申请日：2013-11-05

    Applicant: MICRONIT MICROFLUIDICS B.V.

    Inventor： VAN'T OEVER, Ronny ,  BLOM, Marko Theodoor ,  HANEVELD, Jeroen ,  OONK, Johannes ,  TIJSSEN, Peter

    IPC: H01L21/48 ,  H01L23/14 ,  H01L21/683

    CPC classification number: H01L21/76879 ,  B81C1/00095 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2nm, preferably less than 1 nm, more preferably less than 0.5 nm, and in that in step (d) said first surface of said first substrate and said first surface of said second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

    Abstract translation: 本发明涉及一种用于在衬底中形成导电通孔的方法，并且这种衬底包括导电的所述方法，所述方法包括以适当顺序执行的以下步骤：a）提供作为所述衬底的第一衬底; b）在所述第一衬底中形成通孔; c）提供第二衬底; d）使所述第二基板的第一表面与所述第一基板的所述第一表面接触，使得所述第一基板中的所述通孔被所述第二基板的所述第一表面覆盖; e）通过用于形成所述导电通孔的电镀用导电材料填充所述第一衬底中的所述通孔，以及f）去除所述第二衬底，其中所述第一衬底的所述第一表面和所述第二衬底的所述第一表面 每个表面粗糙度R a小于2nm，优选小于1nm，更优选小于0.5nm，并且在步骤（d）中，使所述第一基板的所述第一表面和所述第二基板的所述第一表面带入 彼此直接接触，从而在其间形成直接粘结。

    ASSEMBLY OF AT LEAST ONE MICROFLUIDIC DEVICE AND A MOUNTING PIECE, MOUNTING PIECE AND METHODS FOR MANUFACTURE AND USE OF SUCH AN ASSEMBLY
    10.
    发明申请
    ASSEMBLY OF AT LEAST ONE MICROFLUIDIC DEVICE AND A MOUNTING PIECE, MOUNTING PIECE AND METHODS FOR MANUFACTURE AND USE OF SUCH AN ASSEMBLY 审中-公开
    至少一个微流体装置的组装和安装件，安装件及其制造和使用这种装配的方法

    公开(公告)号：WO2008030088A2

    公开(公告)日：2008-03-13

    申请号：PCT/NL2007/000214

    申请日：2007-08-31

    Applicant: MICRONIT MICROFLUIDICS B.V. ,  VAN'T OEVER, Ronny ,  BLOM, Marko, Theodoor

    Inventor： VAN'T OEVER, Ronny ,  BLOM, Marko, Theodoor

    CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L3/5635 ,  B01L2200/027 ,  B01L2200/0642 ,  B01L2300/0645

    Abstract: The invention relates to an assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port is situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece. The invention further relates to a method for manufacturing such an assembly and a method for use thereof. What is essential is that external fluidic components, in particular reservoirs or wells, are not connected, as is usual, to ports in the 'upper surface' of a microchip, but to ports in an outer end or side surface thereof, and that more space thereby remains available on the 'upper surface' and 'lower surface' of the microchip, for instance for visual inspection or other operations, or that the 'upper surface' and 'lower surface' of the microchip can thereby be smaller and the device or the system can thus be given a more compact form. Furthermore, an additional process such as powder-blasting or drilling is then often no longer necessary.

    Abstract translation: 本发明涉及包括至少一个微流体装置和安装件的组件，该微流体装置包括至少一个材料层和至少一个第一流体端口，该第一流体端口至少部分地位于材料的端面中 层，并且所述安装件包括至少一个流体部件，其中通过为此目的提供的第一联接装置将安装件联接到微流体装置，使得流体部件连接到第一流体端口。 本发明还涉及这种安装件。 本发明还涉及制造这种组件的方法及其使用方法。 重要的是，外部流体组分，特别是储存器或井，不像通常那样连接到微芯片的“上表面”中的端口，而是连接到其外端或侧表面中的端口，并且更多 因此，在微芯片的“上表面”和“下表面”上保持可用的空间，例如用于目视检查或其他操作，或者微芯片的“上表面”和“下表面”可以更小，并且该装置 或者可以给予系统更紧凑的形式。 此外，通常不再需要附加的过程，例如粉末喷射或钻孔。

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