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    TUNABLE BI-DIRECTIONAL TRANSCEIVER
    21.
    发明申请
    TUNABLE BI-DIRECTIONAL TRANSCEIVER 审中-公开
    单向双向收发器

    公开(公告)号：WO2013096688A1

    公开(公告)日：2013-06-27

    申请号：PCT/US2012/071075

    申请日：2012-12-20

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： STONE, Robert ,  MIZRAHI, Amit

    IPC: H04B1/00

    CPC classification number: H04B10/40

    Abstract: A transceiver includes an optical waveguide and a first filter optically coupled to the optical waveguide and operable to filter a first optical signal in a first wavelength band propagating downstream. A center wavelength of the first wavelength band is tunable. The transceiver also includes a first receiver optically coupled to the first filter and a second filter optically coupled to the optical waveguide and operable to filter a second optical signal in a second wavelength band propagating downstream. The second wavelength band is different from the first wavelength band. The transceiver further includes a second receiver optically coupled to the second filter to receive the second optical signal and a laser optically coupled to the optical waveguide and operable to output radiation in a third wavelength band propagating upstream. The third wavelength band is different from both the first wavelength band and the second wavelength band.

    Abstract translation: 收发器包括光波导和光学耦合到光波导的第一滤光器，并且可操作以对在下游传播的第一波长带中的第一光信号进行滤波。 第一波长带的中心波长是可调谐的。 收发器还包括光耦合到第一滤波器的第一接收器和光耦合到光波导的第二滤波器，并且可操作以对在下游传播的第二波长带中的第二光信号进行滤波。 第二波长带与第一波长带不同。 收发器还包括光耦合到第二滤波器以接收第二光信号的第二接收器和与光波导光耦合的激光器，并可操作以输出在上游传播的第三波长带中的辐射。 第三波长带与第一波长带和第二波长带不同。

    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING
    22.
    发明申请
    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING 审中-公开
    用于模板辅助波形粘结的方法和系统

    公开(公告)号：WO2012078361A1

    公开(公告)日：2012-06-14

    申请号：PCT/US2011/061951

    申请日：2011-11-22

    Applicant: SKORPIOS TECHNOLOGIES, INC. ,  DALLESASSE, John ,  KRASULICK, Stephen, B.

    Inventor： DALLESASSE, John ,  KRASULICK, Stephen, B.

    IPC: B32B27/00 ,  B32B27/32 ,  H01L21/30

    CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

    Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the SOI substrate and the assembly substrate, joining the SOI substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括多个硅基器件的SOI衬底，并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子管芯安装在组装衬底的预定部分上，对准SOI衬底和组装衬底，将SOI衬底和组件衬底接合以形成复合衬底结构，并且在 组合衬底的至少一部分从复合衬底结构。

    METHOD AND SYSTEM FOR PERFORMING TESTING OF PHOTONIC DEVICES
    26.
    发明申请
    METHOD AND SYSTEM FOR PERFORMING TESTING OF PHOTONIC DEVICES 审中-公开

    公开(公告)号：WO2014025824A3

    公开(公告)日：2014-02-13

    申请号：PCT/US2013/053856

    申请日：2013-08-06

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： STONE, Robert J. ,  KRASULICK, Stephen B.

    IPC: G02B6/12

    Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS
    27.
    发明申请
    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS 审中-公开
    用于监视和控制RF信号的电路的单片集成方法和系统

    公开(公告)号：WO2014025683A2

    公开(公告)日：2014-02-13

    申请号：PCT/US2013/053606

    申请日：2013-08-05

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： KRASULICK, Stephen B. ,  CREAZZO, Timothy ,  JHA, Kalpit ,  MARCHENA, Elton ,  MIZRAHI, Amit

    CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

    Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号，并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分，在BPSK调制器的第二臂处接收第二部分，向BPSK调制器的第一臂应用第一音调，并将第二音调应用于 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率，并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

    HYBRID OPTICAL MODULATOR
    28.
    发明申请
    HYBRID OPTICAL MODULATOR 审中-公开
    混合光学调制器

    公开(公告)号：WO2013155378A1

    公开(公告)日：2013-10-17

    申请号：PCT/US2013/036313

    申请日：2013-04-12

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： SPANN, John Y. ,  VAN ORDEN, Derek ,  MIZRAHI, Amit ,  CREAZZO, Timothy ,  MARCHENA, Elton ,  STONE, Robert J. ,  KRASULICK, Stephen B.

    IPC: G02F1/01

    CPC classification number: G02F1/025 ,  G02F1/2257 ,  G02F2202/102 ,  G02F2202/105 ,  H01L21/02538 ,  H01L29/20

    Abstract: An optical modulator includes an input port, a first waveguide region comprising silicon and optically coupled to the input port, and a waveguide splitter optically coupled to the first waveguide region and having a first output and a second output. The optical modulator also includes a first phase adjustment section optically coupled to the first output and comprising a first III-V diode and a second phase adjustment section optically coupled to the second output and comprising a second III-V diode. The optical modulator further includes a waveguide coupler optically coupled to the first phase adjustment section and the second phase adjustment section, a second waveguide region comprising silicon and optically coupled to the waveguide coupler, and an output port optically coupled to the second waveguide region.

    Abstract translation: 光调制器包括输入端口，包括硅并且光耦合到输入端口的第一波导区域，以及光耦合到第一波导区域并具有第一输出和第二输出的波导分路器。 光调制器还包括光耦合到第一输出并包括第一III-V二极管的第一相位调节部分和与第二输出光耦合并且包括第二III-V二极管的第二相位调整部分。 光调制器还包括光耦合到第一相位调整部分和第二相位调整部分的波导耦合器，包括硅并光耦合到波导耦合器的第二波导区域以及光耦合到第二波导区域的输出端口。

    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS
    29.
    发明申请
    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS 审中-公开
    使用PEDESTALS模板辅助波形粘结的方法和系统

    公开(公告)号：WO2013103769A1

    公开(公告)日：2013-07-11

    申请号：PCT/US2013/020226

    申请日：2013-01-04

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： MARCHENA, Elton

    IPC: H01L21/822

    CPC classification number: H01L21/8258 ,  G02B6/13 ,  H01L21/76251 ,  H01L31/18 ,  H01L33/005 ,  H01S5/0215 ,  H01S5/3013

    Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板，并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个，从而提供其上设置有一个或多个结构的第二基板，以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构，并从复合基板结构去除第一基板的至少一部分。

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