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公开(公告)号：US09401349B2
公开(公告)日：2016-07-26
申请号：US14723893
申请日：2015-05-28
Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Malta) Ltd , STMicroelectronics S.r.l.
Inventor： Angelo Crobu , Kenneth Fonk , Romain Coffy
CPC classification number: H01L25/18 , G01L19/0084 , G01L19/147 , G01L19/148 , H01L23/24 , H01L23/3157 , H01L24/10 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/10135 , H01L2224/10165 , H01L2224/1319 , H01L2224/16145 , H01L2224/26122 , H01L2224/26135 , H01L2224/29007 , H01L2224/29021 , H01L2224/29036 , H01L2224/32014 , H01L2224/32111 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48106 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49175 , H01L2224/73207 , H01L2224/73257 , H01L2224/73265 , H01L2224/83192 , H01L2224/83855 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2225/06575 , H01L2924/00014 , H01L2924/14 , H01L2924/146 , H01L2924/16151 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
Abstract: A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.
Abstract translation: 一堆芯片由第一集成电路芯片和第二集成电路芯片形成。 芯片具有通过插入的间隔件彼此分离的相对面。 间隔件通过粘合固定到只有一个相对的面。 相对的面通过与间隔物分离的局部粘合剂彼此紧固。
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22.发明申请WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS 有权MEMS传感器装置的水平包装和相应的制造工艺公开(公告)号：US20160185593A1
公开(公告)日：2016-06-30
申请号：US14860157
申请日：2015-09-21
Applicant: STMICROELECTRONICS (MALTA) LTD
Inventor： Conrad CACHIA , David Oscar VELLA , Damian AGIUS , Maria SPITERI
CPC classification number: B81B7/007 , B81B2207/098 , B81C1/00301 , B81C2203/0154 , H01L23/3121 , H01L24/97 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73227 , H01L2224/73265 , H01L2924/00012 , H01L2924/0002 , H01L2924/181 , H01L2924/18161 , H01L2924/00
Abstract: A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.
Abstract translation: 具有晶片级封装的MEMS器件提供有：第一管芯和第二管芯的堆叠，其限定至少一个封装内部的第一内表面，并且至少承载一个电接触焊盘，以及至少第一管 外部表面，并且限定包装的第一外表面; 以及模具化合物，至少部分地涂覆第一和第二模具的堆叠并且具有限定与第一外表面相对的包装的第二外表面的至少一部分的前表面。 所述MEMS器件进一步具有：从所述接触焊盘在所述第一内表面向模具化合物的前表面延伸的至少垂直连接结构; 以及至少一个外部连接元件，其在垂直连接结构处电耦合并暴露于封装的外部。
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公开(公告)号：US12017910B2
公开(公告)日：2024-06-25
申请号：US18079704
申请日：2022-12-12
Applicant: STMicroelectronics (MALTA) Ltd , STMicroelectronics S.r.l.
Inventor： Kevin Formosa , Marco Del Sarto
CPC classification number: B81C1/00333 , B81B7/0077 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , B81C2203/0154 , B81C2203/0792
Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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公开(公告)号：US11352251B2
公开(公告)日：2022-06-07
申请号：US16831302
申请日：2020-03-26
Applicant: STMicroelectronics (Malta) Ltd
Inventor： Kevin Formosa , Eftal Saribas
Abstract: An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.
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公开(公告)号：US11309237B2
公开(公告)日：2022-04-19
申请号：US16586643
申请日：2019-09-27
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS (MALTA) LTD
Inventor： Marco Del Sarto , Alex Gritti , Pierpaolo Recanatini , Michael Borg
IPC: H01L23/498 , H01L23/31
Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.
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Patent Agency Ranking
公开(公告)号：US20210204049A1
公开(公告)日：2021-07-01
申请号：US17204613
申请日：2021-03-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto BRIOSCHI , Paul Anthony BARBARA
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US11032629B2
公开(公告)日：2021-06-08
申请号：US16235927
申请日：2018-12-28
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Paul Anthony Barbara
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US10882738B2
公开(公告)日：2021-01-05
申请号：US16547093
申请日：2019-08-21
Applicant: STMICROELECTRONICS (MALTA) LTD
Inventor： Conrad Cachia , David Oscar Vella , Damian Agius , Maria Spiteri
Abstract: A MEMS device package comprising a first die of semiconductor material including a contact pad and a second die of semiconductor material stacked on the first die. The second die is smaller than the first die. The second die includes a contact pad, and a conductive wire is coupled between the contact pad of the first die and a contact pad of the second die. A mold compound is on the second die and the first die. A vertical connection structure is on the contact pad of the second die. The vertical connection structure extends through the mold compound.
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公开(公告)号：US20200307991A1
公开(公告)日：2020-10-01
申请号：US16831302
申请日：2020-03-26
Applicant: STMicroelectronics (Malta) Ltd
Inventor： Kevin FORMOSA , Eftal SARIBAS
Abstract: An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.
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公开(公告)号：US20190184579A1
公开(公告)日：2019-06-20
申请号：US15842511
申请日：2017-12-14
Applicant: STMicroelectronics (Malta) LTD
Inventor： Ryan Debono , Stanley Martin Parnis , Nathan John Zammit
CPC classification number: B25J15/0608 , F15B15/2815 , H05K13/0404 , H05K13/08
Abstract: One or more embodiments are directed to cap attach trays for holding barrel caps such that a pick-and-place tool can readily identify the cap and pick the barrel cap from the cap attach tray during the manufacturing process. The cap attach trays include a receiving layer having a plurality of protrusions each of which secures a barrel cap by mating to a through-hole in the barrel cap.
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