다공성 구조를 가지는 전사 물질의 패턴 형성 방법
    21.
    发明公开
    다공성 구조를 가지는 전사 물질의 패턴 형성 방법 无效
    传输多孔结构材料的方法

    公开(公告)号:KR1020140101497A

    公开(公告)日:2014-08-20

    申请号:KR1020130014498

    申请日:2013-02-08

    CPC classification number: H01L21/0274 B32B15/08 B32B18/00 B32B27/06

    Abstract: The present invention relates to a patterning method of a transferring material having a porous structure, comprising the steps of: adsorbing a transferring material to a mold; applying a solution to a substrate; expanding a mold by allowing the mold to adsorb the solution by bringing the solution applied to the substrate in contact with the transferring material adsorbed to the mold; and making the transferring material of the mold adsorbed to the substrate.

    Abstract translation: 本发明涉及具有多孔结构的转印材料的图案化方法,包括以下步骤:将转印材料吸附到模具中; 将溶液施加到基底上; 通过使得模具通过使施加到基板上的溶液与吸附在模具上的转印材料接触而使模具吸附溶液; 并使模具的转印材料吸附到基板上。

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