비접촉 프린팅을 이용한 미세 구조물의 패턴 형성 방법
    1.
    发明授权
    비접촉 프린팅을 이용한 미세 구조물의 패턴 형성 방법 有权
    使用非接触式印刷的精细结构图案方法

    公开(公告)号:KR101598827B1

    公开(公告)日:2016-03-03

    申请号:KR1020130021467

    申请日:2013-02-27

    Abstract: 본원은, 비접촉방법을이용한미세구조물의선택적패턴형성방법에관한것으로서, 기재에용매및 전사물질을함유한용액을도포하는단계; 및, 상기기재를패턴된몰드와접촉시켜, 상기기재에도포된용액중 용매만이상기몰드에선택적으로흡수되어상기기재상에상기전사물질을잔류시키는단계를포함한다.

    비접촉 프린팅을 이용한 미세 구조물의 패턴 형성 방법
    2.
    发明公开
    비접촉 프린팅을 이용한 미세 구조물의 패턴 형성 방법 有权
    使用非接触式印刷的精细结构图案方法

    公开(公告)号:KR1020140108438A

    公开(公告)日:2014-09-11

    申请号:KR1020130021467

    申请日:2013-02-27

    CPC classification number: H01L21/0273 B41J2/17

    Abstract: The present invention relates to a method for forming a selective pattern of a fine structure using a non-contact printing method, comprising a step for applying solution containing a solvent and a transfer material, to a base material; and a step for leaving the transfer material on the base material as only the solvent from the solution applied on the base material is selectively absorbed into the mold, by contacting the base material with a patterned mold.

    Abstract translation: 本发明涉及一种使用非接触印刷法形成精细结构的选择性图案的方法,包括将含有溶剂和转印材料的溶液涂布到基材上的步骤; 以及通过使基材与图案化模具接触,仅将来自施加在基材上的溶液的溶剂选择性地吸收到模具中,将转印材料留在基材上。

    다공성 구조를 가지는 전사 물질의 패턴 형성 방법
    3.
    发明公开
    다공성 구조를 가지는 전사 물질의 패턴 형성 방법 无效
    传输多孔结构材料的方法

    公开(公告)号:KR1020140101497A

    公开(公告)日:2014-08-20

    申请号:KR1020130014498

    申请日:2013-02-08

    CPC classification number: H01L21/0274 B32B15/08 B32B18/00 B32B27/06

    Abstract: The present invention relates to a patterning method of a transferring material having a porous structure, comprising the steps of: adsorbing a transferring material to a mold; applying a solution to a substrate; expanding a mold by allowing the mold to adsorb the solution by bringing the solution applied to the substrate in contact with the transferring material adsorbed to the mold; and making the transferring material of the mold adsorbed to the substrate.

    Abstract translation: 本发明涉及具有多孔结构的转印材料的图案化方法,包括以下步骤:将转印材料吸附到模具中; 将溶液施加到基底上; 通过使得模具通过使施加到基板上的溶液与吸附在模具上的转印材料接触而使模具吸附溶液; 并使模具的转印材料吸附到基板上。

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