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公开(公告)号：KR1020100124627A
公开(公告)日：2010-11-29
申请号：KR1020090043736
申请日：2009-05-19
Applicant: 삼성전자주식회사
IPC: A47L9/18
CPC classification number: A47L9/182 , A47L9/1608 , A47L9/1625 , A47L9/1641 , A47L9/165 , A47L9/1666 , A47L9/1683 , A47L9/187 , A47L9/18 , A47L9/00
Abstract: PURPOSE: A wet type dust collecting apparatus for a vacuum cleaner is provided to enhance user convenience by filling water in a dust collecting region. CONSTITUTION: A wet type dust collecting apparatus(1) for a vacuum cleaner comprises a dust box, a sealing member(220), a dust box cover(200), a chamber, and a dust box water distribution path unit(320). The dust box connects at least two ducts collection regions to water inflow holes, and the sealing member is connected to at least one of the water inflow holes. The chamber is formed at each bottom plane of the dust collecting region to allow the connection with the water inflow holes.
Abstract translation: 目的：提供一种用于真空吸尘器的湿式粉尘收集装置，以通过将灰尘填充到集尘区域来增强使用者的便利性。 构成：用于真空吸尘器的湿式集尘装置（1）包括一个集尘盒，一个密封件（220），一个集尘盒盖（200），一个室和一个集尘盒水分配路径单元（320）。 集尘箱将至少两个管道收集区域连接到水流入孔，并且密封构件连接到至少一个水流入孔。 该室形成在集尘区域的每个底面，以允许与水流入孔的连接。
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公开(公告)号：KR1020090019560A
公开(公告)日：2009-02-25
申请号：KR1020070084091
申请日：2007-08-21
Applicant: 삼성전자주식회사
CPC classification number: A47L9/066
Abstract: A suction brush for a vacuum cleaner is provided to sense a floor with a floor sensor and to adjust distance between the floor and bottom of suction brush with an elevating plate driving part. A suction brush for a vacuum cleaner comprises an upper case(110), a lower case(120) including an inlet(121) inhaling a dirt from a floor to be cleaned and connecting with the upper case, an elevating plate(130) installed between the upper case and the lower case to ascend and descend to top and bottom toward the lower case, an elevating plate driving part operating the elevating plate to top and bottom and an elevating control system controlling the elevating plate driving part.
Abstract translation: 提供用于真空吸尘器的抽吸刷以感测具有地板传感器的地板，并且利用升降板驱动部分来调节抽吸刷的底部和底部之间的距离。 用于真空吸尘器的抽吸刷包括上壳体（110），下壳体（120），其包括从待清洁的地板吸入污物并与上壳体连接的入口（121），安装有升降板 在上壳体和下壳体之间，向下下降到顶部和底部，升降板驱动部分将升降板操作到顶部和底部，以及控制升降板驱动部分的升降控制系统。
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公开(公告)号：KR1020090017183A
公开(公告)日：2009-02-18
申请号：KR1020070081738
申请日：2007-08-14
Applicant: 삼성전자주식회사
CPC classification number: A47L9/248 , A47L9/0081 , A47L9/22 , A47L9/2815 , A47L9/2868 , A47L9/30
Abstract: A connection tube is provided to prevent noise generating when outer air inflows together in the air in a body by installing a muffler in inside the body. A connection tube for a vacuum cleaner having a dust sensing function comprises a suction nozzle(110) inhaling air including dust or dirt, a connection tube(120) including a dust sensor, an operating handle(130), a suction hose(140) connecting to the operating handle and a cleaner body(150), connecting to the suction hose, segmented into a dust chamber and a motor room. The dust sensor includes a light emitting area and light receiving area, and read existence and nonexistence of the dust or the dirt when the air passing through a second air suction passage.
Abstract translation: 连接管被设置成通过将消声器安装在身体内部来防止外部空气一起流入身体中的空气中时的噪声产生。 一种用于具有灰尘感测功能的真空吸尘器的连接管包括吸入包括灰尘或污垢的空气的吸嘴（110），包括灰尘传感器的连接管（120），操作手柄（130），抽吸软管（140） 连接到操作手柄和连接到抽吸软管的清洁器主体（150），分成灰尘室和机动车室。 灰尘传感器包括发光区域和光接收区域，并且当空气通过第二空气吸入通道时，读取灰尘或污物的存在和不存在。
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公开(公告)号：KR100475079B1
公开(公告)日：2005-03-10
申请号：KR1020020032972
申请日：2002-06-12
Applicant: 삼성전자주식회사
IPC: H01L23/36
CPC classification number: H01L23/3128 , H01L23/24 , H01L23/36 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , Y10T29/49156 , H01L2924/00014 , H01L2924/00015 , H01L2924/00 , H01L2924/00012
Abstract: 본 발명은 고전압용 BGA 패키지 및 그의 제조방법에 관한 것이다. 본 발명의 고전압용 BGA 패키지는, 중앙에 소정의 관통구를 가진 판 상의 인쇄회로기판과, 상기 인쇄회로기판과 동일한 형태의 관통구를 가지고 상부에 형성된 금속막과, 인쇄회로기판의 하부면에 형성된 연결패드와, 인쇄회로기판의 하부면에 관통구를 둘러싸고 연결패드와 인접하여 소정의 매트릭스 형태로 배열된 솔더볼과, 금속막의 상부에 형성되고 고열전도율의 전기적 절연체막을 포함하는 히트 스프레더와, 이 히트 스프레더의 하부면에 관통구를 통하여 하향하도록 부착되고 연결패드와 골드 와어링(wiring)된 복수의 접착패드를 가진 반도체 칩 및 관통구를 충진하면서 반도체 칩의 하부면에 형성된 패시브막을 포함한다.
이렇게 히트 스프레더로서 절연성의 세라믹 재료를 개재하여 사용함으로써, 반도체 칩과 히트 스프레더 사이에 필연적으로 발생하는 정전하를 현저히 감소시켜 ESD 검사시 및 셋업 상에 본 발명의 패키지를 실장할 때 발생하는 정전하 방전에 의한 ESD 불량을 감소시킬 수 있다.-
公开(公告)号：KR1020040072808A
公开(公告)日：2004-08-19
申请号：KR1020030008450
申请日：2003-02-11
Applicant: 삼성전자주식회사
IPC: H01L23/50
CPC classification number: H01L23/4093 , F28F2280/105 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A pincers-shaped device for radiating heat generated from a semiconductor module is provided to radiate effectively the heat by using a pincers-shaped structure stuck to a package of the semiconductor module. CONSTITUTION: A plurality of heat exchange members(100,200) face each other. A semiconductor module including packages is inserted between the heat exchange members. A connection part(300) is used for connecting the heat exchange members to each other by using a hinge joint method. An elastic member(400) is inserted between the heat exchange members in order to be stuck to surfaces of the packages of the semiconductor module when the semiconductor module is inserted between the heat exchange members.
Abstract translation: 目的：提供一种用于辐射由半导体模块产生的热量的钳形装置，通过使用卡在半导体模块的封装上的钳形结构来有效地辐射热量。 构成：多个热交换构件（100,200）彼此面对。 包括封装的半导体模块插入在热交换构件之间。 连接部件（300）用于通过铰链接合方法将热交换部件彼此连接。 当半导体模块插入在热交换构件之间时，弹性构件（400）插入在热交换构件之间以便粘附到半导体模块的封装的表面。
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Patent Agency Ranking
公开(公告)号：KR1020040063628A
公开(公告)日：2004-07-14
申请号：KR1020030001113
申请日：2003-01-08
Applicant: 삼성전자주식회사
IPC: G06F1/20
Abstract: PURPOSE: An electronic device equipped with a high efficiency cooling tool is provided to minimize a temperature difference of each area on one memory module by uniformly cooling the memory module regardless of an installation position of the memory module and reduce a size for installing the memory module by making the cooling tool through a semiconductor manufacturing process. CONSTITUTION: The first cooling tool(50) has a mold or case shape covering entire memory module and the same length as the memory module. The first cooling material is made of aluminum. When the first cooling tool is installed to the memory module, the memory chips installed to both sides of the memory module are covered by the first cooling tool. A height of a slot(52) that is the space inserted by the memory module is at least equal to a value summing the height of the memory chip and a gap between the memory chip and an upper end of the memory module. Two surfaces contacting to the memory chips installed to both sides of the memory module are connected to an upper side of the memory module.
Abstract translation: 目的：提供一种配备高效率冷却工具的电子设备，无论内存模块的安装位置如何，通过均匀冷却内存模块，从而最大限度地降低一个内存模块上每个区域的温差，并减小安装内存模块的尺寸 通过使冷却工具通过半导体制造工艺。 构成：第一个冷却工具（50）具有覆盖整个存储器模块的模具或壳体形状，并且与存储器模块的长度相同。 第一个冷却材料由铝制成。 当第一冷却工具安装到存储器模块时，安装在存储器模块两侧的存储芯片被第一个冷却工具覆盖。 由存储器模块插入的空间的高度（52）至少等于将存储器芯片的高度与存储器芯片与存储器模块的上端之间的间隙相加的值。 与安装到存储器模块两侧的存储器芯片接触的两个表面连接到存储器模块的上侧。
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公开(公告)号：KR100429885B1
公开(公告)日：2004-05-03
申请号：KR1020020025626
申请日：2002-05-09
Applicant: 삼성전자주식회사
IPC: H01L23/12
CPC classification number: H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/49171 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06575 , H01L2225/06579 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , Y10T29/49004 , Y10T29/49121 , H01L2924/00 , H01L2224/4554
Abstract: 멀티 칩 패키지 내부의 제1 및 제2 칩에서 발생하는 열을 외부로 효율적으로 방출할 수 있는 멀티 칩 패키지 및 그 제조방법에 관해 개시한다. 이를 위해 본 발명은 제1 칩과 제2 칩 사이에 메탈코아를 포함하는 테이프를 사용한다. 따라서, 제2 칩에서 발생되는 열은 메탈코아를 포함하는 테이프를 통해 멀티 칩 패키지 외부로 빠져나갈 수 있다.
Abstract translation: MCP的第一和第二芯片中产生的热量被有效地分散的多芯片封装（MCP）及其制造方法。 MCP包括第一和第二芯片。 MCP还包括位于第一芯片和第二芯片之间的包括导电材料层的带。 因此，第二芯片中产生的热量可以通过胶带有效地传播到外部。
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公开(公告)号：KR1020030087742A
公开(公告)日：2003-11-15
申请号：KR1020020025626
申请日：2002-05-09
Applicant: 삼성전자주식회사
IPC: H01L23/12
CPC classification number: H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/49171 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06575 , H01L2225/06579 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , Y10T29/49004 , Y10T29/49121 , H01L2924/00 , H01L2224/4554
Abstract: PURPOSE: A multi-chip package improving heat spread characteristics is provided to be capable of improving the thermal performance of the multi-chip package by using a tape including a metal core layer. CONSTITUTION: A multi-chip package(100) is provided with a substrate(102) and the first chip(106) attached to the substrate by using an adhesive. At this time, the substrate includes a bond finger part and a ground adhesion portion. At the time, the first chip includes the first bond pad. The multi-chip package further includes a tape(116) attached on the first chip and connected with the ground adhesion portion, the second chip(120) having the second bond pad, attached on the tape, a gold wire for connecting the first and second bond pad with the bond finger part, and an EMC(Epoxy Molding Compound) part(126) for selectively encapsulating the resultant structure. At this time, the tape includes a metal core layer.
Abstract translation: 目的：提供一种提高热扩散特性的多芯片封装，以能够通过使用包括金属芯层的带来提高多芯片封装的热性能。 构成：多芯片封装（100）具有基板（102）和第一芯片（106），其通过使用粘合剂附接到基板。 此时，基板包括接合指部和接地部。 当时，第一个芯片包括第一个焊盘。 所述多芯片封装还包括安装在所述第一芯片上并与所述接地部分连接的带（116），所述第二芯片（120）具有附接在所述带上的所述第二接合焊盘，用于连接所述第一和第 第二接合焊盘和粘结指部分，以及用于选择性地封装所得结构的EMC（环氧树脂模制化合物）部分（126）。 此时，带包括金属芯层。
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公开(公告)号：KR1020010003082A
公开(公告)日：2001-01-15
申请号：KR1019990023236
申请日：1999-06-21
Applicant: 삼성전자주식회사
Inventor： 김민하
IPC: H01L23/14
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
Abstract: PURPOSE: A chip package of an accumulation semiconductor and a method for manufacturing the chip package is provided to make a thin semiconductor chip package by piling up a different kind of chips. CONSTITUTION: A chip package of an accumulation semiconductor(10) is composed of the first semiconductor chip package(20) of TSOP(Thin Small Outline package) type and the second semiconductor chip package(40) of wafer level CSP(Chip Scale Package). In the first chip package(20), a semiconductor chip(21) is attached on a bottom of an inner lead(23). An electrode pad(22) of the attached semiconductor chip(21) is wire bound electrically with the inner lead(23) using a bonding wire(26). The semiconductor chip(21), the inner lead(23), and the bonding wire(26) are protected by a package body(27). An external lead(24) is used for linking an exterior substrate. A joint part(30) is exposed on the top of the inner lead(23) through a hole in the package body(27). A solder ball(43) on the bottom of the second semiconductor chip package(40) is interconnected electrically to the joint part(30). Through the solder ball(43) and the joint part(20), the first chip package(20) and the second chip package(40) are bonded.
Abstract translation: 目的：提供一种堆积半导体的芯片封装和用于制造芯片封装的方法，以通过堆积不同种类的芯片来制造薄的半导体芯片封装。 构成：堆积半导体（10）的芯片封装由TSOP（Thin Small Outline封装）型的第一半导体芯片封装（20）和晶片级CSP（Chip Scale Package）的第二半导体芯片封装（40）构成， 。 在第一芯片封装（20）中，半导体芯片（21）安装在内引线（23）的底部。 附着的半导体芯片（21）的电极焊盘（22）使用接合线（26）与内引线（23）电连接。 半导体芯片（21），内引线（23）和接合线（26）由封装体（27）保护。 外部引线（24）用于连接外部基板。 接合部（30）通过封装主体（27）中的孔露出在内引线（23）的顶部。 第二半导体芯片封装（40）的底部上的焊球（43）与接合部（30）电连接。 通过焊锡球（43）和接合部（20），第一芯片封装（20）和第二芯片封装（40）接合。
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公开(公告)号：KR101680604B1
公开(公告)日：2016-11-29
申请号：KR1020160100907
申请日：2016-08-08
Applicant: 삼성전자주식회사
Abstract: 핸들유닛을구비한진공청소기의집진장치가개시된다. 개시된집진장치는, 1차유입구를통해유입된공기에포함된먼지를분리하는 1차원심분리영역을형성하는 1차원심분리관; 상기 1차원심분리영역에서분리된먼지를수집하는 1차먼지통; 및상기 1차원심분리영역에서먼지가분리된외부유입공기를상기 1차원심분리관과상기 1차먼지통의외부로배출하는 1차배기관유닛;을구비한 1차분리부; 및, 상기 1차원심분리관이상기 1차먼지통과결합하는경우상기 1차원심분리관이상기 1차먼지통에결합된상태를유지하거나결합을해제하는핸들유닛;을포함하여구성되는것을특징으로한다.
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