公开(公告)号：KR1020050071795A

公开(公告)日：2005-07-08

申请号：KR1020040000113

申请日：2004-01-02

Applicant: 삼성전자주식회사

Inventor： 곽규섭 ,  이영민 ,  안준현

IPC: H01S5/183

CPC classification number: H01S5/0683 ,  G02B6/4206 ,  H01S5/02284 ,  H01S5/0264 ,  H01S5/183 ,  H01S5/423

Abstract: 본 발명에 따른 수직 공동 표면 발광 레이저(VCSEL) 모듈은, 그 하부에 에칭 영역을 갖는 기판과, 상기 기판 상면에 적층되며 광 생성을 위한 복수의 층들을 포함하며, 생성된 광을 그 상측 및 하측으로 방출하기 위한 VCSEL을 포함하며, 상기 VCSEL 모듈은 상기 VCSEL의 하측으로 방출된 광을 검출함으로써, 상기 VCSEL의 출력 상태를 모니터링한다.

公开(公告)号：KR1020040073158A

公开(公告)日：2004-08-19

申请号：KR1020030009145

申请日：2003-02-13

Applicant: 삼성전자주식회사

Inventor： 강병권 ,  조시연 ,  안준현 ,  이승원

IPC: G02B6/42

CPC classification number: H01S5/02248 ,  H01S5/02284 ,  H01S5/02453 ,  H01S5/06804

Abstract: PURPOSE: An uncooled optical communication module is provided to reduce the volume and the manufacturing cost by installing a semiconductor chip on an upper surface of a thermistor having a positive temperature coefficient. CONSTITUTION: An uncooled optical communication module includes a plate-shaped thermistor, a semiconductor chip, and a driver. The plate-shaped thermistor(320) includes a positive temperature coefficient. According to the positive temperature coefficient, a resistance is proportional to the peripheral temperature. The semiconductor chip(350) is installed on an upper surface of the thermistor. The driver is used for applying the predetermined voltage to the thermistor.

Abstract translation: 目的：提供一种非冷却的光通信模块，通过在具有正温度系数的热敏电阻的上表面上安装半导体芯片来减小体积和制造成本。 构成：非冷却光通信模块包括板状热敏电阻，半导体芯片和驱动器。 板状热敏电阻（320）包括正温度系数。 根据正温度系数，电阻与外围温度成正比。 半导体芯片（350）安装在热敏电阻的上表面上。 驱动器用于将预定电压施加到热敏电阻。

公开(公告)号：KR100442616B1

公开(公告)日：2004-08-02

申请号：KR1020020003005

申请日：2002-01-18

Applicant: 삼성전자주식회사

Inventor： 안준현

IPC: G02B5/20

CPC classification number: G02B6/4246 ,  G02B6/29361 ,  G02B6/29395

Abstract: A filter device for transmitting an optical signal using multiple wavelengths is disclosed. The filter device includes a fixation unit fixed to a substrate, a rotation unit having a filter rotatably installed on the fixation unit, and a control means for obtaining a predetermined wavelength by controlling the rotation angle of the filter through gear combinations corresponding positions of the fixation unit and the rotation unit. The alignment and fixation of the filter are controlled simultaneously through the gearing combinations between the gear teeth on the guide rib of the rotation unit and the teeth of the spur gear fixed to the bolt.

Abstract translation: 公开了一种使用多个波长传输光信号的滤波器装置。 该过滤器装置包括固定到基板上的固定单元，具有可旋转地安装在固定单元上的过滤器的旋转单元，以及控制装置，用于通过控制通过固定器的齿轮组合的相应位置的过滤器的旋转角度来获得预定波长 单元和旋转单元。 通过旋转单元的导向肋上的齿轮齿和固定在螺栓上的正齿轮的齿之间的齿轮组合同时控制过滤器的对准和固定。

公开(公告)号：KR1020170086974A

公开(公告)日：2017-07-27

申请号：KR1020160006672

申请日：2016-01-19

Applicant: 삼성전자주식회사

Inventor： 김도영 ,  박희진 ,  안준현 ,  정선태 ,  조재걸 ,  김진성

IPC: A61B5/00 ,  A61B5/08 ,  A61B5/01 ,  A61C19/04

CPC classification number: A61B5/00 ,  A61B5/0013 ,  A61B5/0022 ,  A61B5/0077 ,  A61B5/0088 ,  A61B5/01 ,  A61B5/08 ,  A61C19/04 ,  G06F19/00 ,  G16H40/67

Abstract: 본발명은사용자가자신의사용자단말기를이용하여치아의상태및 진단정보를손쉽게얻을수 있는사용자단말기및 그제어방법이제공된다. 본발명의사용자단말기는, 영상을표시할수 있는화면을가지며, 상기화면의적어도일부영역에서특정파장의광을출력할수 있는디스플레이부와; 사용자의신체에대한이미지를촬상할수 있는촬상부와; 상기화면의제1영역에서제1파장범위의제1광이출력되도록상기디스플레이부를제어하고, 이미지를촬상하도록상기촬상부를제어하며, 상기촬상된이미지를분석하고, 상기화면의제2영역에분석정보를표시하도록상기디스플레이부를제어하는제어부를포함하는것을특징으로한다.

Abstract translation: 本发明提供了一种用户终端及其控制方法，其中用户可以使用他或她自己的用户终端容易地获得牙齿的状态和诊断信息。 本发明的用户终端包括：显示单元，具有能够显示图像并且能够在屏幕的至少一部分中输出特定波长的光的屏幕; 图像拾取部分，用于拾取用户身体的图像; 控制显示单元在屏幕的第一区域中输出第一波长范围中的第一光，控制图像感测单元对图像成像，分析感测的图像，分析屏幕的第二区域 以及用于控制显示单元显示信息的控制器。

公开(公告)号：KR1020150106771A

公开(公告)日：2015-09-22

申请号：KR1020140029257

申请日：2014-03-12

Applicant: 삼성전자주식회사 ,  한국과학기술원

Inventor： 류제인 ,  조규형 ,  곽규섭 ,  권희동 ,  안준현 ,  육영섭

IPC: G05F1/62 ,  G05F1/67

CPC classification number: H02J7/35 ,  G05F1/67 ,  Y02E10/58

Abstract: 전력 공급원으로부터 발생하는 전력에 대한 모니터링에 전력 소모를 최소화하면서 전력 공급원으로부터 최대 전력을 추출할 수 있도록 승압 회로를 제어하는 방법 및 장치, 그리고 이를 이용하는 최대 전력 추출 장치를 개시한다.

Abstract translation: 公开了一种用于控制升压电路的方法和装置以及使用该升压电路的最大功率提取装置，其能够从电源提取最大功率并且最小化在电源中产生的功率的功率消耗。

公开(公告)号：KR1020130020241A

公开(公告)日：2013-02-27

申请号：KR1020110082748

申请日：2011-08-19

Applicant: 삼성전자주식회사

Inventor： 안준현 ,  곽규섭 ,  정지훈 ,  조신희

IPC: H01L31/042 ,  H01L31/0224

CPC classification number: H01L31/0516 ,  H01L31/048 ,  Y02E10/50

Abstract: PURPOSE: A solar cell module is provided to improve sunlight transmission efficiency by directly transmitting the sunlight to solar cells without an air cap. CONSTITUTION: A solar cell module(10) includes a window part, a plurality of solar cells(20), and an electrode part(30). The window part integrates a transparent substrate part. The electrode part is electrically connected to solar cells. The solar cells and the electrode part are formed on the transparent substrate part.

Abstract translation: 目的：提供太阳能电池模块，通过将阳光直接传输到太阳能电池而无空气帽来提高阳光透射效率。 构成：太阳能电池模块（10）包括窗部分，多个太阳能电池（20）和电极部分（30）。 窗户部分集成透明基板部分。 电极部分电连接到太阳能电池。 太阳能电池和电极部分形成在透明基板部分上。

公开(公告)号：KR1020090060578A

公开(公告)日：2009-06-15

申请号：KR1020070127450

申请日：2007-12-10

Applicant: 삼성전자주식회사

Inventor： 안준현 ,  이영민 ,  조시연 ,  곽규섭

IPC: H01L23/48 ,  H01L23/12 ,  H01L21/60

CPC classification number: H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package and a manufacturing method thereof are provided to effectively prevent an electrical contact error between two packages by reducing an occupation region of an electrical connection part between two packages. A plurality of dies is bonded on a substrate in which a bond finger is formed(S110). The bond finger and a bond pad of each die are wire-bonded(S120). A whole substrate is molded by a sealing material(S130). The bond finger is separated into each package by sawing the sealing material and the substrate(S140). A surface of the sealing material is activated(S150). A semiconductor package of a monolayer structure is formed by forming an input/output pad on the surface of the sealing material through a plating process(S160).

Abstract translation: 提供半导体封装及其制造方法，以通过减少两个封装之间的电连接部分的占用区域来有效地防止两个封装之间的电接触误差。 多个管芯结合在形成有接合指的基板上（S110）。 每个模具的粘结指状物和粘结垫被引线键合（S120）。 整个基板由密封材料模制（S130）。 通过锯切密封材料和基底将粘结指状分离成每个包装（S140）。 密封材料的表面被激活（S150）。 通过电镀处理在密封材料的表面上形成输入/输出焊盘，形成单层结构的半导体封装（S160）。

公开(公告)号：KR1020080100009A

公开(公告)日：2008-11-14

申请号：KR1020070046028

申请日：2007-05-11

Applicant: 삼성전자주식회사

Inventor： 박경완 ,  안준현 ,  이재혁 ,  곽규섭

IPC: H04M1/23 ,  H01H13/70 ,  G06F3/02

CPC classification number: H04M1/23 ,  G06F3/0202 ,  H01H13/70

Abstract: A keypad assembly is provided to reduce the manufacturing cost and processing time by integrating a contact sheet with a keypad. A keypad assembly(200) comprises the followings: a key sheet(220) including keys; a keypad(210) including a contact sheet including the first contact member; and a circuit board(270) including the second contact member which is arranged so as to be corresponded to the first contact member to form a switch(255). The switch is closed by the contact between the first and second contact members(260,280) by deformation of the keypad. The first contact member comprises the first and second dome(262,264) which are consecutively connected with each other. The second contact member comprises the first and second electrodes(282,284) corresponding to the first and second domes.

Abstract translation: 提供键盘组件以通过将接触片与键盘集成来降低制造成本和处理时间。 键盘组件（200）包括以下内容：包括键的按键板（220） 包括包括所述第一接触构件的接触片的键盘（210） 以及包括所述第二接触构件的电路板（270），所述第二接触构件被布置成对应于所述第一接触构件以形成开关（255）。 通过键盘的变形，开关被第一和第二接触构件（260,280）之间的接触闭合。 第一接触构件包括彼此连续连接的第一和第二穹顶（262,264）。 第二接触构件包括对应于第一和第二穹顶的第一和第二电极（282,284）。

公开(公告)号：KR1020080087350A

公开(公告)日：2008-10-01

申请号：KR1020070029440

申请日：2007-03-26

Applicant: 삼성전자주식회사 ,  한국과학기술원

Inventor： 김기현 ,  유진 ,  이영민 ,  안준현 ,  서호성 ,  최연호 ,  정용 ,  이택영 ,  지영근

IPC: H01L23/28

CPC classification number: H01L23/3735 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An integrated circuit chip and a manufacturing method thereof are provided to minimize generation of cracks and to protect interconnection lines by preventing reduction of adhesive strength and reducing stress. An integrated circuit package includes an interface layer(210). The interface layer is inserted between an integrated circuit chip and an adhesive(203). The interface layer has a thermal expansion coefficient similar to the thermal expansion coefficient of the integrated circuit chip. The adhesive is an adhesive epoxy. The integrated circuit chip is composed of a silicon chip(204). A target is a printed circuit board. The thermal expansion coefficient of the interface layer is 3 to 55 ppm/°C.

Abstract translation: 提供一种集成电路芯片及其制造方法，以通过防止粘合强度的降低和应力降低来最小化裂纹产生和保护互连线。 集成电路封装包括界面层（210）。 界面层插入集成电路芯片和粘合剂（203）之间。 界面层的热膨胀系数与集成电路芯片的热膨胀系数相似。 粘合剂是粘合剂环氧树脂。 集成电路芯片由硅芯片（204）组成。 目标是印刷电路板。 界面层的热膨胀系数为3〜55ppm /℃。

公开(公告)号：KR100666990B1

公开(公告)日：2007-01-10

申请号：KR1020050074869

申请日：2005-08-16

Applicant: 삼성전자주식회사

Inventor： 김홍권 ,  강석명 ,  안준현 ,  김기현 ,  서호성

IPC: H01L23/02

CPC classification number: H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L23/13 ,  H01L23/4828 ,  H01L24/26

Abstract: A BGA(Ball Grid Array) package and its manufacturing method are provided to reduce stress of a semiconductor substrate and an SMD(Surface Mount Device) element by reducing the number of reflow processes for attaching the SMD element and a solder ball. A semiconductor chip(120) is mounted on a side of a substrate(110). Plural solder ball pads(140) are formed on the other side of the substrate. An SMD part(160) is placed on the substrate where a solder paste(165) is applied. A solder ball(150) is placed on a placing zig(200) and contacted to the solder ball pads. The solder paste and the solder ball are melted through a reflow process. The placing zig includes a base(210), a placing hole, and a adhesive tape(220). A surface of the base is faced to the substrate. The placing hole where the solder ball is placed is formed on the base. The adhesive tape is arranged on a lower surface of the placing hole to adhere the solder ball.

Abstract translation: 提供了一种BGA（球栅阵列）封装及其制造方法，通过减少用于安装SMD元件和焊球的回流工艺的数量来减少半导体衬底和SMD（表面贴装器件）元件的应力。 半导体芯片（120）安装在基板（110）的一侧。 多个焊球垫（140）形成在衬底的另一侧上。 将SMD部件（160）放置在施加焊膏（165）的基板上。 将焊球（150）放置在放置锯（200）上并与焊球焊盘接触。 焊膏和焊球通过回流工艺熔化。 放置锯具包括基座（210），放置孔和胶带（220）。 基座的表面面向基板。 在底座上形成放置焊锡球的放置孔。 粘合带布置在放置孔的下表面上以粘附焊球。