公开(公告)号：KR1020100135530A

公开(公告)日：2010-12-27

申请号：KR1020090053966

申请日：2009-06-17

Applicant: 전자부품연구원

Inventor： 이규복 ,  이재영 ,  최세환

IPC: H01R13/646

Abstract: PURPOSE: An RF(Radio Frequency) connector is provided to form inside line to a pd structure, thereby minimizing the damage of the inside line even in a work of a plurality of repetitive connecting and dividing. CONSTITUTION: A first and a second housing(111,121) has a female and male shape, and is combined to each other. A first insulating body(112) is installed to the first housing, and has a first pad in the center part. A first grounded conductor(114) is installed to the first housing, and surrounds the outer circumference of the first insulating body. The second insulating body(122) is installed to the second housing, and has a second pad facing the first pad in the center part. A second grounded conductor(124) is installed to the second housing, and surrounds the outer circumference of the second insulating body. The first and the second pad are comprised of gold.

Abstract translation: 目的：提供RF（射频）连接器以形成pd结构的内线，从而即使在多次重复连接和分割的工作中也最小化内线的损坏。 构成：第一和第二壳体（111,121）具有阴和阳形状，并且彼此组合。 第一绝缘体（112）安装到第一壳体上，并且在中心部分具有第一垫。 第一接地导体（114）安装到第一壳体，并且围绕第一绝缘体的外周。 第二绝缘体（122）安装到第二壳体上，并且在中心部分具有面向第一焊盘的第二焊盘。 第二接地导体（124）安装到第二壳体，并且围绕第二绝缘体的外周。 第一和第二垫由金组成。

公开(公告)号：KR1020100126991A

公开(公告)日：2010-12-03

申请号：KR1020090045457

申请日：2009-05-25

Applicant: 전자부품연구원

Inventor： 박세훈 ,  박성대 ,  이규복

IPC: H05K1/18

Abstract: PURPOSE: A flexible PCB embedding active elements and passive elements and a manufacturing method thereof are provided to perform a flexible packaging process in even state by using a metal support layer. CONSTITUTION: A first circuit pattern(115) is formed on a support layer. The support layer is arranged of one of aluminum, gold, and silver. An active circuit element(120) and/or a passive device, and a semiconductor chip(130) are mounted in the first circuit pattern. The flexible layer is formed on the support layer in order to surround the first circuit pattern, the active circuit element and/or the passive device, and semiconductor chip. A second circuit pattern(150) is formed on the flexible layer. A heat plate(111) is formed by selectively eliminating a part of the support layer.

Abstract translation: 目的：提供一种嵌入有源元件和无源元件的柔性PCB及其制造方法，以通过使用金属支撑层来均匀地执行柔性封装处理。 构成：第一电路图案（115）形成在支撑层上。 支撑层布置为铝，金和银之一。 在第一电路图案中安装有源电路元件（120）和/或无源器件以及半导体芯片（130）。 为了包围第一电路图案，有源电路元件和/或无源器件以及半导体芯片，在支撑层上形成柔性层。 第二电路图案（150）形成在柔性层上。 通过选择性地去除支撑层的一部分来形成加热板（111）。

公开(公告)号：KR100979111B1

公开(公告)日：2010-08-31

申请号：KR1020080058427

申请日：2008-06-20

Applicant: 전자부품연구원

Inventor： 박성대 ,  박세훈 ,  이규복

IPC: H01C7/00 ,  B82Y30/00 ,  B82Y25/00

Abstract: 본 발명은 액상의 변성 에폭시 수지를 사용함으로써 경화 후에도 유연한 특성을 가지게 되며, 카본 종류와 나노 은을 병행 사용하여 페이스트를 제조함으로써 후막 특성을 유지함과 동시에 면저항을 효과적으로 낮출 수 있는, 플렉서블 기판에 형성 또는 내장할 수 있는 저저항 열경화형 후막 저항체용 페이스트를 제공한다.
후막 저항체 페이스트, 저저항

公开(公告)号：KR1020100076486A

公开(公告)日：2010-07-06

申请号：KR1020080134553

申请日：2008-12-26

Applicant: 전자부품연구원

Inventor： 이규복 ,  이재영 ,  김진섭 ,  최세환

IPC: G06F3/041 ,  G02F1/1333 ,  G06F1/16

CPC classification number: G06F3/045 ,  G06F1/1626 ,  G06F1/1643 ,  G06F1/1652 ,  G06F3/0202 ,  G06F3/041 ,  G02F1/1333 ,  G02F1/133305 ,  G06F1/163 ,  G06F2203/0337

Abstract: PURPOSE: An input apparatus for a flexible display device inputting desired data by the electrode printed on a substrate is provided to variously apply the flexible input device to a multimedia device with the flexible display by forming the electrode on the substrate. CONSTITUTION: An input device for a flexible display device for a flexible display device includes a flexible and transparent substrate(110) and a soft electrode(120). The electrode is printed on the substrate. The input device for the flexible display device is bent by the electrode. The input device for the flexible display device has a curve formation. The data is inputted to the input device for a flexible display device through an input tool.

Abstract translation: 目的：提供一种用于通过印刷在基板上的电极输入期望数据的柔性显示装置的输入装置，通过在基板上形成电极，将柔性输入装置多样地应用于具有柔性显示器的多媒体装置。 构成：用于柔性显示装置的柔性显示装置的输入装置包括柔性和透明基板（110）和软电极（120）。 电极印在基片上。 用于柔性显示装置的输入装置由电极弯曲。 用于柔性显示装置的输入装置具有曲线形成。 通过输入工具将数据输入到用于柔性显示装置的输入装置。

公开(公告)号：KR1020100075007A

公开(公告)日：2010-07-02

申请号：KR1020080133593

申请日：2008-12-24

Applicant: 전자부품연구원

Inventor： 김진섭 ,  이규복

IPC: H03B5/18 ,  H03H3/00

CPC classification number: H01P7/082 ,  H01P1/203 ,  H03H7/09

Abstract: PURPOSE: A singular resonator and a broadband filter thereof are provided to design a broadband filter within short time by designing a broadband filter after designing a singular resonator. CONSTITUTION: A pair of basic resonators(110,120) are symmetrically arranged each other. A parallel inductance(130) magnetically combines the basic resonators. A first pattern width which outputs and inputs a signal of the basic resonator is greater than a second pattern width which is formed to the parallel inductance. Each basic resonator is connected to a cross coupling mode. One side of the parallel inductance is connected to each basic resonator with the cross coupling mode. The other side of the parallel inductance is grounded.

Abstract translation: 目的：设计一个单一的谐振器及其宽带滤波器，通过在设计单个谐振器之后设计宽带滤波器，在短时间内设计宽带滤波器。 构成：一对基本谐振器（110,120）彼此对称布置。 并联电感（130）磁性组合基本谐振器。 输出和输入基本谐振器的信号的第一图案宽度大于形成于并联电感的第二图案宽度。 每个基本谐振器都连接到交叉耦合模式。 并联电感的一侧通过交叉耦合模式连接到每个基本谐振器。 并联电感的另一端接地。

公开(公告)号：KR1020090132251A

公开(公告)日：2009-12-30

申请号：KR1020080058427

申请日：2008-06-20

Applicant: 전자부품연구원

Inventor： 박성대 ,  박세훈 ,  이규복

IPC: H01C7/00 ,  B82Y30/00 ,  B82Y25/00

Abstract: PURPOSE: Paste for low resistance thermosetting type thick film resistor is provided to keep thick film property by making the paste with a kind of carbon and nano-silver, which are used as conductive filter, at the same time. CONSTITUTION: A thermosetting resin is a liquid state in room temperature. Hardener cures the thermosetting resin. The thermosetting resin is a urethane-modified epoxy resin. Carbon black, graphite, or nano-silver is used as conductive filler.

Abstract translation: 目的：提供低电阻热固型厚膜电阻器的粘贴，以同时使用用作导电过滤器的碳和纳米银制成糊状物来保持厚膜性能。 构成：热固性树脂在室温下为液态。 固化剂固化了热固性树脂。 热固性树脂是氨基甲酸酯改性的环氧树脂。 炭黑，石墨或纳米银用作导电填料。

公开(公告)号：KR1020090087654A

公开(公告)日：2009-08-18

申请号：KR1020080013035

申请日：2008-02-13

Applicant: 전자부품연구원

Inventor： 최세환 ,  이규복 ,  이재영

IPC: H01L23/12

CPC classification number: H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L25/073 ,  H01L23/15 ,  H01L23/481 ,  H01L24/26 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A multi chip package and fabricating method thereof are provided to reduce the volume of the total module by forming a semiconductor chip vertically in circuit patterns. One side of the second semiconductor chip(120) and the first semiconductor chip(110) is bonded to the circuit pattern(105) on the first substrate(100). The other side face of the second semiconductor chip and the first semiconductor chip is bonded each other to the circuit pattern(155) of the second substrate(150). The both sides of first semiconductor chip and the second semiconductor chip have bonding pads(115, 125). The pad(170) is formed on the top of the second substrate and is electrically connected to outside through the pad. The Pad is connected to the circuit pattern formed in the lower surface of the second substrate through the via hole(160).

Abstract translation: 提供一种多芯片封装及其制造方法，以通过以电路图案垂直形成半导体芯片来减小总模块的体积。 第二半导体芯片（120）和第一半导体芯片（110）的一侧与第一基板（100）上的电路图案（105）接合。 第二半导体芯片和第一半导体芯片的另一侧面彼此接合到第二基板（150）的电路图案（155）。 第一半导体芯片和第二半导体芯片的两侧具有接合焊盘（115,125）。 焊盘（170）形成在第二基板的顶部上，并通过焊盘与外部电连接。 垫通过通孔（160）连接到形成在第二基板的下表面中的电路图案。

公开(公告)号：KR100763245B1

公开(公告)日：2007-10-04

申请号：KR1020060134749

申请日：2006-12-27

Applicant: 전자부품연구원

Inventor： 이재영 ,  이규복

IPC: H04B1/44

CPC classification number: H04B1/44 ,  H03H7/12 ,  H04B1/0057 ,  H04B1/006

Abstract: An antenna switching circuit is provided to solve a problem that in case an LPF(Low Pass Filter) and an HFP(High Pass Filter) are configured with elements such as a pin diode, a capacitor, an inductor and a resistor, etc., much harmonics are generated when a transmission signal is transmitted, so the transmission signal cannot be clearly transmitted. The first LPF(100) are connected with an antenna(ANT) and extracts the first and second signals as received. The first reception signal output unit(140) outputs the first and second signals, which have been extracted by the firs LPF(100), to the outside. The second LPF(130) filters the first and second signals to be transmitted, and outputs them to the antenna through the first LPF(100). The first switching unit(120) switches the operation of the second LPF(130) according to the first control voltage. An HPF(110) is connected with the antenna(ANT) and extracts the third to fifth signals. The second reception signal output unit(170) outputs the third signal, which has been extracted by the HPF(110), to the external. The third LPF(160) filters the third to the fifth signals to be transmitted, and outputs them to the antenna(ANT) through the HPF(110). The second switching unit(150) switches the operation of the third LPF(160) according to the second control voltage. The third reception signal output unit(190) outputs the fourth and fifth signal, which have been extracted by the HPF(110), to the exterior. The third switching unit(180) switches the operation of the third reception signal output unit(190) according to the third control voltage.

Abstract translation: 提供一种天线切换电路来解决在LPF（低通滤波器）和HFP（高通滤波器）配置有诸如pin二极管，电容器，电感器和电阻器等元件的情况下的问题， 当传输信号被发送时产生很多的谐波，所以发送信号不能被清楚地发送。 第一LPF（100）与天线（ANT）连接，并且按照接收的方式提取第一和第二信号。 第一接收信号输出单元（140）将由第一LPF（100）提取的第一和第二信号输出到外部。 第二LPF（130）对要发送的第一和第二信号进行滤波，并通过第一LPF（100）将其输出到天线。 第一切换单元（120）根据第一控制电压切换第二LPF（130）的操作。 HPF（110）与天线（ANT）连接，提取第三至第五信号。 第二接收信号输出单元（170）将由HPF（110）提取的第三信号输出到外部。 第三LPF（160）对要传输的第三至第五信号进行滤波，并通过HPF（110）将其输出到天线（ANT）。 第二开关单元（150）根据第二控制电压来切换第三LPF（160）的动作。 第三接收信号输出单元（190）将由HPF（110）提取的第四和第五信号输出到外部。 第三切换单元（180）根据第三控制电压切换第三接收信号输出单元（190）的操作。

公开(公告)号：KR100716794B1

公开(公告)日：2007-05-14

申请号：KR1020050131536

申请日：2005-12-28

Applicant: 전자부품연구원

Inventor： 이재영 ,  이규복

IPC: G01S3/78

Abstract: 본 발명은 초고주파의 신호가 움직이는 물체에서 반사될 경우에 주파수가 변화되는 도플러(doppler) 효과를 이용하여 소정 물체의 움직임을 검출한다.
본 발명에 따르면, 발진기를 이용하여 소정 주파수의 초고주파 신호를 발생하고, 발생한 초고주파 신호를 안테나를 통해 움직임 물체의 검출영역으로 송출하여 반사되는 초고주파 신호를 검출하며, 검출한 초고주파 신호와 발진기가 발생한 초고주파 신호를 혼합하여 움직이는 물체의 검출신호를 생성한다. 생성한 움직이는 물체의 검출신호를 증폭기로 증폭하고, 마이크로 컴퓨터로 입력시켜 움직이는 물체의 유무를 판단하는 것으로서 주변 환경의 변화에 관계없이 움직이는 물체의 유무를 정확하게 검출한다.
도플러, 움직임 검출센서, 혼합, 도파관, 초고주파, K밴드

Abstract translation: 本发明通过使用多普勒效应来检测预定物体的运动，其中当运动物体反射超高频信号时频率发生变化。

公开(公告)号：KR100679915B1

公开(公告)日：2007-02-07

申请号：KR1020050131547

申请日：2005-12-28

Applicant: 전자부품연구원

Inventor： 이재영 ,  이규복

IPC: H01Q13/08

Abstract: A patch antenna is provided to transmit and receive an ultrahigh frequency signal by being attached to a wave guide without forming a separate feeding pad. In a patch antenna, an antenna pattern(310) is formed on a front surface of a dielectric substrate(300). A ground pattern(320) is formed on a rear surface of the dielectric substrate(300). An etching unit(330) enables the front and rear surfaces of the dielectric substrate(300) to transmit an ultrahigh frequency signal by etching the ground pattern(320). The ground pattern(320) is made of a metal material. The etching unit(320) etches a middle part of the dielectric substrate(300) by the metal material to be exposed. A size of the etching unit(330) is varied according to a frequency of the ultrahigh frequency signal to transmit and receive.

Abstract translation: 提供贴片天线以通过附接到波导而不形成单独的馈送垫来发送和接收超高频信号。 在贴片天线中，天线图案（310）形成在电介质基板（300）的前表面上。 接地图案（320）形成在电介质基板（300）的后表面上。 蚀刻单元（330）通过蚀刻接地图案（320）使得电介质基板（300）的前表面和后表面能够传输超高频信号。 接地图案（320）由金属材料制成。 蚀刻单元（320）通过金属材料蚀刻电介质基板（300）的中间部分以暴露。 蚀刻单元（330）的尺寸根据要发送和接收的超高频信号的频率而变化。