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公开(公告)号：KR1020160134432A
公开(公告)日：2016-11-23
申请号：KR1020150136744
申请日：2015-09-25
Applicant: 한국과학기술원
CPC classification number: Y02E30/40
Abstract: 본발명은모듈화된부유식해양원전시스템에관한것으로서, 더욱상세하게는, 유사한기능을하는설비를한 곳에통합하여일원화하는모듈화및 모듈화된설비들을기능상의상호연계를고려하여조립하는배치를통하여구축하는모듈화된부유식해양원전시스템에관한것이다. 본발명에의하면, 유사한기능을하는설비를한 곳에통합하여모듈화함에의해, 이와같이모듈화된설비들을조립함에의해부유식해양원전의구축을용이하게할 뿐만아니라, 모듈화된설비들을기능상필요에따라다양한방식으로조립할수 있도록한다.
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公开(公告)号：KR1020130110832A
公开(公告)日：2013-10-10
申请号：KR1020120033105
申请日：2012-03-30
Applicant: 한국과학기술원
CPC classification number: G01N3/08 , A61B5/053 , A61B5/0531 , G01B7/18 , G01B7/22 , G01L1/00 , G01L1/142 , G01L1/2287
Abstract: PURPOSE: A surface shape measuring device is provided to have a simple structure covering a single-layered electrode unit with a substrate and a coating layer, thereby being manufactured by a single mask process in which an additional alignment process is not needed. CONSTITUTION: A surface shape measuring device includes a substrate (10), an electrode unit (20), a coating layer, and a detecting unit (40). The electrode unit includes at least one electrode pattern extended on the substrate. The coating layer is formed on the substrate and covers the electrode pattern. The detecting unit measures a physical amount of the electrode pattern changed according to the deformation caused by an external load applied to the substrate or the coating layer.
Abstract translation: 目的：提供一种表面形状测量装置，其具有覆盖单层电极单元与基板和涂层的简单结构，从而通过不需要附加对准处理的单个掩模工艺制造。 构成：表面形状测量装置包括基板（10），电极单元（20），涂层和检测单元（40）。 电极单元包括在基板上延伸的至少一个电极图案。 涂层形成在基板上并覆盖电极图案。 检测单元测量根据施加到基板或涂层的外部负载引起的变形而改变的电极图案的物理量。
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Patent Agency Ranking
公开(公告)号：KR1020090070435A
公开(公告)日：2009-07-01
申请号：KR1020070138448
申请日：2007-12-27
Applicant: 한국과학기술원
CPC classification number: H05K9/0064 , H01L23/60 , H05K9/0067 , H05K9/0071
Abstract: A mixed mode system-in-package is provided to prevent damage to an ultra high frequency signal by using a ground grid via or a power grid via. A mixed mode system-in-package(100) includes a ground flat layer(120), a signal flat layer(110), a dielectric layer(130), and a ground grid via(170). The signal flat layer is positioned on a layer different from the ground flat layer. The signal flat layer includes an ultra high frequency signal line(140) and a digital signal line(150). The dielectric layer is positioned between the ground flat layer and the signal flat layer. The ground grid via is connected to the ground flat layer and the signal flat layer through the dielectric layer. The ground grid via is positioned between the ultra high frequency signal line and the digital signal line. The ground grid via is more nearly positioned in the ultra high frequency signal line than the digital signal line.
Abstract translation: 提供混合模式系统级封装，以通过使用接地网格或电网通孔来防止对超高频信号的损坏。 混合模式系统级封装（100）包括接地平坦层（120），信号平坦层（110），介电层（130）和接地栅格通孔（170）。 信号平坦层位于与地面平坦层不同的层上。 信号平坦层包括超高频信号线（140）和数字信号线（150）。 电介质层位于接地平面层和信号平面层之间。 接地网格通过介电层连接到地平面层和信号平面层。 接地网格通孔位于超高频信号线和数字信号线之间。 地电网通道比数字信号线更接近于超高频信号线。
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公开(公告)号：KR100783732B1
公开(公告)日：2007-12-07
申请号：KR1020060058169
申请日：2006-06-27
Applicant: 한국과학기술원
IPC: G06F17/50
CPC classification number: G01R31/2848 , G01R31/2853
Abstract: A method for numerically analyzing a hierarchical system is provided to perform a numeric analysis at high speed while maintaining the accuracy and require additional resources by performing the numeric analysis of each structure with present analysis programs. A first and second structure respectively modeling a first and second layer, and an inter-structure modeling electric interaction between the first and second layer are found(S52). The first and second structure, and the inter-structure are independently and numerically analyzed(S53). Numeric analysis results are integrally operated by considering an electric interface condition between the first structure and the inter-structure, and between the second structure and the inter-structure(S55). The first and second layer is a chip and a package, and the package and a board.
Abstract translation: 提供了一种用于数字分析分层系统的方法，以高速执行数值分析，同时通过使用现有的分析程序执行每个结构的数值分析，同时保持精度并且需要额外的资源。 分别建立分别建模第一层和第二层的第一和第二结构，以及第一层和第二层之间的结构间建模电相互作用（S52）。 分别对第一和第二结构以及结构进行独立和数值分析（S53）。 通过考虑第一结构和结构之间的电接口条件以及第二结构和结构之间的电接口条件（S55），数字分析结果被一体地操作。 第一层和第二层是芯片和封装，以及封装和板。
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公开(公告)号：KR102173246B1
公开(公告)日：2020-11-03
申请号：KR20180149465
申请日：2018-11-28
Applicant: 한국과학기술원
Abstract: 전기자동차의주행파라미터결정방법이개시된다. 일실시예에따른방법은전기자동차의위치정보를획득하는단계; 위치정보에기초하여결정되는경로정보를획득하는단계; 경로정보에따른고도정보를획득하는단계; 및전기자동차의에너지모델및 상기고도정보에기초하여, 평지에해당하는도로를위한주행속도및 경사가있는도로를위한등가속도를포함하는주행파라미터를결정하는단계를포함한다.
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公开(公告)号：KR1020170017585A
公开(公告)日：2017-02-15
申请号：KR1020150111742
申请日：2015-08-07
Applicant: 한국과학기술원 , 서울대학교산학협력단
IPC: H01L31/042 , H02S40/38 , H02S50/10 , H02J3/38
CPC classification number: Y02E10/50
Abstract: 태양광어레이의재구성에따른오버헤드에기초하여상기태양광어레이의재구성기간을결정하고, 재구성기간에따라재구성알고리즘을수행하는, 태양광어레이재구성방법및 차량용태양광시스템을제공할수 있다.
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