Abstract:
적층 집적회로소자의 토로이드를 개시한다. 토로이드는 2층 내지 4층의 칩들을 관통하고, 관통비아의 둘레에 근접해서 배열된 n개의 근접관통비아(NTSV)들과, 2층 내지 4층의 칩들을 관통하고, 관통비아의 둘레에 원접해서 배열된 n개의 원접관통비아(FTSV)들을 포함한다. 또한 4층의 칩 표면상에 형성되고, n개의 근접 및 원접관통비아들 중 서로 대응하는 n개의 근접 및 원접관통비아 쌍(NFPA)들 각각을 상호 전기적으로 연결하기 위한 n개의 제1표면 배선패턴들과, 2층의 칩 표면상에 형성되고, n개의 근접 및 원접관통비아 쌍(NFPA)들 중 서로 인접하는 쌍들(NFPA i-1)(NFPA i)(NFPA i+1) 중 어느 한 쌍(NFPA i)의 근접관통비아와 다른 한 쌍(NFPA i-1)의 원접관통비아를 상호 전기적으로 연결하고, 어느 한 쌍(NFPA i)의 원접관통비아와 또 다른 한 쌍(NFPA i+1)의 근접관통비아를 상호 전기적으로 연결하기 위한 n-1 개의 제2표면 배선패턴들을 포함한다. 따라서 본 발명의 토로이드는 관통비아 둘레에 작은 크기로 간단하게 구현할 수 있으므로 적층 집적회로소자에서 관통비아를 통해 흐르는 전류측정을 정확하게 할 수 있다.
Abstract:
비접촉방식의 전기자동차용 급전장치와 집전장치가 제공된다. 급전 장치는 도로의 진행방향을 따라 일정한 간격을 두고 도로의 진행방향과 수직을 이루는 방향으로 배치된 복수 개의 자극을 구비하고, 도로 진행방향에 수직인 폭을 매우 작게 한 급전코어와 도로의 진행방향을 따라 서로 이웃하는 상기 급전코어의 자극이 다른 극성을 갖도록 배치되는 급전선을 포함한다. 집전 장치는 급전 장치로부터 자기유도방식으로 전력을 공급받을 수 있다. 본 발명에 의하면, 도로면과 집전장치 사이의 공극간격을 크게 하고 자동차 운행방향의 좌우 치우침인 조향편차의 허용폭을 충분히 허용하면서도, 급전선로의 폭과 집전모듈의 폭을 줄이고 전자기장(EMF, electromagnetic field)의 발생량을 대폭 경감시키며, 특히 급전선로의 폭을 현격히 줄임으로써 도로 설치 비용을 크게 절감할 수 있다. 전기자동차, 비접촉 전력전달, I형, 격자형, 모노레일, 듀얼레일, 급전장치, 집전장치
Abstract:
본 발명의 네트워크 부호화 장치 및 방법은, 오류 정정 부호가 적용된 통신 환경에 있어서, 데이터 송신 용량을 증대시킬 수 있는 네트워크 부호화 장치 및 방법을 제공한다. 상술한 목적을 달성하기 위하여 본 발명의 네트워크 부호화 장치는, 적어도 두 개 이상의 수신 신호를 복호화하는 수신 신호 처리부; 및 상기 수신 신호 처리부로부터 적어도 두 개 이상의 복호화된 수신 신호를 입력받고, 상기 적어도 두 개 이상의 복호화된 수신 신호를 병합 처리하여 하나의 병합 송신 신호를 생성하는 송신 신호 처리부를 포함한다. 네트워크 부호화, 중계기, 터보 부호
Abstract:
PURPOSE: An embedded toroidal coil, a manufacturing method thereof and a multilayer printed circuit board are provided to implement accurate measurement by forming a coil simultaneously with the forming of an existing metal wiring. CONSTITUTION: An interlayer insulating layer covers a lower coil layer and a metal wiring under test. An interlayer through-hole is formed at the interlayer insulating layer. Interlayer metal vias (230,232) are formed at the interlayer through-hole. An upper coil layer is connected to the contact pad of the lower coil layer. A test terminal (240) is electrically connected to the contact pad of the other side of the upper coil layer.
Abstract:
PURPOSE: A semiconductor chip, a third-dimensional laminated chip and a third-dimensional laminated chip package are provided to increase structural stability and electrical performance of coaxial through silicon via by forming a graphene film between a first via part and an insulation part and between an insulation part and a second via part. CONSTITUTION: An active layer (130) is formed in one side of a substrate (110). Multiple passive devices (140) are laminated on the other side of substrate. Multiple coaxial through silicone vias (120) are formed through the substrate. The multiple coaxial through silicone vias are electrically connected the passive device and the active layer. The coaxial through silicone via comprises a first via part (121), a second via part (122), and an insulation part (123).
Abstract:
PURPOSE: An interposer with a passive equalizer, a manufacturing method thereof, a stacked chip package including the interposer, and a manufacturing method thereof are provided to improve signal transmission characteristics without increasing manufacturing costs and/or a size by increasing a resistance value and inductance and reducing capacitance. CONSTITUTION: An insulating layer (120) is formed on the upper surface of a semiconductor substrate. Multiple metal wires (150a-150f) are separately formed on a first area of the insulating layer and include a signal transmission line and multiple ground lines. A passive equalizer (170) includes a junction pattern extended in a first direction and multiple finger patterns (174,176,178) extended in a second direction perpendicular to the first direction from the junction pattern. A first finger pattern among the multiple finger patterns is electrically connected to the signal transmission line. Second finger patterns are electrically connected to the multiple ground lines, respectively. [Reference numerals] (AA) First direction; (BB) Second direction
Abstract:
PURPOSE: An interposer including a passive equalizer using a through silicon via, a manufacturing method thereof, a stacked chip package including the same, and a method for manufacturing the stacked chip package are provided to improve signal transmission properties without increasing a size or manufacturing costs. CONSTITUTION: A first insulation layer (120) is formed on the front side of a semiconductor substrate (110). A second insulation layer (130) is formed on the rear side of the semiconductor substrate. A plurality of through silicon vias (144,146,148) pass through the semiconductor substrate, the first insulation layer, and the second insulation layer. A plurality of metal wires include a signal transmission line (150a) to transmit an electric signal and a plurality of ground lines (150b-150f) to transmit a ground voltage. A rear metal pattern (170) includes a junction pattern (172) and a plurality of finger patterns (174,176,178). [Reference numerals] (AA) Second direction; (BB) First direction
Abstract:
PURPOSE: An electromagnetic field shielding device of an online electric vehicle system is provided to prevent the malfunction of an electric device. CONSTITUTION: A feeder(20) is laid under a road and is extended along a length direction of the road. A power collecting device(300) is installed at a lower unit of an electric vehicle and receives power from the feeder with a magnetic induction method. A first shielding member(40) shields an electric magnetic field exposed to both sides of the feeder when power is supplied to the power collecting device in the feeder. A second shielding member(50) is installed in a guide groove including a predetermined depth formed at both side units of an electric vehicle. The second shielding member shields the electric magnetic field exposed to a side space between the ground and the electric vehicle. A third shielding member(60) shields the electric magnetic field exposed to both sides of the electric vehicle when the power is supplied to the power collecting device.
Abstract:
PURPOSE: An automatic power feeding module of a power supply device is provided to automatically control the capacity of a capacitor for maximizing the output power of a power collector. CONSTITUTION: An automatic power feeding module of a power supply device includes a switch control device and multiple switches. The switch control device converts received electricity into direct current through a rectifier. The switch control device has a circuit for controlling a switch connected to a capacitor within the power supply device. The multiple switches turns on or off by power supplied from the switch control device. Each of the multiple switches is serially connected to each capacitor. A regulator controls power to be provided to a battery or motor. [Reference numerals] (AA) Switch control signal; (BB) Switch control device; (CC) Output capacity information; (DD) Power collector; (EE) Power feeder
Abstract:
PURPOSE: A device of a magnetic field mode for sensing the position of a moving body is provided to efficiently implement wireless power transmission to a vehicle or a moving body. CONSTITUTION: A device of a magnetic field mode for sensing the position of a moving body comprises a plurality of magnetic field sensors(111,112), A-D convertors(121,122), and a control unit(130). The magnetic field sensors are resonated by a wireless power transmission frequency. The A-D converters convert the voltage or current obtained by the resonance of the magnetic field sensors into a digital value. The control unit controls a display device displaying a position where the strongest magnetic field is formed by using a plurality of the digital values.