Pressure-sensitive adhesive compositions for manufacturing electronic devices

    公开(公告)号:US11286407B2

    公开(公告)日:2022-03-29

    申请号:US16471595

    申请日:2017-12-20

    Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

    Pressure-sensitive adhesive composition
    27.
    发明授权
    Pressure-sensitive adhesive composition 有权
    压敏粘合剂组合物

    公开(公告)号:US09290682B2

    公开(公告)日:2016-03-22

    申请号:US14345312

    申请日:2012-11-12

    CPC classification number: C09J133/08 C09J11/08 C09J133/10 Y10T428/2891

    Abstract: Disclosed is an adhesive composition comprising a low Tg (meth)acrylate copolymer component, a high Tg (meth)acrylate copolymer component, and a hydrogenated hydrocarbon tackifier. This disclosure provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles that are particularly useful in the bonding of low surface energy (LSE) substrates.

    Abstract translation: 公开了包含低Tg(甲基)丙烯酸酯共聚物组分,高Tg(甲基)丙烯酸酯共聚物组分和氢化烃增粘剂的粘合剂组合物。 本公开提供了在低表面能(LSE)基材的粘合中特别有用的压敏粘合剂和压敏粘合剂制品。

    BLENDS FOR PRESSURE SENSITIVE ADHESIVES USED IN PROTECTIVE FILMS
    28.
    发明申请
    BLENDS FOR PRESSURE SENSITIVE ADHESIVES USED IN PROTECTIVE FILMS 审中-公开
    用于在保护膜中使用的压敏敏感粘合剂的混合物

    公开(公告)号:US20150017427A1

    公开(公告)日:2015-01-15

    申请号:US14375591

    申请日:2013-02-01

    Abstract: There is provided an article comprising: a) a protective film comprising a thermoplastic film having a first side and a second side, and a pressure sensitive adhesive composition adhesively attached to at least one of the first side or the second side of the thermoplastic film, wherein the pressure sensitive adhesive composition comprises a blend of: i) an aqueous based pressure sensitive adhesive latex; ii) a low adhesion additive; and iii) a crosslinker; and b) a metal substrate adhesively attached to a side of the pressure sensitive adhesive composition opposite the thermoplastic film. There is also provided a pressure sensitive adhesive composition comprises a blend of: i) an aqueous based pressure sensitive adhesive latex; ii) a low adhesion additive; and iii) a cross linker.

    Abstract translation: 提供了一种制品,其包括:a)保护膜,其包含具有第一侧和第二侧的热塑性膜,以及粘合地附着到所述热塑性膜的第一侧或第二侧中的至少一个的压敏粘合剂组合物, 其中所述压敏粘合剂组合物包含以下混合物:i)水性基压敏胶乳; ii)低粘附性添加剂; 和iii)交联剂; 和b)粘附在与热塑性薄膜相对的压敏粘合剂组合物侧的金属基底。 还提供了一种压敏粘合剂组合物,其包含以下混合物:i)水性基压敏胶乳; ii)低粘附性添加剂; 和iii)交联剂。

Patent Agency Ranking