Abstract:
There is provided a pressure sensitive adhesive foam comprising a foam comprising a non-syntactic foam blend of styrenic block copolymer and acrylic copolymer wherein the pressure-sensitive adhesive foam has an elongation of greater than 600%, wherein the non-syntactic foam blend is a hot melt formed foam. There is also provided multilayer pressure sensitive adhesive foams, pressure sensitive adhesive foam tapes and articles made using such pressure sensitive adhesive foam.
Abstract:
Composition blends are prepared that are hot melt processable pressure sensitive adhesives. The composition blends include at least one olefinic block copolymer, at least one elastomeric polymer, and at least one tackifying resin. The composition blends may also include additional components, such as for example, at least one plasticizer. The composition blends can be used to prepare articles, such as tapes, by disposing the hot melt processable pressure sensitive adhesive blend composition on at least a portion of a substrate
Abstract:
The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.
Abstract:
There is provided an adhesive composition comprising at least 50 wt % of an aqueous dispersion of an amorphous polyurethane having a Tg below 25° C.; and a water dispersible cross-linker, where the adhesive composition has a peel retention of greater than or equal to 5% according to the Water/IPA Exposure Test.
Abstract:
The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer superimposed to a second polymer layer, wherein a curable liquid precursor of the first pressure sensitive adhesive polymer layer comprises a low Tg (meth)acrylate copolymer and a high Tg (meth)acrylate copolymer having a weight average molecular weight (Mw) of above 20,000 Daltons. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly and uses thereof.
Abstract:
There is provided an adhesive composition comprising at least 50 wt % of an aqueous dispersion of an amorphous polyurethane having a Tg below 25° C.; and a water dispersible cross-linker, where the adhesive composition has a peel retention of greater than or equal to 5% according to the Water/IPA Exposure Test.
Abstract:
Disclosed is an adhesive composition comprising a low Tg (meth)acrylate copolymer component, a high Tg (meth)acrylate copolymer component, and a hydrogenated hydrocarbon tackifier. This disclosure provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles that are particularly useful in the bonding of low surface energy (LSE) substrates.
Abstract:
There is provided an article comprising: a) a protective film comprising a thermoplastic film having a first side and a second side, and a pressure sensitive adhesive composition adhesively attached to at least one of the first side or the second side of the thermoplastic film, wherein the pressure sensitive adhesive composition comprises a blend of: i) an aqueous based pressure sensitive adhesive latex; ii) a low adhesion additive; and iii) a crosslinker; and b) a metal substrate adhesively attached to a side of the pressure sensitive adhesive composition opposite the thermoplastic film. There is also provided a pressure sensitive adhesive composition comprises a blend of: i) an aqueous based pressure sensitive adhesive latex; ii) a low adhesion additive; and iii) a cross linker.