PRESSURE-SENSITIVE ADHESIVE COMPOSITION
    5.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE COMPOSITION 有权
    压敏粘合剂组合物

    公开(公告)号:US20150044457A1

    公开(公告)日:2015-02-12

    申请号:US14345312

    申请日:2012-11-12

    CPC classification number: C09J133/08 C09J11/08 C09J133/10 Y10T428/2891

    Abstract: Disclosed is an adhesive composition comprising a low Tg (meth)acrylate copolymer component, a high Tg (meth)acrylate copolymer component, and a hydrogenated hydrocarbon tackifier. This disclosure provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles that are particularly useful in the bonding of low surface energy (LSE) substrates.

    Abstract translation: 公开了包含低Tg(甲基)丙烯酸酯共聚物组分,高Tg(甲基)丙烯酸酯共聚物组分和氢化烃增粘剂的粘合剂组合物。 本公开提供了在低表面能(LSE)基材的粘合中特别有用的压敏粘合剂和压敏粘合剂制品。

    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR MANUFACTURING ELECTRONIC DEVICES

    公开(公告)号:US20210130661A1

    公开(公告)日:2021-05-06

    申请号:US16471595

    申请日:2017-12-20

    Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

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