Abstract:
The sensors for SPM consist of a body, microcantilever and probe member, having a common flat surface in which at least one functionalization element shaped as trench and/or opening is formed with a heterogeneous probe element assembled in it, such as carbon nanotube (CNT) or other type nano-sized tubes, fibers, micro-crystals etc., including such with a complex shape and specially functionalized. In a sensor embodiment piezoresistors are used for transdusing the bending oscillation of the microcantilever and probe member in electrical signal. The three-dimensional measurement method allows using common scanning microscopy system, in a particular point of the scanning grid to perform measurement in all three directions without translating/rotating the system and/or the sample or change the sensor, by controlled periodic actuation of sensor with microcantilever and probe member with individual oscillation characteristics of bending without torsion in each direction of measurement, which characteristics are discernible from one another upon measurement and the number of the probe elements used is sufficient to ensure measurement in each of the three directions. The invention includes also a method for manufacturing the described sensor.
Abstract:
The method of fabricating devices for microelectromechanical systems (MEMS) with electrical components in their sidewalls is applicable for the production of microstructures with various electrical and mechanical properties that can be used for sensing in different technical areas. The method consists of three stages and through numerous repetitions of processes of creation of protective layers, photolithographical patterning, consecutive etching processes and doping via high temperature ion diffusion performed over non-deformable semiconductor basic structures, for example monocrystalline Silicon basic structures, it gives opportunity of building of electrical components in the sidewalls of MEMS devices. The electrical components so obtained can have equal or different parameters and can be disposed in parts of or the whole sidewalls of such devices. With MEMS devices realized according to the claimed method measurements with considerably increased accuracy, precision and sensitivity can be made.
Abstract:
The method of fabricating devices for microelectromechanical systems (MEMS) with electrical components in their sidewalls is applicable for the production of microstructures with various electrical and mechanical properties that can be used for sensing in different technical areas. The method consists of three stages and through numerous repetitions of processes of creation of protective layers, photolithographical patterning, consecutive etching processes and doping via high temperature ion diffusion performed over non-deformable semiconductor basic structures, for example monocrystalline Silicon basic structures, it gives opportunity of building of electrical components in the sidewalls of MEMS devices. The electrical components so obtained can have equal or different parameters and can be disposed in parts of or the whole sidewalls of such devices. With MEMS devices realized according to the claimed method measurements with considerably increased accuracy, precision and sensitivity can be made.