Abstract:
The sensors for SPM consist of a body, microcantilever and probe member, having a common flat surface in which at least one functionalization element shaped as trench and/or opening is formed with a heterogeneous probe element assembled in it, such as carbon nanotube (CNT) or other type nano-sized tubes, fibers, micro-crystals etc., including such with a complex shape and specially functionalized. In a sensor embodiment piezoresistors are used for transdusing the bending oscillation of the microcantilever and probe member in electrical signal. The three-dimensional measurement method allows using common scanning microscopy system, in a particular point of the scanning grid to perform measurement in all three directions without translating/rotating the system and/or the sample or change the sensor, by controlled periodic actuation of sensor with microcantilever and probe member with individual oscillation characteristics of bending without torsion in each direction of measurement, which characteristics are discernible from one another upon measurement and the number of the probe elements used is sufficient to ensure measurement in each of the three directions. The invention includes also a method for manufacturing the described sensor.
Abstract:
The method of fabricating devices for microelectromechanical systems (MEMS) with electrical components in their sidewalls is applicable for the production of microstructures with various electrical and mechanical properties that can be used for sensing in different technical areas. The method consists of three stages and through numerous repetitions of processes of creation of protective layers, photolithographical patterning, consecutive etching processes and doping via high temperature ion diffusion performed over non-deformable semiconductor basic structures, for example monocrystalline Silicon basic structures, it gives opportunity of building of electrical components in the sidewalls of MEMS devices. The electrical components so obtained can have equal or different parameters and can be disposed in parts of or the whole sidewalls of such devices. With MEMS devices realized according to the claimed method measurements with considerably increased accuracy, precision and sensitivity can be made.
Abstract:
The method of fabricating devices for microelectromechanical systems (MEMS) with electrical components in their sidewalls is applicable for the production of microstructures with various electrical and mechanical properties that can be used for sensing in different technical areas. The method consists of three stages and through numerous repetitions of processes of creation of protective layers, photolithographical patterning, consecutive etching processes and doping via high temperature ion diffusion performed over non-deformable semiconductor basic structures, for example monocrystalline Silicon basic structures, it gives opportunity of building of electrical components in the sidewalls of MEMS devices. The electrical components so obtained can have equal or different parameters and can be disposed in parts of or the whole sidewalls of such devices. With MEMS devices realized according to the claimed method measurements with considerably increased accuracy, precision and sensitivity can be made.
Abstract:
The invention relates to microelectromechanical (MEMS) sensors for contact mode measuring the position of micro- and macro-dimensional objects within a working range of up to 5 millimeters, and to a method for position monitoring with accuracy on the order of nanometers and better. The sensor is used in positioning systems with very high accuracy, for measurement and control in the field of micro-/nanotechnologies, and in other fields. The sensor comprises an anchored body (1) with a measuring microcantilever (2), piezoresistors (4) embedded in the base of the microcantilever (2), and an actuated element 1' which is fixedly attached to a movable object, the position of which is to be monitored. The body (1) attached to a stationary object, and the element 1' are connected via at least one compliant transmission mechanism (5), comprising the microcantilever (2), and a chain of auxiliary flexure elements (6, 7, 8, 14 or 10), being connected to the movable end thereof.
Abstract:
The invention refers to sensors for scanning probing microscopy (SPM), which offer high precision and resolution of measurement, a method for three-dimensional measurement with such sensors and a method for their production, which, by measuring the variations of the amplitude, the frequency, of the phase difference or of the tunnel current, find an application for the determination of the topography, the geometrical size or some other characteristic of objects in various fields of engineering. The sensors consist of a body, a micro bracket and a probing part, which have a common plane surfacewithin which at least one element is structured for functioning in the form of an orifice and/or a gutter, in which a heterogeneous probing element is positioned in the form of a carbon nanotube (CNT), a boron or boron nitride nanotube, a nanothread, a nanocrystal, etc., including such with a complex form, e.g. a cylinder with a sphere. The method of three dimensional measurement offers the possibility, by using sensors with elasticity in the three directions, with the usual technology of scanning probe microscopy , by measuring in a given point, to determine the characteristics of the samplein the three directions without rotating the sensor and/or the sample under study. The invention involves also a method for obtaining the sensors described in a reproducible and precise manner.