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    CAPACITIVE SENSOR PACKAGING
    21.
    发明公开
    CAPACITIVE SENSOR PACKAGING 审中-公开
    VERPACKUNGFÜREINEN KAPAZITIVEN传感器

    公开(公告)号：EP2877960A1

    公开(公告)日：2015-06-03

    申请号：EP13728581.3

    申请日：2013-05-17

    Applicant: Apple Inc.

    Inventor： POPE, Benjamin J. ,  ARNOLD, Shawn ,  CORLETT, Barry J. ,  GILTON, Terry L. ,  HUSIANI, Syed ,  WEBSTER, Steven ,  MEYERS, Scott A ,  HILL, Matthew D ,  LYON, Benjamin B.

    IPC: G06K9/00

    CPC classification number: G06K9/00087 ,  G06F3/044 ,  G06K9/0002 ,  G06K9/0004 ,  G06K9/00053 ,  G06K9/00073

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Abstract translation: 一种装置包括指纹传感器，其具有被配置为电容耦合到用户指纹的一组电容性元件。 指纹传感器可以设置在电子设备的控制按钮或显示元件之下，例如控制按钮和显示组件中的一个或多个。 响应元件响应于用户指纹的接近度，例如响应于控制按钮的运动的第一电路中的一个或两个，以及响应于指纹和显示元件的表面之间的耦合的第二电路。 指纹传感器比响应元件更靠近指纹。 控制按钮或显示部件可以包括各向异性介电材料，例如蓝宝石。

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    22.
    发明公开
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：EP4456704A3

    公开(公告)日：2025-01-08

    申请号：EP24200008.1

    申请日：2017-07-24

    Applicant: Apple Inc.

    Inventor： BROWNING, Lucy Elizabeth ,  POPE, Benjamin J. ,  LEUTHEUSER, Paul U. ,  MYERS, Scott A. ,  DINH, Richard Hung Minh ,  HUO, Edward S.

    IPC: G06F1/16 ,  G06F3/01 ,  G06F3/0354 ,  G06V40/12

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    23.
    发明公开
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：EP4092507A2

    公开(公告)日：2022-11-23

    申请号：EP22183352.8

    申请日：2017-07-24

    Applicant: Apple Inc.

    Inventor： BROWNING, Lucy Elizabeth ,  POPE, Benjamin J. ,  LEUTHEUSER, Paul U. ,  MYERS, Scott A. ,  DINH, Richard Hung Minh ,  HUO, Edward S.

    IPC: G06F1/16 ,  G06F3/01 ,  G06F3/0354 ,  H01L41/113 ,  G06K9/00

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    VALVE FOR ACOUSTIC PORT
    24.
    发明公开
    VALVE FOR ACOUSTIC PORT 审中-公开

    公开(公告)号：EP3518555A1

    公开(公告)日：2019-07-31

    申请号：EP19162349.5

    申请日：2017-08-17

    Applicant: Apple Inc.

    Inventor： POPE, Benjamin J. ,  PORTER, Scott P. ,  WILK, Christopher Raymond ,  BROWN, Suzanne C ,  NOTARANGELO, Claudio ,  TAO, Hongdan ,  TAYLOR, Martin D ,  TAN, Tang Yew

    IPC: H04R1/28

    Abstract: A portable electronic device including an enclosure having an enclosure wall that forms an interior chamber. A speaker module is positioned within the interior chamber and includes a speaker and a module wall forming a back volume chamber of the speaker. The back volume chamber includes an acoustic vent port formed through the module wall to acoustically couple the back volume chamber to the interior chamber. The device further including an electromechanical valve for regulating the acoustic coupling of the back volume chamber to the interior chamber. The electromechanical valve is operable to transition between an open configuration in which the acoustic vent port is open to the interior chamber and a closed configuration in which the acoustic vent port is closed off from the interior chamber.

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