SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    1.
    发明申请
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
    电子设备传感器组件

    公开(公告)号:WO2018044425A1

    公开(公告)日:2018-03-08

    申请号:PCT/US2017/043446

    申请日:2017-07-24

    Applicant: APPLE INC.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    Abstract translation: 描述了用于电子设备的传感器组件。 根据一些实施例,传感器组件包括固态传感器,诸如电容传感器,压电传感器或压阻传感器。 传感器组件可以包括许多功能,提供紧凑的外形,使其非常适合集成到电子设备外壳的小空间。 传感器组件还可以包括隔离传感器组件的各个部分的移动的特征,允许准确检测传感事件。 根据一些实施例,传感器组件耦合到模仿机械按钮的感觉并增强用户体验的触觉致动器,扬声器或两者。

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    3.
    发明公开

    公开(公告)号:EP4092507A3

    公开(公告)日:2023-02-08

    申请号:EP22183352.8

    申请日:2017-07-24

    Applicant: Apple Inc.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    4.
    发明公开

    公开(公告)号:EP4456704A2

    公开(公告)日:2024-10-30

    申请号:EP24200008.1

    申请日:2017-07-24

    Applicant: Apple Inc.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    6.
    发明公开

    公开(公告)号:EP4456704A3

    公开(公告)日:2025-01-08

    申请号:EP24200008.1

    申请日:2017-07-24

    Applicant: Apple Inc.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    7.
    发明公开

    公开(公告)号:EP4092507A2

    公开(公告)日:2022-11-23

    申请号:EP22183352.8

    申请日:2017-07-24

    Applicant: Apple Inc.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

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