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公开(公告)号:WO2018048695A1
公开(公告)日:2018-03-15
申请号:PCT/US2017/049342
申请日:2017-08-30
Applicant: APPLE INC.
Inventor: ZHAO, Xiao Ying , LUI, Timothy S. , CATER, Tyler B. , PHOUTHAVONG, Rasamy , MYERS, Scott A. , POPE, Benjamin J. , HURRELL, David A. , XYDIS, Christopher R. , HUO, Edward S. , DINH, Richard Hung Minh , FIRKA, Michael W. , AUCLAIR, Martin J. , MUNDELL, Kurtis J. , BAVETTA, Salome , LEUTHEUSER, Paul , ESMAEILI, Hani , FROESE, Kevin M. , CHOWDHURY, Ihtesham H. , TAN, Tang Yew , BATES, Eric W. , ZHANG, Yaocheng
IPC: H04M1/02
Abstract: An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.
Abstract translation: 公开了具有防液体进入电子设备的外壳中的开口(或多个开口)的具有防液体修改的电子设备。 例如,电子设备可以包括由内部施加到外壳的防液体材料形成的涂层。 该电子设备可以进一步包括承载被设计为覆盖显示器组件的保护性透明层的框架。 为了将框架与外壳固定,电子设备可以包括布置在涂层的外周上的粘合组件。 粘合剂组件可以包括初始彼此分离的多个粘合剂部分。 然而,利用框架和外壳之间的粘合部分,粘合部分可被框架和外壳压缩,导致粘合部分膨胀并彼此啮合。 结果,涂层和粘合剂部分提供了对液体的密封。 p>
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公开(公告)号:WO2014109951A1
公开(公告)日:2014-07-17
申请号:PCT/US2014/010145
申请日:2014-01-03
Applicant: APPLE INC.
Inventor: KWONG, Kelvin , POPE, Benjamin J. , MERZ, Nicholas G.
CPC classification number: H05K5/03 , G06F1/1626 , G06F3/02 , G06F3/0202 , H01H13/04 , H01H13/52 , H01H2013/525 , H04M1/23
Abstract: A control mechanism (50) for an electronic device (10) comprises a cover glass (12) having an aperture (54) defined therein. The aperture (54) extends from an interior to an exterior of the device (10). A control member (52) is positioned within the aperture (54), coupled to an actuator (58). The control member (52) comprises a ceramic insert (52B) having a contact surface exposed to the exterior of the housing, operable to actuate the actuator (58) in response to a force on the contact surface. A bearing member (52A) 4is molded about the insert. The bearing member (52A) has a hardness less than that of the ceramic insert (52B), and less than that of the cover glass (12).
Abstract translation: 用于电子设备(10)的控制机构(50)包括其中限定有孔(54)的盖玻璃(12)。 孔(54)从装置(10)的内部延伸到外部。 控制构件(52)定位在孔(54)内,联接到致动器(58)。 控制构件(52)包括具有暴露于壳体外部的接触表面的陶瓷插入件(52B),可操作以响应于接触表面上的力来致动致动器(58)。 轴承构件(52A)4围绕插入件模制。 轴承构件(52A)的硬度小于陶瓷嵌件(52B)的硬度,并且小于盖玻璃(12)的硬度。
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公开(公告)号:WO2018048660A1
公开(公告)日:2018-03-15
申请号:PCT/US2017/048948
申请日:2017-08-28
Applicant: APPLE INC.
Inventor: CATER, Tyler B. , POPE, Benjamin J. , MYERS, Scott A. , BUSTLE, Benjamin Shane , YANG, Tseng-Mau , BRINKMAN, Adam J.
Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.
Abstract translation: 公开了一种具有由模制材料互锁在一起的多个壳体部件的电子设备。 为了为模制材料提供互锁表面,壳体部件可以包括各种几何形状,这些几何形状被设计成容纳和保持模制材料,使得壳体部件彼此固定。 例如,第一壳体部分可以经历多次材料去除操作以形成多个肋,每个肋具有通孔。 当模制材料沿着肋条延伸并进入通孔时,模制材料固化并且与第一壳体部分互锁。 第二壳体部件可以包括容纳模制材料的几个阶梯凹痕。 而且,第三壳体部分可以包括燕尾凹陷以接收模制材料,使得第一壳体部分和第二壳体部分与第三壳体部分互锁。 凹痕可以提供三维保留以防止脱钩。 p>
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公开(公告)号:WO2018044425A1
公开(公告)日:2018-03-08
申请号:PCT/US2017/043446
申请日:2017-07-24
Applicant: APPLE INC.
Inventor: BROWNING, Lucy Elizabeth , POPE, Benjamin J. , LEUTHEUSER, Paul U. , MYERS, Scott A. , DINH, Richard Hung Minh , HUO, Edward S.
IPC: G06F1/16 , G06F3/01 , G06F3/0354 , H01L41/113 , G06K9/00
Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
Abstract translation: 描述了用于电子设备的传感器组件。 根据一些实施例,传感器组件包括固态传感器,诸如电容传感器,压电传感器或压阻传感器。 传感器组件可以包括许多功能,提供紧凑的外形,使其非常适合集成到电子设备外壳的小空间。 传感器组件还可以包括隔离传感器组件的各个部分的移动的特征,允许准确检测传感事件。 根据一些实施例,传感器组件耦合到模仿机械按钮的感觉并增强用户体验的触觉致动器,扬声器或两者。 p>
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公开(公告)号:WO2013173773A1
公开(公告)日:2013-11-21
申请号:PCT/US2013/041673
申请日:2013-05-17
Applicant: APPLE INC.
Inventor: POPE, Benjamin J. , ARNOLD, Shawn , CORLETT, Barry J. , GILTON, Terry L. , HUSIANI, Syed , WEBSTER, Steven , MEYERS, Scott A , HILL, Matthew D , LYON, Benjamin B.
IPC: G06K9/00
CPC classification number: G06K9/00087 , G06F3/044 , G06K9/0002 , G06K9/0004 , G06K9/00053 , G06K9/00073
Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.
Abstract translation: 一种装置包括指纹传感器,其具有被配置为电容耦合到用户指纹的一组电容性元件。 指纹传感器可以设置在电子设备的控制按钮或显示元件下方,例如控制按钮和显示组件中的一个或多个。 响应元件响应于用户指纹的接近度,例如响应于控制按钮的运动的第一电路中的一个或两个,以及响应于指纹和显示元件的表面之间的耦合的第二电路。 指纹传感器比响应元件更靠近指纹。 控制按钮或显示组件可以包括各向异性介电材料,例如蓝宝石。
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公开(公告)号:WO2020068374A1
公开(公告)日:2020-04-02
申请号:PCT/US2019/049227
申请日:2019-08-30
Applicant: APPLE INC.
Inventor: COHEN, Sawyer I. , CROSBY, Justin D. , DAVE, Ruchir M. , JOHNSON, Martin E. , POPE, Benjamin J. , SATONGAR, Darius A.
Abstract: The present disclosure generally relates techniques for audio-assisted enrollment of biometric features. In some embodiments, methods and devices for assisting users with enrollment of biometric features, using spatial audio cues, are described.
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公开(公告)号:WO2016024943A1
公开(公告)日:2016-02-18
申请号:PCT/US2014/050570
申请日:2014-08-11
Applicant: APPLE INC.
Inventor: JARVIS, Daniel W. , POPE, Benjamin J. , SLOEY, Jason S. , DENBY, Jonathan C. , SPRAGGS, Ian A. , MALEK, Shayan
CPC classification number: H05K7/14 , H01H23/04 , H01H23/148 , H01R43/205 , H04M1/026 , H04M1/0274 , H04M1/0277 , H05K7/026 , H05K7/06
Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.
Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中,使用整流罩将多个板对板连接器保持在印刷电路板(PCB)上的通信槽内。 在另一个实施例中,使用许多插入模制的保持构件来防止在丢弃事件期间便携式计算设备的侧壁向外变形。 在另一个实施例中,使用具有直径相对的突起的C形垫圈来调节内部部件的对准。
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公开(公告)号:WO2015035411A1
公开(公告)日:2015-03-12
申请号:PCT/US2014/054834
申请日:2014-09-09
Applicant: APPLE INC.
Inventor: POPE, Benjamin J. , SPRAGGS, Ian A. , DINH, Richard Hung Minh , PHOUTHAVONG, Rasamy , YAN, Vincent
CPC classification number: H04M1/0264
Abstract: An electronic device has a camera assembly disposed in a housing of the electronic device that includes a light source assembly having a primary purpose for illuminating a subject during an imaging operation. The light source assembly includes a light source and a light window. A light block can be applied to lateral surfaces of the light window to prevent light passing through the light window from propagating along an outer surface of the housing, or other components of the electronic device. In some embodiments, the light block can include multiple layers having various reflective and absorptive characteristics.
Abstract translation: 电子设备具有设置在电子设备的壳体中的相机组件,其包括在成像操作期间具有用于照亮被摄体的主要目的的光源组件。 光源组件包括光源和光窗。 可以将光块施加到光窗的侧表面,以防止通过光窗的光沿着壳体的外表面或电子设备的其它部件传播。 在一些实施例中,光块可以包括具有各种反射和吸收特性的多个层。
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公开(公告)号:EP3420433A1
公开(公告)日:2019-01-02
申请号:EP17847143.9
申请日:2017-07-24
Applicant: Apple Inc.
Inventor: BROWNING, Lucy Elizabeth , POPE, Benjamin J. , LEUTHEUSER, Paul U. , MYERS, Scott A. , DINH, Richard Hung Minh , HUO, Edward S.
IPC: G06F1/16 , G06F3/01 , G06F3/0354 , H01L41/113 , G06K9/00
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公开(公告)号:EP4456704A2
公开(公告)日:2024-10-30
申请号:EP24200008.1
申请日:2017-07-24
Applicant: Apple Inc.
Inventor: BROWNING, Lucy Elizabeth , POPE, Benjamin J. , LEUTHEUSER, Paul U. , MYERS, Scott A. , DINH, Richard Hung Minh , HUO, Edward S.
IPC: H10N30/20
Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
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