公开(公告)号：EP3205187A1

公开(公告)日：2017-08-16

申请号：EP15775892.1

申请日：2015-09-24

Applicant: Apple Inc.

Inventor： ZHANG, Zhen ,  DRZAIC, Paul, S. ,  TAO, Yi

IPC: H05K1/02

CPC classification number: G06F3/0412 ,  G06F1/169 ,  G06F2203/04102 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0296 ,  H05K1/0393 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/10106

Abstract: A flexible substrate may have one or more bends. A bend in a flexible substrate may be made along a bend axis. Conductive traces in the flexible substrate may have elongated shapes. Each conductive trace may extend along a longitudinal axis that is perpendicular to the bend axis. Metal or other conductive materials may form the conductive traces. The traces may be formed from a chain of linked segments. Each segment may have patterned trace portions that surround one, two, or more than two openings. Traces may also be formed that have multiple layers of metal or other conductive material interconnected using vias. A polymer layer may cover the traces to align a neutral stress plane with the traces and to serve as a moisture barrier layer.

Abstract translation: 柔性基底可以具有一个或多个弯曲。 柔性衬底中的弯曲可以沿着弯曲轴进行。 柔性衬底中的导电迹线可以具有细长的形状。 每个导电迹线可以沿着垂直于弯曲轴线的纵向轴线延伸。 金属或其他导电材料可以形成导电迹线。 迹线可以由链条链段形成。 每个节段可以具有围绕一个，两个或多于两个开口的图案化迹线部分。 也可以形成迹线，其具有使用通孔互连的多层金属或其他导电材料。 聚合物层可覆盖迹线以使中性应力平面与迹线对齐并用作防潮层。

公开(公告)号：EP3245678A1

公开(公告)日：2017-11-22

申请号：EP16701567.6

申请日：2016-01-08

Applicant: Apple Inc.

Inventor： ZHANG, Zhen ,  TAO, Yi ,  DRZAIC, Paul, S. ,  WURZEL, Joshua, G.

IPC: H01L51/52 ,  H01L27/32

CPC classification number: H01L51/0097 ,  H01L23/4985 ,  H01L23/5387 ,  H01L27/326 ,  H01L27/3276 ,  H01L51/004 ,  H01L51/5253 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549

Abstract: A display may have an array of organic light-emitting diodes that form an active area (14A) on a flexible substrate (30). Metal traces (74) may extend between the active area (14A) and an inactive area (14C) of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be coupled to the inactive area. The metal traces may extend across a bend region (14B) in the flexible substrate. The flexible substrate may be bent in the bend region. The flexible substrate may be made of a thin flexible material to reduce metal trace bending stress. A coating layer (84) in the bend region may be provided with an enhanced elasticity to allow its thickness to be reduced. The flexible substrate may be bent on itself and secured within an electronic device without using a mandrel.