Abstract:
An optical probe for emitting and/or receiving light within a body comprises an optical fiber that transmits and/or receives an optical signal, a silicon optical bench including a fiber groove running longitudinally that holds an optical fiber termination of the optical fiber and a reflecting surface that optically couples an endface of the optical fiber termination to a lateral side of the optical bench. The fiber groove is fabricated using silicon anisotropic etching techniques. Some examples use a housing around the optical bench that is fabricated using LIGA or other electroforming technology. A method for forming lens structure is also described that comprises forming a refractive lens in a first layer of a composite wafer material, such as SOI (silicon on insulator) wafers and forming an optical port through a backside of the composite wafer material along an optical axis of the refractive lens.
Abstract:
An alignment structure (100) maintains an optical fiber in a bore (113). The structure is fixed on a bench and is passively or actively aligned with a light source. Then the structure may be welded or soldered to the optical bench whereby the alignment may suffer due to heat transfer. To correct this, the alignment structure can be plastically deformed to correct the alignment after the components have been fixed. The alignment structure has a substantially constant cross section in a z-axis direction as well as flexible links in order to allow displacements orthogonal to the optical axis. This movement will be initiated by seizing the component with a micro-positioner at a handle (136) and displacing it over the elastic limit to achieve permanent deformation.
Abstract:
An optical component manipulation system (100) has two opposed jaws (120A, 120B), which can each be independently positioned relative to each other in a coordinate plane to thereby effect the desired positioning of optical components (10) within the larger system. Z-axis rigidity is provided by air-bearings (124A, 124B). Laser heating (220) of the jaws is used for solder, or similar heat driven bonding, processes.
Abstract:
A process for fabricating an optical membrane device comprises providing a handle wafer and then oxidizing a surface of the handle wafer to form an insulating layer. A device wafer is then bonded to the handle wafer. An optical membrane structure is formed in this device wafer. The insulating layer is selectively removed to release the membrane structure. This device wafer can be manufactured from silicon wafer material. Such material typically has a low number of dislocations yielding a stable mechanical membrane structure. The insulating layer defines the electrical cavity across which electrical fields are established that are used to electrostatically deflect the membrane structure. The insulating layer is between 3 and 6 micrometers ( mu m) in thickness.
Abstract:
An alignment structure (100) maintains an optical fiber in a bore (113). The structure is fixed on a bench and is passively or actively aligned with a light source. Then the structure may be welded or soldered to the optical bench whereby the alignment may suffer due to heat transfer. To correct this, the alignment structure can be plastically deformed to correct the alignment after the components have been fixed. The alignment structure has a substantially constant cross section in a z-axis direction as well as flexible links in order to allow displacements orthogonal to the optical axis. This movement will be initiated by seizing the component with a micro-positioner at a handle (136) and displacing it over the elastic limit to achieve permanent deformation.
Abstract:
An optical probe for emitting and/or receiving light within a body comprises an optical fiber that transmits and/or receives an optical signal, a silicon optical bench including a fiber groove running longitudinally that holds an optical fiber termination of the optical fiber and a reflecting surface that optically couples an endface of the optical fiber termination to a lateral side of the optical bench. The fiber groove is fabricated using silicon anisotropic etching techniques. Some examples use a housing around the optical bench that is fabricated using LIGA or other electroforming technology. A method for forming lens structure is also described that comprises forming a refractive lens in a first layer of a composite wafer material, such as SOI (silicon on insulator) wafers and forming an optical port through a backside of the composite wafer material along an optical axis of the refractive lens.
Abstract:
An optical switch device includes a rolling shutter or membrane attached at one of its edges to a substrate near an optical port in the substrate. The rolling shutter can assume one of two states. In a first closed state, the membrane is uncoiled onto the substrate over the port such that light directed at the port impinges on the shutter. In a second open state, the membrane is rolled up away from the port such that light directed at the port impinges on the port. In one embodiment, a mirror is formed on the membrane such that when the membrane is in the closed state over the substrate, light directed at the port is reflected by the mirror. In one configuration, the optical port includes a hole or aperture such that light passed through the port without interference. The device can include a latch electrode the far end of the membrane such that when it is rolled out, it can be held in position by a latching voltage applied across the latch electrode and the substrate. Slits can be formed in the membrane to keep the mirror flat by relieving strain in the membrane and to allow gases in proximity to the device to pass through the membrane as it is activated. The shutter can include dimples to minimize the area of contact between the membrane and the substrate to reduce the probability of the two sticking together. The attachment edge of the membrane can be made shorter than its width to reduce distortions in the membrane to keep the mirror flat. A raised annular rim can be provided around the port such that when the shutter is held down over the port it is pulled taut and flat over the rim. This feature is also used to maintain flatness in the mirror. The switch device can be used as part of an array of optical switches.
Abstract:
A semiconductor optical amplifier system (100) comprises a hermetic package (112). In the typical implementation, this hermetic package (112) is a standard butterfly, DIP or miniDIL package. An optical bench (116) is sealed within this package (112). A first fiber pigtail (118) enters this package via a feed-through to connect to the bench (116) and terminate above the bench. A second optical fiber pigtail (120) enters the package (112) via a second fiber feed-through to connect to the bench (116) and similarly terminate above the bench. A semiconductor amplifier chip (102) is connected to the bench (116) to provide amplification. Isolators (128, 130) are further incorporated along with a monitoring diode (126) to yield a fully integrated system.
Abstract:
A wavelength measurement system uses birefringent material waveplate, thereby producing a substantially sinusoidal spectral response. As a result, the responses of multiple birefringent filters can be combined to yield a filter system with a periodic frequency response that has an additive wavelength resolution that is spectrally stable. That is, the wavelength measurement system (100) does not have regions where wavelength resolution is degraded. In one implementation, a waveplate system (112) is used, placed between two blocks of birefringent material (110) and (114). A quadrant detector (116) is used to detect the intensities of the resulting four beams.