Abstract:
An alignment structure (100) maintains an optical fiber in a bore(113). The structure is fixed on a bench and is passively or ac tively aligned with a light source. Then the structure may be welded or soldered to the optical bench whereby the alignment may suffer due to heat transfer. To correct this, the alignment structure can be plastically deformed to correct the alignment after thecomponents have been fixed. The alignment structure has a substantially constant cross section in a z-axis direction as well as flexible links in order to allow displacements orthogonal to the optical axis. This mouvements will be initiated by seizing the component with a micro-positioner at a handle (136) and displacing it over the elastic limit to achieve permanent deformation.
Abstract:
An integrated optical monitoring system comprises a hermetic package and an optical bench sealed within the package. An optical fiber pigtail enters the package via a feed-through to connect to and terminate above the bench. A tunable filter is connected to the top of the bench and filters an optical signal transmitted by the fiber pigtail. A detector, also connected to the bench, detects the filtered signal from the tunable filter. Thus, the entire system is integrated together, on a single bench within a preferably small package. This configuration makes the system useful as a subsystem, for example, in a larger system offering higher levels of functionality and optical signal processing capability.
Abstract:
A semiconductor optical amplifier system (100) comprises a hermetic package (112). In the typical implementation, this hermetic package (112) is a standard butterfly, DIP or miniDIL package. An optical bench (116) is sealed within this package (112). A first fiber pigtail (118) enters this package via a feed-through to connect to the bench (116) and terminate above the bench. A second optical fiber pigtail (120) enters the package (112) via a second fiber feed-through to connect to the bench (116) and similarly terminate above the bench. A semiconductor amplifier chip (102) is connected to the bench (116) to provide amplification. Isolators (128, 130) are further incorporated along with a monitoring diode (126) to yield a fully integrated system.
Abstract:
An alignment structure (100) maintains an optical fiber in a bore(113). The structure is fixed on a bench and is passively or ac tively aligned with a light source. Then the structure may be welded or soldered to the optical bench whereby the alignment may suffer due to heat transfer. To correct this, the alignment structure can be plastically deformed to correct the alignment after thecomponents have been fixed. The alignment structure has a substantially constant cross section in a z-axis direction as well as flexible links in order to allow displacements orthogonal to the optical axis. This mouvements will be initiated by seizing the component with a micro-positioner at a handle (136) and displacing it over the elastic limit to achieve permanent deformation.