-
公开(公告)号：US09627749B2
公开(公告)日：2017-04-18
申请号：US15078949
申请日：2016-03-23
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Brian S. Tryon , Charles J. Kuehmann , Stephen B. Lynch , James A. Wright
Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.
-
公开(公告)号：US20150368772A1
公开(公告)日：2015-12-24
申请号：US14744774
申请日：2015-06-19
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Abhijeet Misra
Abstract: The disclosure provides an aluminum alloy comprising second phase particles having an Al(FeMn)Si phase with an (Fe+Mn):Si ratio of 0.5 to 2.5 and a mean particle diameter of 0.5 μm to 10 μm. The disclosure also provides an aluminum alloy comprising 0.02 to 0.11 wt % Fe, 0 to 0.16 wt % Mn, 0 to 0.08 wt. % Cr, 0.40 to 0.90 wt % Mg, and 0.20 to 0.60 wt % Si, wherein the aluminum alloy is homogenized at a temperature from 550 to 590° C.
Abstract translation: 本发明提供一种铝合金，其包括具有（Fe + Mn）：Si比为0.5〜2.5，平均粒径为0.5μm〜10μm的Al（FeMn）Si相的第二相粒子。 本公开还提供了一种铝合金，其包含0.02至0.11重量％的Fe，0至0.16重量％的Mn，0至0.08重量％ ％Cr，0.40〜0.90重量％Mg和0.20〜0.60重量％的Si，其中铝合金在550-590℃的温度下均化。
-
公开(公告)号：US20250048576A1
公开(公告)日：2025-02-06
申请号：US18915613
申请日：2024-10-15
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Hoishun Li , Todd S. Mintz , Isabel Yang , James A. Curran , Lei Gao , Chuan Liu , Yu Yan
Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
-
公开(公告)号：US20240373575A1
公开(公告)日：2024-11-07
申请号：US18651139
申请日：2024-04-30
Applicant: Apple Inc.
Inventor： Abhijeet Misra , Hoishun Li , Todd S. Mintz , Isabel Yang , James A. Curran , Lei Gao , Chuan Liu , Yu Yan
Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
-
公开(公告)号：US12114453B2
公开(公告)日：2024-10-08
申请号：US16449061
申请日：2019-06-21
Applicant: Apple Inc.
Inventor： William A. Counts , Andrew W. Meschke , Lei Gao , Abhijeet Misra , Alexander W. Williams , Hoishun Li , Lee E. Hooton , Michael B. Wittenberg , James A. Yurko
CPC classification number: H05K5/04 , A45C11/00 , G06F1/1626 , H04M1/0283 , H05K5/0004 , H05K5/0213 , H05K5/03 , A45C2011/002 , G06F2200/1633
Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
-
Patent Agency Ranking
公开(公告)号：US12070797B1
公开(公告)日：2024-08-27
申请号：US17447790
申请日：2021-09-15
Applicant: Apple Inc.
Inventor： Anthony D. Prescenzi , Abhijeet Misra , Adam T. Clavelle , Eric W. Hamann , Isabel Yang , Brian M. Gable , James A. Yurko
Abstract: A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.
-
公开(公告)号：US20240284624A1
公开(公告)日：2024-08-22
申请号：US18650720
申请日：2024-04-30
Applicant: Apple Inc.
Inventor： William A. Counts , Andrew W. Meschke , Lei Gao , Abhijeet Misra , Alexander W. Williams , Hoishun Li , Lee E. Hooton , Michael B. Wittenberg , James A. Yurko
CPC classification number: H05K5/04 , A45C11/00 , G06F1/1626 , H04M1/0283 , H05K5/0004 , H05K5/0213 , H05K5/03 , A45C2011/002 , G06F2200/1633
Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
-
公开(公告)号：US11028468B2
公开(公告)日：2021-06-08
申请号：US16273761
申请日：2019-02-12
Applicant: Apple Inc.
Inventor： John C. DiFonzo , Abhijeet Misra , Charles J. Kuehmann , Daniel T. McDonald
Abstract: A component for an electronic device can include a metal alloy formed by a metal injection molding process. The metal alloy can have a composition of about 32 wt % to about 38 wt % cobalt and about 62 wt % to about 68 wt % iron.
-
公开(公告)号：US20200332400A1
公开(公告)日：2020-10-22
申请号：US16533374
申请日：2019-08-06
Applicant: Apple Inc.
Inventor： Zechariah D. Feinberg , Abhijeet Misra , Lei Gao , Matthew D. Walker , Logan Ames , Duy P. Le , Vince Yan
Abstract: An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about 1.4.
-
公开(公告)号：US20200245487A1
公开(公告)日：2020-07-30
申请号：US16449061
申请日：2019-06-21
Applicant: Apple Inc.
Inventor： William A. Counts , Andrew W. Meschke , Lei Gao , Abhijeet Misra , Alexander W. Williams , Hoishun Li , Lee E. Hooton , Michael B. Wittenberg , James A. Yurko
Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
-
-
-
-
-
-
-
-
-
Search Results
36
records
(took 0.032 seconds)
