SUBSTRATE PROCESSING SYSTEM, VALVE ASSEMBLY, AND PROCESSING METHOD
    23.
    发明申请
    SUBSTRATE PROCESSING SYSTEM, VALVE ASSEMBLY, AND PROCESSING METHOD 审中-公开
    基板加工系统,阀组件和加工方法

    公开(公告)号:US20150013771A1

    公开(公告)日:2015-01-15

    申请号:US14335415

    申请日:2014-07-18

    Abstract: In one aspect, a valve assembly adapted to seal an opening in a chamber is disclosed. Valve assembly includes a housing being adapted for coupling to a chamber surface having the opening therein, the housing including a threshold portion positioned adjacent to the chamber opening, the threshold portion having one or more inlets adapted to supply gas to an interior region of the housing adjacent to the chamber opening; and a sealing surface adapted to selectively (1) seal the opening, and (2) retract from the opening so as not to obstruct substrate passage. Numerous other system aspects are provided, as are methods and computer program products in accordance with these and other aspects.

    Abstract translation: 一方面,公开了一种适于密封腔室中的开口的阀组件。 阀组件包括适于联接到其中具有开口的腔室表面的壳体,壳体包括邻近腔室开口定位的阈值部分,阈值部分具有适于将气体供应到壳体的内部区域的一个或多个入口 邻近室开口; 以及适于选择性地(1)密封开口的密封表面,和(2)从开口缩回以不妨碍基板通过。 提供了许多其他系统方面,以及根据这些和其他方面的方法和计算机程序产品。

    Electron beam welding of large vacuum chamber body having a high emissivity coating
    24.
    发明授权
    Electron beam welding of large vacuum chamber body having a high emissivity coating 有权
    具有高发射率涂层的大型真空室体的电子束焊接

    公开(公告)号:US08915389B2

    公开(公告)日:2014-12-23

    申请号:US13966329

    申请日:2013-08-14

    CPC classification number: B65D7/06 B23K15/0006 B65D7/38 H01L21/67379

    Abstract: Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.

    Abstract translation: 本文公开的实施例涉及已经焊接在一起的大型真空室主体。 腔体可以在其中的至少一个表面上具有高发射率涂层。 由于腔室主体的尺寸较大,可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。 这些部件可以在与身体的角部间隔开的位置处被焊接在一起,该位置在排空期间可能处于最大的应力下,以确保可能是身体中最弱点的焊缝不会失效。 室主体的至少一个表面可以涂覆有高发射率涂层,以帮助来自加热的基底的热传递。 高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

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