公开(公告)号：DE102005019923A1

公开(公告)日：2006-11-02

申请号：DE102005019923

申请日：2005-04-27

Applicant: BASF AG

Inventor： NIESNER NORBERT ,  SOBOTKA BETTINA ,  PFISTER JUERGEN ,  SCHEIBITZ MATTHIAS ,  WAGNER NORBERT ,  LOCHTMAN RENE ,  SCHNEIDER NORBERT ,  WARZELHAN VOLKER ,  LIPPERT GERALD

IPC: C08J5/18 ,  B29D7/01 ,  B32B15/08 ,  B32B27/08 ,  C08J3/12 ,  C08K3/08 ,  C08K7/02 ,  C08K7/16 ,  C08L101/12 ,  H01Q17/00

Abstract: The film or plate, which can be metalized, is a plastics mixture of four components. The tensile stretch of the thermoplastic polymer component is greater than the mixture including the metal powder, dispersant and filling components by a factor of 1.1-100.0. The tensile strength of the thermoplastic polymer component is stronger than the mixture by a factor of 0.5-4.0. The film or board is metalised by deposition in one or more layers. The plastics mixture (based on 100 weight%) comprises: (a) 5-50 weight% of a thermoplastics polymer; (b) 50-95 weight% of a metal powder with an average particle diameter of 0.01-100 microns and has a negative potential in acidic solution present a silver; (c) 0-10 weight% of a dispersant; and (d) 0-40 weight% of a fibre or particulate filler or mixture. INDEPENDENTLY CLAIMED are: (1) thermoplastic moulding formed from the film or plate; (2) granulate formed from the thermoplastics moulding; (3) bonded layered film or plate formed comprising the film or plate as covering layer and a substrate layer formed from one or more thermoplastic polymers; (4) Moulding comprising the film or plate or a bonded layered film or plate and a back sprayed, foamed, charged or compressed plastics carrier layer; (5) metallised moulding of the (bonded layered) film or plate and (component (b) containing layer, preferably of copper, chromium, nickel, silver and/or gold; (6) production of the film or plate and bonded layered film or plate by melt mixing and extrusion of the plastics mixture; (7) production of the metallised mouldings involving galvanisation or direct metallisation through vacuum deposition, irradiation/spraying or sputtering.