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    DISPERSION CONTAINING TWO DIFFERENT METALS FOR APPLYING A METAL LAYER
    3.
    发明专利
    DISPERSION CONTAINING TWO DIFFERENT METALS FOR APPLYING A METAL LAYER 未知

    公开(公告)号：CA2625013A1

    公开(公告)日：2007-03-15

    申请号：CA2625013

    申请日：2006-08-31

    Applicant: BASF AG

    Inventor： SOBOTKA BETTINA ,  WAGNER NORBERT ,  SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN

    IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    5.
    发明专利
    未知

    公开(公告)号：DE102005043242A1

    公开(公告)日：2007-03-15

    申请号：DE102005043242

    申请日：2005-09-09

    Applicant: BASF AG

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: C08J7/04 ,  C09D5/38 ,  C09D5/23 ,  C09D5/32 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    The film or plate, which can be metalized as an electromagnetic radiation shield, comprises a plastics mixture of thermoplastics and metal powder together with dispersant and filling materials
    7.
    发明专利
    The film or plate, which can be metalized as an electromagnetic radiation shield, comprises a plastics mixture of thermoplastics and metal powder together with dispersant and filling materials 未知

    公开(公告)号：DE102005019923A1

    公开(公告)日：2006-11-02

    申请号：DE102005019923

    申请日：2005-04-27

    Applicant: BASF AG

    Inventor： NIESNER NORBERT ,  SOBOTKA BETTINA ,  PFISTER JUERGEN ,  SCHEIBITZ MATTHIAS ,  WAGNER NORBERT ,  LOCHTMAN RENE ,  SCHNEIDER NORBERT ,  WARZELHAN VOLKER ,  LIPPERT GERALD

    IPC: C08J5/18 ,  B29D7/01 ,  B32B15/08 ,  B32B27/08 ,  C08J3/12 ,  C08K3/08 ,  C08K7/02 ,  C08K7/16 ,  C08L101/12 ,  H01Q17/00

    Abstract: The film or plate, which can be metalized, is a plastics mixture of four components. The tensile stretch of the thermoplastic polymer component is greater than the mixture including the metal powder, dispersant and filling components by a factor of 1.1-100.0. The tensile strength of the thermoplastic polymer component is stronger than the mixture by a factor of 0.5-4.0. The film or board is metalised by deposition in one or more layers. The plastics mixture (based on 100 weight%) comprises: (a) 5-50 weight% of a thermoplastics polymer; (b) 50-95 weight% of a metal powder with an average particle diameter of 0.01-100 microns and has a negative potential in acidic solution present a silver; (c) 0-10 weight% of a dispersant; and (d) 0-40 weight% of a fibre or particulate filler or mixture. INDEPENDENTLY CLAIMED are: (1) thermoplastic moulding formed from the film or plate; (2) granulate formed from the thermoplastics moulding; (3) bonded layered film or plate formed comprising the film or plate as covering layer and a substrate layer formed from one or more thermoplastic polymers; (4) Moulding comprising the film or plate or a bonded layered film or plate and a back sprayed, foamed, charged or compressed plastics carrier layer; (5) metallised moulding of the (bonded layered) film or plate and (component (b) containing layer, preferably of copper, chromium, nickel, silver and/or gold; (6) production of the film or plate and bonded layered film or plate by melt mixing and extrusion of the plastics mixture; (7) production of the metallised mouldings involving galvanisation or direct metallisation through vacuum deposition, irradiation/spraying or sputtering.

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