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    22.
    发明专利
    未知

    公开(公告)号：BRPI0710662A2

    公开(公告)日：2011-08-16

    申请号：BRPI0710662

    申请日：2007-04-05

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES ON A CARRIER
    25.
    发明专利
    METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES ON A CARRIER 未知

    公开(公告)号：CA2654797A1

    公开(公告)日：2007-12-21

    申请号：CA2654797

    申请日：2007-06-11

    Applicant: BASF SE

    Inventor： PFISTER JURGEN ,  WAGNER NORBERT ,  HENTSCHEL DIETER ,  LOCHTMAN RENE ,  KACZUN JURGEN ,  SCHNEIDER NORBERT

    IPC: H05K3/10 ,  H05K3/24

    Abstract: Method for producing electrically conductive, structured or whole-area su rfaces on a carrier, in which a first step involves applying a structured or whole-area base layer to the carrier with a dispersion containing electrica lly conductive particles in a matrix material, a second step involves at lea st partly curing or drying the matrix material, a third step involves uncove ring the electrically conductive particles by at least partly breaking up th e matrix, and a fourth step involves forming a metal layer on the structured or whole-area base layer by means of electroless or electrolytic coating.

    ELECTROPLATING DEVICE AND METHOD
    26.
    发明专利
    ELECTROPLATING DEVICE AND METHOD 未知

    公开(公告)号：CA2647969A1

    公开(公告)日：2007-10-25

    申请号：CA2647969

    申请日：2007-04-05

    Applicant: BASF SE

    Inventor： WAGNER NORBERT ,  PFISTER JUERGEN ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  POHL GERT ,  LOCHTMAN RENE

    IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    Dispersion containing two different metals for applying a metal layer
    27.
    发明专利
    Dispersion containing two different metals for applying a metal layer 未知

    公开(公告)号：AU2006289126A1

    公开(公告)日：2007-03-15

    申请号：AU2006289126

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： WAGNER NORBERT ,  SOBOTKA BETTINA ,  PFISTER JURGEN ,  MAAS HEIKO ,  LOCHTMAN RENE ,  SCHNEIDER NORBERT ,  LIPPERT GERALD

    IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

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