NICHT-WÄSSRIGE ANTIDRÖHNMASSE MIT NICHT-PULVERFÖRMIGEM POLYACRYLATBINDEMITTEL UND RADIKALISCH POLYMERISIERBARER VERBINDUNG
    24.
    发明公开
    NICHT-WÄSSRIGE ANTIDRÖHNMASSE MIT NICHT-PULVERFÖRMIGEM POLYACRYLATBINDEMITTEL UND RADIKALISCH POLYMERISIERBARER VERBINDUNG 有权
    非水性ANTIDRÖHNMASSE与无粉和聚丙烯酸酯自由基聚合CONNECTION

    公开(公告)号:EP3137558A1

    公开(公告)日:2017-03-08

    申请号:EP15717866.6

    申请日:2015-04-17

    Applicant: BASF SE

    Abstract: The invention relates to a non-aqueous sound-deadening composition, comprising (a) a non-pulverulent polyacrylate binder having a K value in the range of 10 to 35, measured as a 1% solution in tetrahydrofuran; (b) inorganic fillers; and a free-radically polymerizable compound which comprises at least one free-radically polymerizable C-C double bond and has a boiling point at normal pressure of greater than 160°C. The invention also relates to a method for damping vibrations or oscillations in vehicle and machine components using the sound-deadening composition according to the invention.

    Abstract translation: 下面给出的非水声deadener组合物,包含(a)具有在从10至35的范围内,测量为在四氢呋喃中的1%浓度的溶液的K值一个非粉状聚丙烯酸酯粘合剂; (B)无机填料; 和具有至少一个可自由基聚合的C-C双键和具有在大于160℃如此描述的常压沸点的能自由基聚合的化合物是用于阻尼车辆和机器的部件的振荡或振动的方法,使用 声音deadener发明组合物。

    SCHMELZKLEBSTOFF, ENTHALTEND STRAHLUNGSVERNETZBARES POLY(METH)ACRYLAT UND OLIGO(METH)ACRYLAT MIT NICHT-ACRYLISCHEN C-C-DOPPELBINDUNGEN
    26.
    发明公开
    SCHMELZKLEBSTOFF, ENTHALTEND STRAHLUNGSVERNETZBARES POLY(METH)ACRYLAT UND OLIGO(METH)ACRYLAT MIT NICHT-ACRYLISCHEN C-C-DOPPELBINDUNGEN 有权
    熔胶含可辐射固化的聚(甲基)丙烯酸酯和寡(甲基)丙烯酸酯非丙烯酸C-C双键

    公开(公告)号:EP2718385A1

    公开(公告)日:2014-04-16

    申请号:EP12725456.3

    申请日:2012-06-05

    Applicant: BASF SE

    CPC classification number: C09J133/10 C08L2312/06

    Abstract: The invention relates to a radiation cross-linkable hot-melt adhesive, containing at least one poly(meth)acrylate, which can be radiation cross-linked and which is formed from C1 to C10 alkyl(meth)acrylates to at least 60 wt%, and at least one oligo(meth)acrylate, which contains non-acrylic C-C double bonds and has a K value of less than or equal to 20. The hot-melt adhesive contains a photoinitiator, which can be present as an additive not bonded to the poly(meth)acrylate and/or not bonded to the oligo(meth)acrylate, can be polymerized into the poly(meth)acrylate, and/or can be bonded to the oligo(meth)acrylate. The hot-melt adhesive can be used to produce adhesive tapes.

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