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    BUMPER BRACKET, VEHICLE BODY FRONT END ASSEMBLY, AND VEHICLE
    21.
    发明公开
    BUMPER BRACKET, VEHICLE BODY FRONT END ASSEMBLY, AND VEHICLE 审中-公开

    公开(公告)号：EP4516597A1

    公开(公告)日：2025-03-05

    申请号：EP23795041.5

    申请日：2023-04-13

    Applicant: BYD Company Limited

    Inventor： LIN, Yongrui ,  SUN, Bo ,  LIANG, Zhiguang ,  CHEN, Liang ,  ZHU, Chao

    IPC: B60R19/26

    Abstract: A bumper bracket (2). The bumper bracket is provided with a mounting hole (22) and a weakened portion (21). The mounting hole is used for achieving connection between the bumper bracket and a vehicle body module (3). In the front-to-rear direction of a vehicle, the weakened portion is arranged in front of the mounting hole, the projection of the mounting hole in the front-to-rear direction of the vehicle and the projection of the weakened portion in the front-to-rear direction of the vehicle at least partially overlap, and the structural strength of the weakened portion is less than the structural strength of the bumper bracket.

    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF
    23.
    发明公开
    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF 审中-公开

    公开(公告)号：EP3481165A1

    公开(公告)日：2019-05-08

    申请号：EP17819128.4

    申请日：2017-06-19

    Applicant: BYD Company Limited

    Inventor： SUN, Jian ,  CHEN, Liang ,  ZHAO, Guiwang ,  ZHU, Shuai ,  JIANG, Xiangrong

    IPC: H05K5/02

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a substrate (1), and then successively performing injection molding and etching.

    ELECTRONIC PRODUCT METAL HOUSING FORMED WITH ANTENNA GROOVE AND MANUFACTURING METHOD THEREFOR
    25.
    发明公开
    ELECTRONIC PRODUCT METAL HOUSING FORMED WITH ANTENNA GROOVE AND MANUFACTURING METHOD THEREFOR 审中-公开
    由天线槽形成的电子产品金属外壳及其制造方法

    公开(公告)号：EP3240377A1

    公开(公告)日：2017-11-01

    申请号：EP15871766.0

    申请日：2015-10-23

    Applicant: BYD Company Limited

    Inventor： JIANG, Baorong ,  LIAO, Chongchong ,  LI, Aihua ,  CHEN, Liang

    IPC: H05K5/04

    CPC classification number: H05K5/04 ,  C23F1/28 ,  C25D11/022 ,  H01Q1/243 ,  H04M1/0202 ,  H04M1/026 ,  H04M1/0283 ,  H05K3/067

    Abstract: The present disclosure provides an electronic product metal shell with an antenna groove and a method of manufacturing the same. The electronic product metal shell includes a metal layer and a hard anodic oxidation layer; the hard anodic oxidation layer is coated on surface of the metal layer; a step is formed on a first surface of the electronic product metal shell; the step penetrates through the hard anodic oxidation layer coated on a first surface of the metal layer and part of the metal layer in a thickness direction of the electronic product metal shell; the antenna groove is disposed within the step and penetrates through residual part of the metal layer in the thickness direction so as to expose an inner side of the hard anodic oxidation layer coated on a second surface of the metal layer; and a non-conductive material is filled in the antenna groove.

    Abstract translation: 本发明提供一种具有天线槽的电子产品金属外壳及其制造方法。 电子产品金属壳体包括金属层和硬质阳极氧化层， 硬质阳极氧化层被涂覆在金属层的表面上; 所述电子产品金属壳的第一表面形成台阶， 该台阶穿过金属层的第一表面和电子产品金属壳体的厚度方向上的部分金属层上所覆盖的硬质阳极氧化层; 所述天线槽设置在所述台阶内，并沿所述厚度方向穿过所述金属层的剩余部分，以暴露涂覆在所述金属层的第二表面上的所述硬质阳极氧化层的内侧; 并在天线槽中填充非导电材料。

    LAMINATED GLASS AND PREPARATION METHOD THEREFOR, HOUSING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
    27.
    发明公开
    LAMINATED GLASS AND PREPARATION METHOD THEREFOR, HOUSING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3868729A1

    公开(公告)日：2021-08-25

    申请号：EP19873991.4

    申请日：2019-05-16

    Applicant: BYD Company Limited

    Inventor： WANG, Haixia ,  MA, Lan ,  CHEN, Liang ,  SHI, Liliang

    IPC: C03C27/12

    Abstract: Provided is laminated glass and a preparation method thereof, an electronic device housing, and an electronic device. The laminated glass comprises at least two glass members and at least one adhesive film disposed in a stacked manner, where the glass members and the adhesive film are alternately disposed, wherein decorative layers are provided on surfaces of at least two of the glass members facing toward the adhesive film, and at least two of the decorative layers independently comprise at least one of an etched texture, an optical coating layer, and a pattern layer.

    GLASS COMPOSITE, HOUSING, DISPLAY APPARATUS, AND TERMINAL DEVICE
    28.
    发明公开
    GLASS COMPOSITE, HOUSING, DISPLAY APPARATUS, AND TERMINAL DEVICE 审中-公开

    公开(公告)号：EP3831783A1

    公开(公告)日：2021-06-09

    申请号：EP18928767.5

    申请日：2018-11-30

    Applicant: BYD Company Limited

    Inventor： MA, Lan ,  CHEN, Liang

    IPC: C03B23/00

    Abstract: The present invention provides a casing, a preparation method thereof, a display device and a terminal device. The method for preparing the casing comprises: activating at least part of the surface of a first glass member and at least part of the surface of a second glass member by an acidness activation solution to form an activated surface; and contacting the activated surface of the first glass member with the activated surface of the second glass member, so that the first glass member and the second glass member are compounded together to obtain the casing.

    METAL RESIN COMPLEX AND PREPARATION METHOD AND USE OF SAME
    29.
    发明公开
    METAL RESIN COMPLEX AND PREPARATION METHOD AND USE OF SAME 审中-公开

    公开(公告)号：EP3527346A1

    公开(公告)日：2019-08-21

    申请号：EP17860354.4

    申请日：2017-09-22

    Applicant: BYD Company Limited

    Inventor： WU, Yingyuan ,  ZHANG, Guoqiang ,  ZHAO, Guiwang ,  SUN, Jian ,  CHEN, Liang

    IPC: B29C45/14 ,  B29C69/00 ,  B29L31/34

    Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position opposite to the upper surface slit, and the upper surface slit is communicated with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

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