公开(公告)号：US11178756B2

公开(公告)日：2021-11-16

申请号：US17160483

申请日：2021-01-28

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.

公开(公告)号：US10580729B2

公开(公告)日：2020-03-03

申请号：US15952814

申请日：2018-04-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chin-Tang Hsieh ,  Chun-Te Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.

公开(公告)号：US20190252298A1

公开(公告)日：2019-08-15

申请号：US15952814

申请日：2018-04-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chin-Tang Hsieh ,  Chun-Te Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.

公开(公告)号：US20190214357A1

公开(公告)日：2019-07-11

申请号：US15952807

申请日：2018-04-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Ming-Sheng Liu

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/11005 ,  H01L2224/1181 ,  H01L2224/11831 ,  H01L2224/13006 ,  H01L2224/13144

Abstract: A method for manufacturing a semiconductor device includes an extra etching process. A bump or a UBM layer is etched additionally in the extra etching process after forming the semiconductor device such that the semiconductor device can conform to the standard of performance and appearance.

公开(公告)号：US09177830B1

公开(公告)日：2015-11-03

申请号：US14529246

申请日：2014-10-31

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Fei-Jain Wu ,  Tsang-Sheng Liao ,  Ching-Yi Huang ,  Chun-Te Lee

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/03912 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11848 ,  H01L2224/13005 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/35 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2924/206

Abstract: A manufacturing method of a substrate with a bump structure, a copper layer is formed on a semiconductor substrate, and a nickel layer is formed on the copper layer. A bump structure is composed of the copper layer and the nickel layer, wherein the hardness of the bump structure after annealing process depends on the thickness of the nickel layer to meet the user's demand. The hardness of the bump structure meets the user's demand prevents a glass substrate from cracking when the substrate with the bump structure is bonded with the glass substrate.

Abstract translation: 具有凸块结构的基板的制造方法，在半导体基板上形成铜层，在铜层上形成镍层。 凸点结构由铜层和镍层组成，其中退火处理后的凸块结构的硬度取决于镍层的厚度以满足用户的需求。 凸块结构的硬度满足用户的要求，当具有凸块结构的基板与玻璃基板结合时，防止玻璃基板破裂。