公开(公告)号：US20160250735A1

公开(公告)日：2016-09-01

申请号：US15150279

申请日：2016-05-09

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: B24B37/20 ,  B24B37/005

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16 ,  B24B49/18 ,  B24B49/183

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract translation: 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

公开(公告)号：US20160176011A1

公开(公告)日：2016-06-23

申请号：US15058710

申请日：2016-03-02

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Tetsuji TOGAWA ,  Shingo TOGASHI ,  Tomoshi INOUE

IPC: B24B37/20

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/32 ,  B24B49/10 ,  B24B49/12

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

Abstract translation: 抛光方法用于将半导体晶片等基板研磨成平面镜面。 通过研磨装置研磨基板的方法包括具有研磨面的研磨台（100），用于保持基板并将基板压靠在研磨面上的顶环（1），以及可升降机构 沿垂直方向移动顶环（1）。 在将衬底压靠在抛光表面之前，将顶环（1）移动到第一高度，然后在衬底被压靠在抛光表面上之后将顶环（1）移动到第二高度。

公开(公告)号：US20150000056A1

公开(公告)日：2015-01-01

申请号：US14315283

申请日：2014-06-25

Applicant: EBARA CORPORATION

Inventor： Tetsuji TOGAWA ,  Kenya ITO ,  Yu ISHII ,  Keisuke UCHIYAMA

IPC: B08B1/00

CPC classification number: B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

Abstract translation: 公开了一种能够检测由流体支撑的诸如晶片的基板是否适当地存在于预定处理位置中的基板处理装置。 衬底处理装置包括至少一个距离传感器，其构造成测量洗涤器和静水支撑结构之间的距离; 以及处理控制器，被配置为从所述距离的测量值计算所述静液压支撑结构和所述基板的表面之间的间隙，并且确定所述间隙是否落在预定范围内。

公开(公告)号：US20140357164A1

公开(公告)日：2014-12-04

申请号：US14464130

申请日：2014-08-20

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: B24B37/32 ,  B24B37/10

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract translation: 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

公开(公告)号：US20140220866A1

公开(公告)日：2014-08-07

申请号：US14167934

申请日：2014-01-29

Applicant: EBARA CORPORATION

Inventor： Yu ISHII ,  Kenya ITO ,  Masayuki NAKANISHI ,  Tetsuji TOGAWA

IPC: B24B7/22

CPC classification number: B24B7/228 ,  B24B21/004 ,  B24B21/06 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30

Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

Abstract translation: 提供了能够以高去除速度从基板的整个背面除去异物的研磨方法。 抛光方法包括将抛光工具放置在与基板的背面的外周区域滑动接触的同时保持基板的背面的中心侧区域，并且将抛光工具与中心部分滑动接触， 同时保持基板的斜面部分以整体抛光背面。