公开(公告)号：US20150298280A1

公开(公告)日：2015-10-22

申请号：US14745863

申请日：2015-06-22

Applicant: EBARA CORPORATION

Inventor： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI

IPC: B24B21/00 ,  B24B21/20 ,  H01L21/68 ,  H01L21/306 ,  H01L21/67 ,  H01L21/84 ,  B24B9/06 ,  H01L21/66

CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B21/20 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/84 ,  H01L22/20

Abstract: The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

Abstract translation: 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括：抛光头，其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件，配置成将抛光带供给到抛光头并将抛光带从 抛光头，构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。

公开(公告)号：US20140087627A1

公开(公告)日：2014-03-27

申请号：US14034488

申请日：2013-09-23

Applicant: EBARA CORPORATION

Inventor： Tetsuji TOGAWA ,  Masaya SEKI ,  Hiroyuki TAKENAKA

IPC: B24B37/005 ,  B24B9/06

CPC classification number: B24B37/005 ,  B24B9/065 ,  B24B21/002

Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.

Abstract translation: 提供了检测基板的研磨异常的方法。 该方法包括：旋转衬底; 将抛光工具压靠在基板的边缘部分上以抛光边缘部分; 测量所述抛光工具相对于所述衬底的表面的位置; 从抛光工具的位置确定衬底的抛光量; 从所述基板的抛光量计算抛光速率; 并且如果抛光速率在预定范围之外，则判断出已经发生了基板边缘部分的抛光异常。

公开(公告)号：US20230173636A1

公开(公告)日：2023-06-08

申请号：US18161707

申请日：2023-01-30

Applicant: EBARA CORPORATION

Inventor： Tetsuji TOGAWA ,  Hiroshi SOBUKAWA ,  Masahiro HATAKEYAMA

IPC: B24B37/013 ,  B24B37/16

CPC classification number: B24B37/013 ,  B24B37/16

Abstract: To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

公开(公告)号：US20190240801A1

公开(公告)日：2019-08-08

申请号：US16386681

申请日：2019-04-17

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Tetsuji TOGAWA ,  Shingo TOGASHI ,  Tomoshi INOUE

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/34 ,  B24B37/04 ,  B24B49/12 ,  B24B49/10 ,  B24B37/32 ,  B24B37/30

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/30 ,  B24B37/32 ,  B24B37/34 ,  B24B37/345 ,  B24B49/10 ,  B24B49/12

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

公开(公告)号：US20140213155A1

公开(公告)日：2014-07-31

申请号：US14167898

申请日：2014-01-29

Applicant: EBARA CORPORATION

Inventor： Tetsuji TOGAWA ,  Atsushi YOSHIDA ,  Toshifumi WATANABE

IPC: B24B9/06 ,  B24B21/00 ,  H01L21/463

CPC classification number: B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/008 ,  B24B21/06 ,  B24B27/0076 ,  H01L21/02035 ,  H01L21/463

Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

Abstract translation: 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

公开(公告)号：US20140094095A1

公开(公告)日：2014-04-03

申请号：US14034468

申请日：2013-09-23

Applicant: EBARA CORPORATION

Inventor： Tetsuji TOGAWA ,  Atsushi YOSHIDA ,  Michiyoshi YAMASHITA

IPC: B24B9/06

CPC classification number: B24B9/065 ,  B24B9/102 ,  B24B21/00 ,  B24B21/002 ,  B24B21/20

Abstract: A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.

Abstract translation: 抛光方法包括旋转基板，执行第一抛光工艺，其通过按压部件将研磨带压靠在基板的边缘部分，抛光带的一部分沿着基板的径向向内突出， 抛光基板的边缘部分并沿着加压部件弯曲抛光带的一部分，并且进行第二抛光处理，该抛光工艺通过按压部件沿着基板的径向向内按压研磨带的弯曲部分， 进一步抛光衬底的边缘部分。

公开(公告)号：US20150151398A1

公开(公告)日：2015-06-04

申请号：US14618426

申请日：2015-02-10

Applicant: EBARA CORPORATION

Inventor： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI ,  Naoki MATSUDA ,  Atsushi YOSHIDA

IPC: B24B21/00 ,  B24B21/20

CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract translation: 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

公开(公告)号：US20150104999A1

公开(公告)日：2015-04-16

申请号：US14510033

申请日：2014-10-08

Applicant: EBARA CORPORATION

Inventor： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI ,  Kenya ITO

IPC: B24B37/34 ,  B24B37/30 ,  B24B37/10

CPC classification number: B24B37/345 ,  B24B37/005 ,  B24B37/10 ,  B24B37/30 ,  B24B49/12

Abstract: A substrate processing apparatus capable of accurately aligning a center of a substrate, such as a wafer, with an axis of a substrate stage and capable of processing the substrate without bending the substrate is disclosed. The substrate processing apparatus includes a first substrate stage having a first substrate-holding surface configured to hold a first region in a lower surface of the substrate, a second substrate stage having a second substrate-holding surface configured to hold a second region in the lower surface of the substrate, a stage elevator configured to move the first substrate-holding surface between an elevated position higher than the second substrate-holding surface and a lowered position lower than the second substrate-holding surface, and an aligner configured to measure an amount of eccentricity of a center of the substrate from the axis of the second substrate stage and align the center of the substrate with the axis of the second substrate stage.

Abstract translation: 公开了一种基板处理装置，其能够将诸如晶片的基板的中心与基板台的轴准确对准，并且能够在不弯曲基板的情况下处理基板。 基板处理装置包括：第一基板台，其具有被配置为保持基板的下表面中的第一区域的第一基板保持表面;第二基板台，其具有构造成将第二区域保持在下部的第二基板保持表面 基板的表面，配置为使第一基板保持表面在高于第二基板保持表面的升高位置和低于第二基板保持表面的降低位置之间移动的台式升降机;以及对准器，其被配置为测量量 从第二衬底台的轴线偏心衬底，并将衬底的中心与第二衬底台的轴对准。

公开(公告)号：US20130237033A1

公开(公告)日：2013-09-12

申请号：US13868500

申请日：2013-04-23

Applicant: EBARA CORPORATION

Inventor： Masayuki NAKANISHI ,  Tetsuji TOGAWA ,  Kenya ITO ,  Masaya SEKI ,  Kenji IWADE ,  Takeo KUBOTA

IPC: H01L21/02

CPC classification number: H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

Abstract translation: 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

公开(公告)号：US20230302604A1

公开(公告)日：2023-09-28

申请号：US18297469

申请日：2023-04-07

Applicant: Ebara Corporation

Inventor： Tetsuji TOGAWA ,  Kenichi KOBAYASHI

IPC: B24B37/04 ,  B24B57/02

CPC classification number: B24B37/042 ,  B24B57/02 ,  H01L21/30625

Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.