Abstract:
PROBLEM TO BE SOLVED: To reduce difference in propagation speed caused by a transition direction of a signal in a signal transmission circuit. SOLUTION: The signal transmission circuit includes: an inverter which includes transistors 41, 42 connected in series between power supply lines 21 and 22; a source transistor 32 which is provided between the power supply line 22 and the transistor 42 and is put into a state of conductivity based on control signals; and a load transistor 51 which is used as a load circuit provided between the power supply line 21 and the transistor 41. According to this invention, since difference between a load between the power supply line 22 and the transistor 42 and a load between the power supply line 21 and the transistor 41 is reduced, difference between signal propagation speed when an input signal to be supplied to the inverter transitions from a low level to a high level and signal propagation speed when the input signal transitions from the high level to the low level is reduced. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a memory system in which deterioration of signal quality caused by signal reflection by mismatching of wiring impedance of a data bus is lightened, and which can perform read-out and write-in of data at high speed, in a memory system in which memory devices such as a DRAM or the like are branched for a data bus. SOLUTION: This system is memory device connected to a data bus, the memory device is provided with an active terminal circuit terminal-controlling this memory device and a control circuit controlling electrically this active terminal circuit to an active state or an inactive state, in it. Further, this memory system has a plurality of memory devices, while has a memory controller performing terminal control of the plurality of memory devices. In this case, also the memory controller is provided with the terminal circuit made an active state or an inactive state. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a memory system, capable of achieving reduction of the number of clock signal lines and simultaneously preventing decrease in timing margins on the signal receiving side. SOLUTION: A memory controller 20 generates an internal clock signal for receiving a DQ signal, based on continuous inversion signals and a reference clock signal by receiving the continuous inversion signals from a DRAM 30 2 as pseudo-clock signals. Next, the memory controller 20 counts the number of clocks of the internal clock for receiving, after an OUT 1 command has been issued to the DRAM 30 2 until reception of a high-level data signal from the DRAM 30 2 as a DQ data signal and holds the counted number as the number of delayed clocks. Thus, the memory controller 20 can receive read data by the internal clock signal for reception, when the number of delayed clocks elapses after a read command has been issued in the case of receiving the read data (DQ signal). COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To perform data transfer between hierarchized data lines with low power consumption. SOLUTION: A semiconductor device is equipped with switch transistors 41 and 42 provided between a sub data line LIO and a main data line MIO. In transferring data, a voltage of VPP level is supplied to gate electrodes of the switch transistors 41 and 42 when these transistors are brought into conduction, and a voltage of VPERI level is supplied to the gate electrodes when these transistors are brought into nonconduction. Since the voltage of the gate electrodes is not lowered to a voltage of VSS level when the switch transistors 41 and 42 are brought into nonconduction, a charge and discharge current of a gate capacitance is reduced. Since the voltage of VPP level is supplied when the switch transistors 41 and 42 are brought into conduction, a voltage level after data transfer does not decrease by a threshold voltage. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an output circuit of a semiconductor memory device capable of suppressing a leak current in standby and also reducing current consumption in operation. SOLUTION: The output circuit includes an inverter INV (1), in which a PMOS transistor Q11 and a NMOS transistor Q21 are connected in series, and read-out data OUTHB from a memory cell is logic-reversed to output a gate signal of a PMOS transistor 51 for output. In the standby, a PMOS transistor Q81 is turned on, a power source VDD (1.8 V) is selected as a circuit power source of the inverter INV (1), and a gate level of the PMOS transistor Q51 for output is set to the VDD level. In the operation, an NMOS transistor Q71 is turned on, a power source VDDQ (1.2 V) is selected, and a gate level of the PMOS transistor Q51 is set to a VDDQ level. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a memory system by which a high-speed operation between a memory controller and a memory module can be achieved. SOLUTION: In the memory system comprising the memory controller and a memory module mounted with DRAMs, a buffer is mounted on the memory module, the buffer and the memory controller are connected to each other via data wiring, command/address wiring, and clock wiring, the DRAMs and the buffer on the memory module are connected to each other via internal data wiring, internal command/address wiring, and clock wiring. The data wiring, the command/address wiring, and the clock wiring may be connected to buffers of other memory modules and to cascade. Between the DRAMs and the buffer on the memory module, high-speed data transmission is implemented using data phase signals synchronous with clocks. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve a problem wherein, with transmission/reception timing of a data signal and that of a clock/address signal different from each other depending on the difference between topologies in a memory system, the topology of clock/command address wiring is different from that of data wiring in relation to a memory system having a structure with a plurality of DRAMs arranged in each of a plurality of modules; and each DRAM is connected to a memory controller (MC) by data wiring and clock wiring. SOLUTION: Since the data signal provided via the data wiring and a clock/command address signal provided via the clock wiring/command address wiring are transmitted and received in the DRAMs and the MC at distinct timing, circuits for matching the timing are arranged in the DRAMs and the MC. In addition, after a phase for a clock signal of the data signal is retained, the memory controller periodically generates sampling clocks; and also the phase of the data signal is adjusted according to the sampling clocks after the phase retention in the DRAMs. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a self refresh timer circuit which generates a timer period which is changed relative to temperature continuously and in terms of index function and, which is suitable for usage under a condition that ambient temperature is changed. SOLUTION: The self refresh timer circuit comprises a bias current circuit 11 for supplying a bias current to each part; a temperature dependence voltage source 12 for outputting a voltage to which temperature dependence based on a diode characteristic is granted; a control current generating circuit 13 having a constant current source 13b so as to generate a control current I' which is proportional to a current I flowing by applying the output voltage of the temperature dependence voltage source 12; a current control oscillation circuit 14 for generating the oscillation signal of the period which is inversely proportional to the largeness of the control current I'; and a frequency dividing circuit 15 for dividing the frequency of the oscillation signal and outputting a timer periodic signal. The output voltage level of the temperature dependence voltage source 12 and the largeness of the control current are appropriately adjusted, so as to generate the timer period which meets the temperature characteristic of an information holding time. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To perform an accurate write leveling operation.SOLUTION: A semiconductor device comprises for example: a divider circuit 100 that generates a plurality of frequency-division clock signals PCLK0-n having phases different from each other by frequency-dividing an external clock signal CK; a multiplier circuit 200 that generates an internal clock signal PCLKD by multiplying the plurality of frequency-division clock signals PCLK0-n; an internal data strobe signal generation circuit 400 that generates an internal data strobe signal IDQS by adding the amount of delay of the multiplier circuit 200 to an external data strobe signal DQS; and a skew detection circuit 500 that measures a skew between the internal clock signal PCLKD and the internal data strobe signal IDQS. Thus, the characteristics of the internal data strobe signal generation circuit 400 and the characteristics of the multiplier circuit 200 are substantially matched, thereby allowing an accurate write leveling operation.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor memory device that enables high-speed input-output operation by controlling a maximum value of delay between a memory cell array and an input-output buffer.SOLUTION: A semiconductor memory device comprises: a memory cell array part where multiple memory cell arrays are arranged; a peripheral circuit part where an external input-output circuit is arranged; and an internal bus 4 that connects the multiple memory cell arrays with the peripheral circuit part. The peripheral circuit part comprises: multiple external input-output buffers 23; and multiple bus interface circuits 24 that mutually convert, between them and the memory cell arrays, data for inputting and outputting the internal bus in parallel and data for inputting and outputting the multiple external input-output buffers in series. The multiple bus interface circuits 24 are arranged collectively between the internal bus 4 and the multiple external input-output buffers so that a distance d1 between the multiple bus interface circuits becomes smaller than a distance d2 between the multiple external input-output buffers and also than a maximum value d3 of a wiring width of the internal bus.