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21.
公开(公告)号:DE102006056995B4
公开(公告)日:2018-03-22
申请号:DE102006056995
申请日:2006-11-30
Applicant: GEN ELECTRIC
Inventor: WEI CHING-YEU , HENNESSY WILLIAM ANDREW , ALBAGLI DOUGLAS
IPC: H01L31/10 , H01L27/12 , H01L27/146 , H01L29/786 , H01L31/115
Abstract: Einrichtung: mit einem isolierenden Substrat (210) und mit einem ersten Bereich, der wenigstens eine oder mehrere Metallschichten aufweist, wobei auf der wenigstens einen oder den mehreren Metallschichten (214, 218, 222) eine dielektrische Schicht angeordnet ist, wobei in der dielektrischen Schicht ein oder mehrere Kontaktübergänge (200, 202, 206) ausgebildet sind, um eine Diodenschicht (226) an die wenigstens eine oder mehrere Metallschichten anzuschließen, und mit einem zweiten Bereich, der keinen oder mehrere Kontaktübergänge (204, 304, 700, 702, 704) aufweist, die in der dielektrischen Schicht ausgebildet sind, um die Diodenschicht (226) mit wenigstens dem isolierenden Substrat (210) zu verbinden, wobei wenigstens einige der Kontaktübergänge (204, 304, 700, 702, 704) an einem freien Randbereich keine elektrische Funktion mit dem isolierenden Substrat haben.
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公开(公告)号:DE69836190T2
公开(公告)日:2007-08-23
申请号:DE69836190
申请日:1998-10-06
Applicant: GEN ELECTRIC
Inventor: ALBAGLI DOUGLAS , KWASNICK ROBERT FORREST , POSSIN GEORGE EDWARD
IPC: G01T1/20
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公开(公告)号:DE102006056995A1
公开(公告)日:2007-05-31
申请号:DE102006056995
申请日:2006-11-30
Applicant: GEN ELECTRIC
Inventor: WEI CHING-YEU , HENNESSY WILLIAM ANDREW , ALBAGLI DOUGLAS
IPC: H01L31/10 , H01L29/786
Abstract: A thin film transistor and diode array for an imaging detector comprises a device with a substrate (210) with a region of at least one metal layer (214,218,220) on which is a dielectric layer with at least one contact junction (200,202,204,206) between a diode layer and metal layer. A second section has none or many junctions and is formed in the dielectric layer to connect the diode layer to the substrate.
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公开(公告)号:DE102004048756A1
公开(公告)日:2005-04-21
申请号:DE102004048756
申请日:2004-10-05
Applicant: GEN ELECTRIC
Inventor: ALBAGLI DOUGLAS , SHIANG JOSEPH JOHN , POSSIN GEORGE EDWARD , HENNESY WILLIAM ANDREW
IPC: G01T1/24 , H01L27/14 , G01T1/20 , H01L27/146 , H01L31/09 , H01L31/115 , H04N5/32
Abstract: A solid-state imager with back-side irradiation. The present invention provides a solid-state imager that includes a substantially radiation transparent substrate adapted to receive incident radiation. The radiation travels through the substrate and a pixelated array of photosensitive elements to a scintillator material, which absorbs the radiation. The pixelated array of photosensitive elements receives light photons and measures the amount of light generated by radiation interactions with the scintillator material. With this imager, there is less spreading and blurring and thus a better quality image. In another embodiment, there is a substantially transparent material disposed between the pixelated array of photosensitive elements and the scintillator material. The substantially transparent material absorbs and substantially blocks electrons from entering the active regions of the pixelated array of photosensitive elements. This enables the imager to perform for a longer period of time according to its specifications.
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公开(公告)号:DE10357919A1
公开(公告)日:2004-07-29
申请号:DE10357919
申请日:2003-12-11
Applicant: GEN ELECTRIC
Inventor: POSSIN GEORGE EDWARD , KWASNICK ROBERT FORREST , ALBAGLI DOUGLAS
IPC: H01L21/00 , H01L21/84 , H01L27/14 , H01L27/144 , H01L27/146 , H01L31/0232 , H01L31/10
Abstract: The production of an imaging array comprises forming a first dielectric barrier (66); forming a light block (68) on the first dielectric barrier, where the light block is coextensive with a gate; and forming a second dielectric barrier (70) on the first dielectric barrier and the light block, such that the light block is encapsulated between the first and second dielectric barriers. An Independent claim is also included for a medical imaging system comprising a radiation source; and a radiation detector operationally coupled to the radiation source, and comprising the imaging array.
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公开(公告)号:DE10353197A1
公开(公告)日:2004-06-09
申请号:DE10353197
申请日:2003-11-13
Applicant: GEN ELECTRIC
Inventor: YANOFF BRIAN DAVID , ALBAGLI DOUGLAS
Abstract: A technique for compensating for a retained image includes employing bimodal readout of alternating light and dark images. The bimodal readout technique results from reading either light or dark frames more rapidly, allowing additional time to be allocated to the X-ray exposures occurring prior to the light frames or to the other reading operation. The bimodal readout may be accomplished by a binning procedure by which scan lines are binned and read, typically during dark frame readout. The images acquired from reading the dark frames may then be used to compensate for a retained image artifacts present in the image derived from light frames.
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公开(公告)号:FR2847418A1
公开(公告)日:2004-05-21
申请号:FR0312870
申请日:2003-11-03
Applicant: GEN ELECTRIC
Inventor: YANOFF BRIAN DAVID , ALBAGLI DOUGLAS
Abstract: A technique for compensating for a retained image includes employing bimodal readout of alternating light and dark images. The bimodal readout technique results from reading either light or dark frames more rapidly, allowing additional time to be allocated to the X-ray exposures occurring prior to the light frames or to the other reading operation. The bimodal readout may be accomplished by a binning procedure by which scan lines are binned and read, typically during dark frame readout. The images acquired from reading the dark frames may then be used to compensate for a retained image artifacts present in the image derived from light frames.
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公开(公告)号:DE69632020D1
公开(公告)日:2004-05-06
申请号:DE69632020
申请日:1996-12-17
Applicant: GEN ELECTRIC
Inventor: WEI CHING-YEU , LIU JIANQIANG , SALISBURY ROGER STEPHEN , KWASNICK ROBERT FORREST , POSSIN GEORGE EDWARD , ALBAGLI DOUGLAS
IPC: H01L21/66 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L27/146 , G02F1/13 , H01L21/48 , G02F1/136
Abstract: A method of repairing an open circuit defect in a damaged address line in a thin film electronic imager device includes the steps of forming a repair area (160) on the device so as to expose the open-circuit defect in the damaged address line and then depositing a conductive material (170) to form a second conductive component and to coincidentally form a repair shunt (180) in the repair area so as to electrically bridge the defect. The step of forming the repair area includes the steps of ablating dielectric material disposed over the first conductive component (140) in the repair area, and etching the repair area so as to remove dielectric material (156) disposed over the defect in the address line in the repair area such that the surface of the address line conductive material is exposed but is not contaminated by the removal of the overlying dielectric material. A layer of photoresist is deposited over the imager device prior to forming the repair area, such that the photoresist layer is patterned during the ablating step and serves as a mask during the etch step.
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公开(公告)号:FR2831013A1
公开(公告)日:2003-04-18
申请号:FR0212567
申请日:2002-10-10
Applicant: GEN ELECTRIC
Inventor: ALBAGLI DOUGLAS , YANOFF BRIAN DAVID , TKACZYK JOHN ERIC , POSSIN GEORGE EDWARD , XUE PING
Abstract: In one aspect of the invention a method for processing a fluoroscopic image is provided. The method includes scanning an object with an imaging system including at least one radiation source and at least one detector array, acquiring a plurality of dark images to generate a baseline image, acquiring a plurality of lag images subsequent to the baseline image, determining a plurality of parameters of a power law using at least one lag image and at least one baseline image, and performing a log-log extrapolation of the power law including the determined parameters.
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公开(公告)号:BR0005627A
公开(公告)日:2001-07-03
申请号:BR0005627
申请日:2000-11-29
Applicant: GEN ELECTRIC
Inventor: ALBAGLI DOUGLAS , POSSIN GEORGE EDWARD , HAN SUNG SU , DEJULE MICHAEL CLEMENT
Abstract: A fiber optic scintillator includes (18), for example, a plurality of relatively low-density glass scintillating elements (20) for converting radiation into light and a plurality of relatively high-density glass radiation absorbing elements (40) interspersed among the plurality of scintillating elements (20). The high-density glass radiation absorbing elements (40) increase the x-ray stopping power of the scintillator and also produce electron showers which interact desirably in adjacent scintillating elements (20) to increase the luminance of the scintillator (18). The high-density glass radiation absorbing elements also absorb x-ray cross-talk from absorption of radiation in the scintillating elements (20) and desirably include optical absorbers for absorbing optical cross-talk, both of which improves the resolution of the scintillator (18). The plurality of scintillating elements (20) and high-density glass radiation absorbing elements (40) typically are fibers, and the high-density glass radiation absorbing elements (140) may define cladding around the scintillating low-density glass fibers.
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