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公开(公告)号：CO2018005779A2
公开(公告)日：2018-06-20
申请号：CO2018005779
申请日：2018-06-01
Applicant: GEN ELECTRIC
Inventor： TSAKALAKOS LOUCAS , RUBINSZTAJN SLAWOMIR , GUIDA RENATO , BALASUBRAMANIAM MAHADEVAN NMN , LEE BOON KWEE , RUSH BRIAN MAGANN , AHMAD FAISAL RAZI , MANDAL SUDEEP , SHANKS DAVID SIRDA
Abstract: Un ensamblaje de cable sensor de fluido y un método utilizan cuerpos de conducción que se extienden a lo largo de un cuerpo central alargado para conducir una corriente de calentamiento para calentar el ensamblaje de cable. Los cuerpos de conducción también están configurados para conducir una señal de interrogación y para conducir reflexiones de la señal de interrogación, fibras ópticas se extienden a lo largo de la longitud del cuerpo central e incluyen elementos sensibles a la temperatura en localizaciones diferentes a lo largo de la longitud del cuerpo central. Los elementos sensibles a la temperatura miden flujo térmico fuera del ensamblaje de cable en las localizaciones diferentes después del calentamiento el ensamblaje de cable y comunican el flujo térmico a un sistema de adquisición por computador.
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公开(公告)号：AU2016292371A1
公开(公告)日：2018-02-01
申请号：AU2016292371
申请日：2016-06-27
Applicant: GEN ELECTRIC
Inventor： TAN DANIEL QI , YIN WEIJUN , YIN MING , GASCOYNE DAVID GILLES , RUBINSZTAJN SLAWOMIR , VENKATARAMANI VENKAT SUBRAMANIAM
Abstract: An insulated winding is provided, wherein the insulated winding incudes (a) an electrically conductive core; (b) an electrically insulating non-porous ceramic coating disposed on the conductive core; and (c) a composite silicone coating incuding a plurality of electrically insulating filler particles disposed on the ceramic coating. Further, a method of making an insulated winding is also provided.
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公开(公告)号：CH708439A2
公开(公告)日：2015-02-13
申请号：CH11652014
申请日：2014-07-29
Applicant: GEN ELECTRIC
Inventor： BIYANI PRAMOD KUMAR , LEWIS LARRY NEIL , MIRANDA CARLOS MIGUEL , RUBINSZTAJN SLAWOMIR , SIMPSON STANLEY FRANK
Abstract: Ein thermischer Aktuator (1) ist geschaffen und enthält ein Ausdehnungsmaterial (4), das angeordnet und eingerichtet ist, um ein bewegbares Element (3) gemäss einem Ausdehnungszustand des Ausdehnungsmaterials (4) von einer ersten Position (31) des bewegbaren Elementes (3) zu einer zweiten Position (32) des bewegbaren Elementes zu bewegen. Das Ausdehnungsmaterial (4) enthält eine anorganische Salzmischung.
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公开(公告)号：AU2006240282A1
公开(公告)日：2006-11-02
申请号：AU2006240282
申请日：2006-04-12
Applicant: GEN ELECTRIC
Inventor： RUBINSZTAJN SLAWOMIR , KURJATA JAN , CHOJNOWSKI JULIAN , FORTUNIAK WITOLD
Abstract: The present invention relates to a method of making a Si-H functional siloxane oligomer from the reaction between silicon hydride compounds and cyclic siloxane oligomer in the presence of a Lewis acid that is capable of interacting with the hydrogen of the silicon hydride to promote ring opening of the cyclic siloxane oligomer and the insertion a siloxane oligomer segment between Si and H atom to thereby form the Si-H functional siloxane oligomer.
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公开(公告)号：BRPI0413775A
公开(公告)日：2006-10-31
申请号：BRPI0413775
申请日：2004-09-01
Applicant: GEN ELECTRIC
Inventor： RUBINSZTAJN SLAWOMIR , TONAPI SANDEEP , CAMPBELL JOHN , PRABHAKUMAR ANANTH
Abstract: A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
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Patent Agency Ranking
公开(公告)号：CA2537827A1
公开(公告)日：2005-03-17
申请号：CA2537827
申请日：2004-08-03
Applicant: GEN ELECTRIC
Inventor： PRABHAKUMAR ANANTH , GIBSON DAVID ALEXANDER III , CAMPBELL JOHN ROBERT , TONAPI SANDEEP , RUBINSZTAJN SLAWOMIR , MILLS RYAN CHRISTOPHER
Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modifie d resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
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公开(公告)号：CA2537688A1
公开(公告)日：2005-03-10
申请号：CA2537688
申请日：2004-09-01
Applicant: GEN ELECTRIC
Inventor： TONAPI SANDEEP , RUBINSZTAJN SLAWOMIR , CAMPBELL JOHN , PRABHAKUMAR ANANTH
Abstract: A no-flow underfill composition comprising an epoxy resin in combination wit h epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about I nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curin g agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
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公开(公告)号：AU2004266209A1
公开(公告)日：2005-03-03
申请号：AU2004266209
申请日：2004-08-06
Applicant: GEN ELECTRIC
Inventor： WOO WING KEUNG , SCHATTENMANN FLORIAN JOHANNES , CAMPBELL JOHN ROBERT , TONAPI SANDEEP SHRIKANT , RUBINSZTAJN SLAWOMIR , PRABHAKUMAR ANANTH
Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.
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公开(公告)号：CA2515749A1
公开(公告)日：2004-08-26
申请号：CA2515749
申请日：2004-02-05
Applicant: GEN ELECTRIC
Inventor： SOSNOWSKI STANISLAW , SLOMKOWSKI STANISLAW , GRISWOLD ROY MELVIN , ECKBERG RICHARD PAUL , KOWALEWSKA ANNA , RUBINSZTAJN SLAWOMIR
Abstract: The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates.
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公开(公告)号：DE60009851D1
公开(公告)日：2004-05-19
申请号：DE60009851
申请日：2000-12-08
Applicant: GEN ELECTRIC
Inventor： RUBINSZTAJN SLAWOMIR , LAPINSKI MELANIA I
IPC: C09D183/04 , C09D183/06 , C09D183/07 , C08K5/5419 , C08K5/5425
Abstract: A curable release coating composition is provided, comprising (a) a cationically curable functionalized polyorganosiloxane; (b) a photoinitiator; and (c) an adhesion promoter having the following formula (1): wherein R to R and R to R are independently alkyl, alkoxy, aryl, aryloxy or alkenyl hydrocarbon or halohydrocarbon groups having from 1 to 20 carbon atoms, R and R are independently alkyl, aryl, or alkenyl hydrocarbon or halohydrocarbon groups having from 1 to 20 carbon atoms, and R is an alkyl, aryl, or alkenyl hydrocarbon or halohydrocarbon group having from 1 to 20 carbon atoms. Cured release coatings from theses compositions exhibit less rub off than other coatings, particularly on plastic substrates.
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