Abstract:
A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.
Abstract:
The present invention relates to a method of making a Si-H functional siloxane oligomer from the reaction between silicon hydride compounds and cyclic siloxane oligomer in the presence of a Lewis acid that is capable of interacting with the hydrogen of the silicon hydride to promote ring opening of the cyclic siloxane oligomer and the insertion a siloxane oligomer segment between Si and H atom to thereby form the Si-H functional siloxane oligomer.
Abstract:
A process for the production of linear Silanol stopped siloxanes comprising: a) conducting a ring opening polymerization of a hexaorganocyclotrisiloxane having the formula: D3 = (R R SiO)3 where R and R are independently selected from the group of one to forty carbon atom monovalent radicals, in a solvent comprising a mixture of water and a volatile polar aprotic organic solvent in the presence of catalytic amounts of a strong base; b) neutralizing the catalytic amount of the strong base with a partially neutralized salt of a polybasic acid wherein the pH ranges from about 6 to about 8; and c) washing with water.
Abstract:
A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen- containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
Abstract:
The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.
Abstract:
PROBLEM TO BE SOLVED: To obtain a curable silicone elastomer composition which can give a cured product reduced in compression set by adding a salt of a cationic organonitrogen compound to a silicone composition suited for the production of a rollable rubber or pumpable liquid injection-moldable composition. SOLUTION: Desirably this composition contains (1) an alkenylorganopolysiloxane and (2) a hydrogen-containing silicon compound selected from the group consisting of hydrogen-containing silanes and hydrogen- containing organopolysiloxanes. The salt of the cationic organonitrogen compound is desirably, for example, a cation of a cycloaliphatic nitrogen-containing heterocyclic ring having the formula: (CH2-e Qe )f NRN g H2-g [wherein e is 0, 1, or 2; Q is a 1-40 monovalent organic group; f is an integer of 4 or greater; RN is a 1-40C monovalent organic group; and g is 0, 1, or 2].
Abstract:
PROBLEM TO BE SOLVED: To obtain a silicone elastomer which can give a cured product reduced in compression set by adding a salt of a cationic organonitrogen compound to a silicone composition suited for the production of a liquid injection-moldable composition. SOLUTION: This composition contains the following four components: (1) a silicone elastomer, (2) a salt of a cationic organonitrogen compound, (3) bis(trimethoxysilylpropyl) fumarate, and (4) a silanol-terminated polymer represented by the formula (wherein RA , RA , RA , and RA are each independently a 1-40C monovalent organic group; RA is a 2-40C monovalent olefinic organic group; y' is 0 to about 50; x' is 0 or 1 to about 100; and the alkenyl content ranges from 0 in the case of y'=0 to about 25 wt.%, in the case of y'>0). When this composition is bonded to a substrate comprising a thermosetting polymer or a thermoplastic polymer, components (3) and (4) function as an adhesion promoter system.
Abstract:
PROBLEM TO BE SOLVED: To obtain a silicone elastomer composition which can give a cured product reduced in compression set by adding a salt of a cationic organonitrogen compound to a silicone composition suited for the production of a rollable rubber or pumpable liquid injection-moldable composition. SOLUTION: Desirably, the curable silicone elastomer used in the curable silicone elastomer composition contains a hydrogen-containing silicon compound selected from the group consisting of (1) alkenylorganopolysiloxanes and (2) hydrogen-containing silanes and hydrogen-containing organopolysiloxanes. The salt of the cationic organonitrogen compound is desirably, for example, a nitrogen compound containing a monovalent cation having the following formula: RN a RN b RN c RN d N (wherein RN is selected from the group consisting of hydrogen and 1-40C monovalent organic groups; RN to RN are each independently selected from the group consisting of 1-40C monovalent organic groups; a is 0-3; b, c, and d are each independently 0-4; and the sum of a to d is always 4).
Abstract:
PROBLEM TO BE SOLVED: To obtain a silicone composition having improved noncorrosiveness to copper alloys by mixing a polyalkoxyl-terminated polydiorganosiloxane with a silica filler, a tin condensation/curing catalyst, a silicone functionalized with 1-silaazacyclopentane, etc. SOLUTION: This composition is obtained by mixing 100 pts.wt. polyalkoxyl- terminated polydiorganosiloxane of formula I with 5-40 pts.wt. reinforcing fumed or pyrocysis silica filler, 0-40 pts.wt. triorganosilyl-terminated polydiorganisiloxane of formula II, 0-5 pts.wt. polyalkoxysilane crosslinking agent of formula II, 0-2 pts.wt. cyano-functional silane of formula IV, 0.25 pts.wt. MDT silanol fluid comprising 1-80 mol.% monoorganosiloxy units of formula V, 0.5-50 mol.% triorganosiloxy units of formula VI, 1-80 mol.% diorganosiloxy units of formula VII, etc., 0.1-1.0 pt.wt. tin condensation/curing catalyst, and 2.5-10 pts.wt. monovalent 1-silaazacyclopentane-functionalized silicone of formula VIII.