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    3.
    发明专利
    未知

    公开(公告)号：AT394791T

    公开(公告)日：2008-05-15

    申请号：AT04780151

    申请日：2004-08-05

    Applicant: GEN ELECTRIC

    Inventor： TONAPI SANDEEP ,  ZHONG HONG ,  SIMONE DAVIDE LOUIS ,  FILLION RAYMOND

    IPC: H01L23/42 ,  C09K5/14 ,  H01L21/56 ,  H01L23/373

    Abstract: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

    4.
    发明专利
    未知

    公开(公告)号：BRPI0413775A

    公开(公告)日：2006-10-31

    申请号：BRPI0413775

    申请日：2004-09-01

    Applicant: GEN ELECTRIC

    Inventor： RUBINSZTAJN SLAWOMIR ,  TONAPI SANDEEP ,  CAMPBELL JOHN ,  PRABHAKUMAR ANANTH

    IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29

    Abstract: A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

    NO-FLOW UNDERFILL MATERIAL HAVING LOW COEFFICIENT OF THERMALEXPANSION AND GOOD SOLDER BALL FLUXING PERFORMANCE
    6.
    发明专利
    NO-FLOW UNDERFILL MATERIAL HAVING LOW COEFFICIENT OF THERMALEXPANSION AND GOOD SOLDER BALL FLUXING PERFORMANCE 未知

    公开(公告)号：CA2537688A1

    公开(公告)日：2005-03-10

    申请号：CA2537688

    申请日：2004-09-01

    Applicant: GEN ELECTRIC

    Inventor： TONAPI SANDEEP ,  RUBINSZTAJN SLAWOMIR ,  CAMPBELL JOHN ,  PRABHAKUMAR ANANTH

    IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29

    Abstract: A no-flow underfill composition comprising an epoxy resin in combination wit h epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about I nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curin g agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

    No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
    10.
    发明专利
    No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance 未知

    公开(公告)号：AU2004268147A1

    公开(公告)日：2005-03-10

    申请号：AU2004268147

    申请日：2004-09-01

    Applicant: GEN ELECTRIC

    Inventor： RUBINSZTAJN SLAWOMIR ,  TONAPI SANDEEP ,  PRABHAKUMAR ANANTH ,  CAMPBELL JOHN

    IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29

    Abstract: A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

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