公开(公告)号：US10813253B2

公开(公告)日：2020-10-20

申请号：US15834636

申请日：2017-12-07

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: H05K7/20

Abstract: Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.

公开(公告)号：US20200093033A1

公开(公告)日：2020-03-19

申请号：US16132679

申请日：2018-09-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey Lunsman ,  John Franz ,  Benjamin Kufahl ,  Matthew Slaby

IPC: H05K7/20 ,  G01M3/28

Abstract: A leak mitigation system for a cooling system may include an isolation valve, a controller, and a computer-readable medium. The isolation valve may selectively isolate an expansion tank from a closed loop containing a coolant circulated by a primary pump having a pump inlet. The expansion tank may maintain the coolant at a predetermined pressure at the pump inlet in the closed loop. The controller may communicate with the primary pump and the isolation valve. The computer-readable storage medium may include instructions executable by the controller to: in response to a detection of a leak of the coolant from the closed loop, shut down the primary pump; and close the isolation valve to isolate the expansion tank from the closed loop.

公开(公告)号：US10582645B1

公开(公告)日：2020-03-03

申请号：US16145625

申请日：2018-09-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Benjamin Kufahl ,  Harvey Lunsman ,  Michael Scott

IPC: H05K7/20 ,  F28D15/02 ,  H05K1/02

Abstract: A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.

公开(公告)号：US10582640B2

公开(公告)日：2020-03-03

申请号：US15974798

申请日：2018-05-09

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Harvey Lunsman ,  Ernesto Ferrer Medina ,  John Franz

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  G06F1/20

Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.

公开(公告)号：US10561040B1

公开(公告)日：2020-02-11

申请号：US16154710

申请日：2018-10-08

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey Lunsman ,  Tahir Cader ,  Michael Scott

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.

公开(公告)号：US20190239387A1

公开(公告)日：2019-08-01

申请号：US15883230

申请日：2018-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  F28F2250/08 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20281

Abstract: Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.