ACCUMULATOR FOR A CHASSIS-LEVEL COOLING SYSTEM

    公开(公告)号:US20250159840A1

    公开(公告)日:2025-05-15

    申请号:US19019687

    申请日:2025-01-14

    Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.

    COOL FLUID RESERVOIR FOR A COOLANT DISTRIBUTION UNIT

    公开(公告)号:US20230320031A1

    公开(公告)日:2023-10-05

    申请号:US17708240

    申请日:2022-03-30

    CPC classification number: H05K7/20272 H05K7/20781 H05K7/20836

    Abstract: Example implementations relate to a cool fluid reservoir for managing loss of cool fluid in a coolant distribution unit (CDU). The cool fluid reservoir includes a cylinder which has an internal volume defined between an inlet and outlet, and a hollow piston that is slidably connected to the cylinder via one of the inlet or outlet to split the internal volume into a first volume portion filled with the cool fluid and a second volume portion filled with driver fluid. The first volume portion is fluidically connected to a closed fluid loop of the CDU via the hollow piston and other one of the inlet or outlet. The hollow piston is slidably driven by the driver fluid to reduce the first volume portion and inject a portion of the cool fluid from the first volume portion into the closed fluid loop based on an operating pressure of the cool fluid.

    Pumps with pre-charged fluid
    3.
    发明授权

    公开(公告)号:US10893630B2

    公开(公告)日:2021-01-12

    申请号:US15883230

    申请日:2018-01-30

    Abstract: Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.

    Chassis cooling
    4.
    发明授权

    公开(公告)号:US10813253B2

    公开(公告)日:2020-10-20

    申请号:US15834636

    申请日:2017-12-07

    Abstract: Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.

    Cooling apparatus for electronic components

    公开(公告)号:US10582645B1

    公开(公告)日:2020-03-03

    申请号:US16145625

    申请日:2018-09-28

    Abstract: A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.

    Flexible gasket seal for direct liquid cooling of electronic devices

    公开(公告)号:US10561040B1

    公开(公告)日:2020-02-11

    申请号:US16154710

    申请日:2018-10-08

    Abstract: Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.

    HOST ELECTRONIC DEVICE HAVING A MOVABLE COOLING COMPONENT FOR REMOVABLE ELECTRONIC DEVICE

    公开(公告)号:US20230034486A1

    公开(公告)日:2023-02-02

    申请号:US17388412

    申请日:2021-07-29

    Inventor: Michael Scott

    Abstract: Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

    Host electronic device having a movable cooling component for removable electronic device

    公开(公告)号:US11481009B1

    公开(公告)日:2022-10-25

    申请号:US17237529

    申请日:2021-04-22

    Inventor: Michael Scott

    Abstract: Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.

    Valved connector
    10.
    发明授权

    公开(公告)号:US10941892B2

    公开(公告)日:2021-03-09

    申请号:US15789741

    申请日:2017-10-20

    Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.

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