公开(公告)号：GB1286560A

公开(公告)日：1972-08-23

申请号：GB5962970

申请日：1970-12-22

Applicant: IBM

Inventor： BAKOS PETER

IPC: C08L7/00 ,  C08J3/02 ,  C08L21/00 ,  C08L21/02 ,  C08L33/00 ,  C08L33/02 ,  C23F1/02 ,  G03F7/038 ,  G03F7/16 ,  H01L21/00 ,  H01L21/027 ,  H01L23/29 ,  H05K3/00

Abstract: 1286560 Photosensitive compositions INTERNATIONAL BUSINESS MACHINES CORP 22 Dec 1970 [23 Dec 1969] 59629/70 Heading C3P [Also in Divisions C7 and G2] A photosensitive composition comprises an emulsion of an organic solution of a polychloroprene, a photosensitizer, a stabilizer and a polymeric binder and an aqueous solution of a wetting agent, N-methyl-2-pyrrolidene and a plasticizer. The composition may be electrophoretically deposited on an electrically conductive support and then image-wise exposed and developed to produce a resist on the support which may subsequently be etched. The polychloroprene and photosensitizer may be as disclosed in Specification 1,147,272, the stabilizer may be hydroquinone, the polymeric binder may be an epoxy resin, polyvinylcinnanate, polystyrene or an acrylic resin and the plasticizer may be triethanolamine or diallylisophthalate.

公开(公告)号：GB1277862A

公开(公告)日：1972-06-14

申请号：GB5475470

申请日：1970-11-18

Applicant: IBM

Inventor： BAKOS PETER ,  KNIGHT DIANA JEAN

IPC: G03F7/42

Abstract: 1277862 Resist stripping composition INTERNATIONAL BUSINESS MACHINES CORP 18 Nov 1970 [23 Dec 1969] 54754/70 Heading C5D A composition for removing photosensitive resist material from a substrate used in microelectronic circuitry comprises a mixture of a first solution of an amine in a halogenated hydrocarbon and a second solution of an organic acid in a polar organic solvent. The amine may be monoethanolamine, diethanolamine or triethanolamine. The acid may be trichloroacetic, picric or maleic acid. The halogenated hydrocarbon may be methylene chloride, trichloroethane or tetrachloroethylene. The polar solvent may be cyclohexanone, acetone, methylisobutyl ketone, dimethylsulphoxide or N-methyl-2- pyrrolidone.

公开(公告)号：IT1165392B

公开(公告)日：1987-04-22

申请号：IT2773979

申请日：1979-11-30

Applicant: IBM

Inventor： BAKOS PETER

IPC: C04B41/84 ,  C04B41/50 ,  C04B41/87 ,  H01L21/48 ,  H01L

Abstract: The porosity and surface roughness of ceramic substrates are improved by coating the surface with silicon compounds, drying the coated substrate, and then subjecting the substrate to elevated temperature so as to convert the silicon compounds to silicon oxides. Coated substrates obtained by the above process as well as specific preferred organosilane compositions are provided.

公开(公告)号：DE3169284D1

公开(公告)日：1985-04-18

申请号：DE3169284

申请日：1981-10-27

Applicant: IBM

Inventor： ANGELO RAYMOND WILLIAM ,  BAKOS PETER

IPC: C09K13/06 ,  C23F1/26 ,  H01L21/308 ,  H01L21/3213 ,  C23F1/00 ,  G03F7/26

公开(公告)号：CA1108355A

公开(公告)日：1981-09-08

申请号：CA337940

申请日：1979-10-18

Applicant: IBM

Inventor： BAKOS PETER

IPC: C04B41/84 ,  C04B41/50 ,  C04B41/87 ,  H01L21/48 ,  C09D3/00 ,  H01L21/461 ,  H01L27/00

Abstract: The porosity and surface roughness of ceramic substrates are improved by coating the surface with silicon compounds, drying the coated substrate, and then subjecting the substrate to elevated temperature so as to convert the silicon compounds to silicon oxides. Coated substrates obtained by the above process as well as specific preferred organisilane compositions are provided. EN978011

公开(公告)号：CA1085984A

公开(公告)日：1980-09-16

申请号：CA267528

申请日：1976-12-09

Applicant: IBM

Inventor： BAKOS PETER ,  MEMIS IRVING ,  RASILE JOHN

IPC: H05K5/00 ,  C09D4/00 ,  H01L21/312 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K5/06 ,  C09D3/74 ,  B05D3/02

Abstract: HERMETIC POLYMERIC TOPSEALANT COATING FOR ELECTRONIC CIRCUITRY A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer.

公开(公告)号：CA984236A

公开(公告)日：1976-02-24

申请号：CA148258

申请日：1972-07-31

Applicant: IBM

Inventor： BAKOS PETER

IPC: H05K3/18 ,  C04B41/88 ,  C23C18/18 ,  C23C18/30 ,  H01L21/288

公开(公告)号：DE2232276A1

公开(公告)日：1973-02-22

申请号：DE2232276

申请日：1972-06-30

Applicant: IBM

Inventor： BAKOS PETER

IPC: H05K3/18 ,  C04B41/88 ,  C23C18/18 ,  C23C18/30 ,  H01L21/288 ,  C23C3/00

公开(公告)号：CA864473A

公开(公告)日：1971-02-23

申请号：CA864473D

Applicant: IBM

Inventor： BAKOS PETER ,  KOZAK GARY S

公开(公告)号：DE1597608A1

公开(公告)日：1970-05-21

申请号：DE1597608

申请日：1967-10-06

Applicant: IBM

Inventor： BAKOS PETER ,  STEVENS KOZAK GARY

IPC: G03F7/031 ,  G03F7/038