公开(公告)号：FR2325078A1

公开(公告)日：1977-04-15

申请号：FR7623636

申请日：1976-07-27

Applicant: IBM

Inventor： BAKOS PETER ,  RASILE JOHN

IPC: G03C1/72 ,  G03F7/022 ,  G03F7/039 ,  G03C1/52

Abstract: A positive photoresist having increased sensitivity to light and formed by the addition of an acidic compound to a 1,2-quinone-diazide sulphonic acid ester sensitizer.

公开(公告)号：CA1078071A

公开(公告)日：1980-05-20

申请号：CA287346

申请日：1977-09-23

Applicant: IBM

Inventor： GEDNEY RONALD W ,  RASILE JOHN

IPC: H01L23/12 ,  H01L23/08 ,  H01L23/498 ,  H01R12/55 ,  H05K7/10 ,  H05K1/14

Abstract: IMPROVED INTEGRATED CIRCUIT PACKAGE A prepunched copper/dielectric laminate ground plane is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection between the ground plane and the circuit connection pins is achieved by welding or soldering of bonding elements between selected pins, which also provides mechanical attachment of the ground plane to the substrate.

公开(公告)号：FR2335574A1

公开(公告)日：1977-07-15

申请号：FR7632457

申请日：1976-10-18

Applicant: IBM

Inventor： BAKOS PETER ,  MEMIS IRVING ,  RASILE JOHN

IPC: C09D4/00 ,  H01L21/312 ,  H05K5/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K5/06 ,  C09D3/82 ,  H01B3/46

Abstract: A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer.

公开(公告)号：DE2752438A1

公开(公告)日：1978-06-15

申请号：DE2752438

申请日：1977-11-24

Applicant: IBM

Inventor： GEDNEY RONALD WALKER ,  RASILE JOHN

IPC: H01L23/12 ,  H01L23/08 ,  H01L23/498 ,  H01R12/55 ,  H05K7/10 ,  H01L21/50

公开(公告)号：DE2656139A1

公开(公告)日：1977-06-23

申请号：DE2656139

申请日：1976-12-10

Applicant: IBM

Inventor： BAKOS PETER ,  MEMIS IRVING ,  RASILE JOHN

IPC: H05K5/00 ,  C09D4/00 ,  H01L21/312 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K5/06

Abstract: A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer.

公开(公告)号：DE3363036D1

公开(公告)日：1986-05-22

申请号：DE3363036

申请日：1983-06-01

Applicant: IBM

Inventor： HUME DAVID WILLIAM ,  RASILE JOHN

IPC: H05K3/00 ,  H05K3/02 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/46

公开(公告)号：CA1085984A

公开(公告)日：1980-09-16

申请号：CA267528

申请日：1976-12-09

Applicant: IBM

Inventor： BAKOS PETER ,  MEMIS IRVING ,  RASILE JOHN

IPC: H05K5/00 ,  C09D4/00 ,  H01L21/312 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K5/06 ,  C09D3/74 ,  B05D3/02

Abstract: HERMETIC POLYMERIC TOPSEALANT COATING FOR ELECTRONIC CIRCUITRY A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer.

公开(公告)号：FR2373944A1

公开(公告)日：1978-07-07

申请号：FR7731857

申请日：1977-10-14

Applicant: IBM

Inventor： GEDNEY RONALD W ,  RASILE JOHN

IPC: H01L23/12 ,  H01L23/08 ,  H01L23/498 ,  H01R12/55 ,  H05K7/10 ,  H05K1/18 ,  H01L23/28