公开(公告)号：DE10321403A1

公开(公告)日：2003-12-04

申请号：DE10321403

申请日：2003-05-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING ,  UHLMANN RUEDIGER

IPC: H01L23/00 ,  H01L23/544 ,  H05K1/02 ,  H05K3/00 ,  H05K3/22 ,  H05K3/24 ,  G07C3/14 ,  G06K1/12

Abstract: A fine ball grid array component (1) has a system carrier (SC) (2) supporting strip conductors (3) that link contact surfaces (4) on the SC with a connector block (5). A lasting, non-removable bad unit marking (6) distinguished from the surrounding area by its color is used for marking bad units/parts on the SC.

公开(公告)号：DE10133361C2

公开(公告)日：2003-05-28

申请号：DE10133361

申请日：2001-07-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING ,  BISCHOF ANDREAS

IPC: H01L21/58 ,  H01L23/16 ,  H01L23/31

Abstract: The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.