公开(公告)号：WO03007364A3

公开(公告)日：2003-07-24

申请号：PCT/EP0207439

申请日：2002-07-04

Applicant: INFINEON TECHNOLOGIES AG ,  BISCHOF ANDREAS ,  KAHLISCH KNUT ,  MIETH HENNING

Inventor： BISCHOF ANDREAS ,  KAHLISCH KNUT ,  MIETH HENNING

IPC: H01L21/58 ,  H01L23/16 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L24/83 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/00

Abstract: The inventive method is based on the idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.

Abstract translation: 本发明的方法是基于这样的半导体芯片（2）和所述载体基片（1）之间的机械连接（4）设置在包装的完成再次解决的考虑。 用于生产半导体芯片和载体基板之间的电接触所需的机械连接从而仅发生暂时的。 因此，一个关键的接口被移除从而在热机械应力一个显著减少导致在包中。

公开(公告)号：DE10133361C2

公开(公告)日：2003-05-28

申请号：DE10133361

申请日：2001-07-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING ,  BISCHOF ANDREAS

IPC: H01L21/58 ,  H01L23/16 ,  H01L23/31

Abstract: The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.

公开(公告)号：DE10125362A1

公开(公告)日：2002-06-20

申请号：DE10125362

申请日：2001-05-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BISCHOF ANDREAS

IPC: H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H01R13/24 ,  H05K3/32

Abstract: On the topside of a modular printed circuit board (PCB) (1) there are contacts/footprints (2) to make a conductive connection with corresponding contacts/underside footprints (3) for a ball grid array or chip size package component (4) waiting to be mounted by a conductive transition piece (CTP) (5) that uses adhesive connections to connect to the PCB and the component. The CTP is first glued as a mask to the PCB and to part of the contacts there. An Independent claim is also included for a carrier like a printed circuit board with an electronic component fitted on it and the component's contacts making conductive contact with contacts on the carrier.

公开(公告)号：DE10133361A1

公开(公告)日：2003-01-30

申请号：DE10133361

申请日：2001-07-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING ,  BISCHOF ANDREAS

IPC: H01L21/58 ,  H01L23/16 ,  H01L23/31

Abstract: The inventive method is based on the idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.

公开(公告)号：DE10107149A1

公开(公告)日：2002-09-12

申请号：DE10107149

申请日：2001-02-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BISCHOF ANDREAS

IPC: H01L21/268 ,  H01L21/301 ,  H01L29/06 ,  H01L21/324 ,  H01L21/48

Abstract: The method involves providing a wafer with a number of preprocessed semiconductor chips (1), and dividing up the preprocessed chips by separating them along the chip edges. The chip edges are smoothened by local thermal melting of the chip edges, e.g. while the inner region is cooled. The chips may be divided by sawing.