公开(公告)号：EP3238166A4

公开(公告)日：2018-06-27

申请号：EP15873885

申请日：2015-10-12

Applicant: INTEL CORP

Inventor： COWLEY NICHOLAS P ,  SARASWAT RUCHIR ,  PERRY COLIN L ,  AITKEN MATTHEW T ,  GOLDMAN RICHARD J ,  KAN CHI MAN

IPC: G06Q50/12 ,  G06F19/00 ,  G06Q50/22 ,  G08B3/10 ,  G08B5/36 ,  G08B21/02 ,  H04W84/18

CPC classification number: G08B21/02 ,  G06Q50/12 ,  G06Q50/22 ,  G08B3/10 ,  G08B5/36

Abstract: A method monitors the consumption of materials, including determining the presence of materials in a smart receptacle using a sensor located in the smart receptacle. A server is alerted when an actionable item is detected.

公开(公告)号：EP3192045A4

公开(公告)日：2018-02-21

申请号：EP15839814

申请日：2015-07-22

Applicant: INTEL CORP

Inventor： COWLEY NICHOLAS P ,  SARASWAT RUCHIR ,  GOLDMAN RICHARD J ,  KAN CHI MAN ,  AITKEN MATTHEW T ,  PERRY COLIN L

IPC: G06Q30/00 ,  A47G21/02 ,  G01K13/00 ,  G06Q50/12

CPC classification number: G01K13/00 ,  A47G21/02 ,  A47G2021/008 ,  A47G2200/186 ,  G01C19/00 ,  G01K2207/08 ,  G06Q30/016 ,  G06Q50/12

Abstract: Embodiments described herein relate generally to monitoring a dining session using smart smallwares. A smart smallware may sense usage or non-usage associated with a dining session of a customer. Based on the sensed non-usage of the smart smallware, the smart smallware may detect a period of inactivity. In response to the detected period of inactivity, the smart smallware may transmit an indication of the detected period of inactivity. This transmitted indication may cause an external monitoring device to notify a waitperson that a customer associated with that smart smallware may require attention. Other embodiments may be described and/or claimed.

公开(公告)号：EP3178100A4

公开(公告)日：2018-01-24

申请号：EP14899125

申请日：2014-08-07

Applicant: INTEL CORP

Inventor： GOLDMAN RICHARD J ,  SARASWAT RUCHIR ,  ZILLMANN UWE ,  COWLEY NICHOLAS P

IPC: H01F17/00 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L23/645 ,  H01F17/0006 ,  H01F27/2804 ,  H01F41/041 ,  H01F2017/002 ,  H01L28/10

Abstract: Described is an apparatus which comprises: a substrate; a plurality of holes formed as vias (e.g., through-silicon-vias (TSVs)) in the substrate; and a metal loop formed in a metal layer positioned above the plurality of holes such that a plane of the metal loop is orthogonal to the plurality of holes.

公开(公告)号：EP2957035A4

公开(公告)日：2017-02-22

申请号：EP14751395

申请日：2014-02-18

Applicant: INTEL CORP

Inventor： COWLEY NICHOLAS P ,  MUTHUKARUPPAN RAMNARAYANAN

IPC: H03K19/177 ,  G01R31/26 ,  G11C11/417

CPC classification number: H03K19/173 ,  G11C17/18

公开(公告)号：EP2943997A4

公开(公告)日：2016-11-16

申请号：EP14737516

申请日：2014-01-09

Applicant: INTEL CORP

Inventor： SARASWAT RUCHIR ,  COWLEY NICHOLAS P ,  ZILLMANN UWE

IPC: H01Q13/08 ,  H01L23/522 ,  H01L23/66 ,  H01Q1/38

CPC classification number: H01L21/486 ,  H01L23/481 ,  H01L23/522 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/66 ,  H01L2924/0002 ,  H01Q1/2283 ,  H01Q21/065 ,  H01L2924/00