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    PACKAGE FOR AN OPTICAL RADIATION DEVICE
    24.
    发明公开
    PACKAGE FOR AN OPTICAL RADIATION DEVICE 审中-公开

    公开(公告)号：US20240288363A1

    公开(公告)日：2024-08-29

    申请号：US18582173

    申请日：2024-02-20

    Applicant: Infineon Technologies AG

    Inventor： Christoph Glacer ,  Ulrich Krumbein ,  Tobias Mittereder ,  Mark Pavier ,  Siyuan Qi ,  Hugh Richard ,  David Tumpold ,  Paul Westmarland

    IPC: G01N21/3504

    CPC classification number: G01N21/3504

    Abstract: A package for an optical radiation device comprises a base structure having arranged thereon an optical radiation device, an optically transparent lid element bonded to the base structure defining a cavity between the base structure and the lid element, and a bond structure in a bonding region between the base structure and the lid element, wherein the bond structure is arranged to provide an adhesive bond between the base structure and the lid element, and wherein the bond structure comprises a diffusion layer having a gas diffusive material or gas diffusive structure for providing a gas diffusion path between the cavity and the surrounding atmosphere.

    Thermoresistive Micro Sensor Device
    26.
    发明公开
    Thermoresistive Micro Sensor Device 审中-公开

    公开(公告)号：US20230160732A1

    公开(公告)日：2023-05-25

    申请号：US18065394

    申请日：2022-12-13

    Applicant: Infineon Technologies AG

    Inventor： Martin Seidl ,  Christian Bretthauer ,  Wolfgang Klein ,  Ulrich Krumbein ,  David Tumpold

    IPC: G01F1/688 ,  G01F1/86

    CPC classification number: G01F1/6888 ,  G01F1/86

    Abstract: A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.

    Radiation source and gas sensor using the radiation source
    28.
    发明授权
    Radiation source and gas sensor using the radiation source 有权

    公开(公告)号：US11561168B2

    公开(公告)日：2023-01-24

    申请号：US17122490

    申请日：2020-12-15

    Applicant: Infineon Technologies AG

    Inventor： David Tumpold ,  Christoph Glacer ,  Steffen Kubacki

    IPC: G01N21/3504

    Abstract: A radiation source for obliquely launching a narrowband electromagnetic radiation into a cavity, comprises an emitter structure having a main radiation emission region for emitting the narrowband electromagnetic radiation, wherein the emitter structure is optically coupled to the cavity, and a layer element coupled to the main radiation emission region of the emitter structure, wherein the layer element comprises a radiation deflection structure configured for deflecting the radiation emission characteristic of the emitter structure with respect to the surface normal of the main radiation emission region of the emitter structure.

    System and method for a reference chamber with a housing and a deflectable structure
    29.
    发明授权
    System and method for a reference chamber with a housing and a deflectable structure 有权

    公开(公告)号：US11549917B2

    公开(公告)日：2023-01-10

    申请号：US16053177

    申请日：2018-08-02

    Applicant: Infineon Technologies AG

    Inventor： David Tumpold ,  Alfons Dehe

    IPC: G01N29/24 ,  G01N29/30 ,  G01N29/44 ,  G01N29/036

    Abstract: A reference chamber for a fluid sensor comprises a housing, a deflectable structure, which is arranged movably within the housing, a control device configured to drive the deflectable structure at a first point in time such that the deflectable structure assumes a defined position, and to drive the deflectable structure at a second point in time such that the deflectable structure moves out of the defined position and a movement of the deflectable structure in the housing is obtained. The reference chamber comprises an evaluation device configured to determine a movement characteristic of the movement of the deflectable structure on the basis of the moving into the defined position or on the basis of the moving out of the defined position and to determine an atmospheric property in the housing on the basis of the movement characteristic.

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