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公开(公告)号：USD756349S1
公开(公告)日：2016-05-17
申请号：US29513077
申请日：2014-12-26
Applicant: Intel Corporation
Designer： Min Suet Lim , Bok Eng Cheah , Howe Yin Loo , Jackson Chung Peng Kong , Poh Tat Oh
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公开(公告)号：US20160132077A1
公开(公告)日：2016-05-12
申请号：US14996568
申请日：2016-01-15
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Jackon Chung Peng Kong , Poh Tat Oh
CPC classification number: E05D3/06 , E05D11/0081 , G06F1/1615 , G06F1/1616 , G06F1/1618 , G06F1/1662 , G06F1/1677 , G06F1/1681 , G06F1/3218 , G06F1/3265 , H05K5/0226 , Y02D10/153 , Y10T16/522 , Y10T16/533 , Y10T16/5475
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.
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公开(公告)号：US20160130849A1
公开(公告)日：2016-05-12
申请号：US14998225
申请日：2015-12-24
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Jackon Chung Peng Kong , Poh Tat Oh
CPC classification number: E05D3/06 , E05D11/0081 , G06F1/1615 , G06F1/1616 , G06F1/1618 , G06F1/1662 , G06F1/1677 , G06F1/1681 , G06F1/3218 , G06F1/3265 , H05K5/0226 , Y02D10/153 , Y10T16/522 , Y10T16/533 , Y10T16/5475
Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.
Abstract translation: 个人计算设备设置有第一壳体部分，第二壳体部分和将第一壳体部分连接到第二壳体部分的铰链。 铰链被构造成允许第一壳体部分相对于第二壳体部分大致旋转三百六十度。 铰链可以实现为多个互连的平行铰链段，每个铰链段围绕铰链的多个平行轴线中的相应一个旋转，以使第一壳体部分能够旋转。
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公开(公告)号：US12061502B2
公开(公告)日：2024-08-13
申请号：US17368851
申请日：2021-07-07
Applicant: Intel Corporation
Inventor： Jeff Ku , Tin Poay Chuah , Howe Yin Loo , Chin Kung Goh , Yew San Lim , Cora Shih Wei Nien
CPC classification number: G06F1/203 , G06F1/1616
Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.
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公开(公告)号：US11639623B2
公开(公告)日：2023-05-02
申请号：US16859452
申请日：2020-04-27
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Jackson Chung Peng Kong , Poh Tat Oh
IPC: E05D3/06 , G06F1/16 , G06F1/3218 , G06F1/3234 , E05D11/00 , H05K5/02
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.
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Patent Agency Ranking
公开(公告)号：US10943792B2
公开(公告)日：2021-03-09
申请号：US16325665
申请日：2016-09-27
Applicant: Intel Corporation , Bok Eng Cheah , Min Suet Lim , Jackson Chung Peng Kong , Howe Yin Loo
Inventor： Bok Eng Cheah , Min Suet Lim , Jackson Chung Peng Kong , Howe Yin Loo
IPC: H01L25/00 , H01L21/48 , H01L23/48 , H01L23/538 , H01L23/552 , H01L25/065 , H01L29/06 , H01L23/00 , H01L25/18
Abstract: A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated.
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公开(公告)号：US20190093402A1
公开(公告)日：2019-03-28
申请号：US16012469
申请日：2018-06-19
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Jackson Chung Peng Kong , Poh Tat Oh
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.
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公开(公告)号：US10041282B2
公开(公告)日：2018-08-07
申请号：US14998225
申请日：2015-12-24
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Chung Peng Jackson Kong , Poh Tat Oh
Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.
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29.发明申请公开(公告)号：US20180175002A1
公开(公告)日：2018-06-21
申请号：US15380669
申请日：2016-12-15
Applicant: Intel Corporation
Inventor： Howe Yin Loo , Eng Huat Goh , Min Suet Lim , Bok Eng Cheah , Jackson Chung Peng Kong , Khang Choong Yong
IPC: H01L25/065 , H01L25/00
CPC classification number: H01L25/0657 , H01L25/0652 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652
Abstract: A system-in-package apparatus includes a package substrate configured to carry at least one semiconductive device on a die side and a package bottom interposer disposed on the package substrate on a land side. A land side board mates with the package bottom interposer, and enough vertical space is created by the package bottom interposer to allow space for at least one device disposed on the package substrate on the land side.
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公开(公告)号：US10000954B2
公开(公告)日：2018-06-19
申请号：US14998225
申请日：2015-12-24
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Chung Peng Jackson Kong , Poh Tat Oh
Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.
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