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公开(公告)号：MY139074A
公开(公告)日：2009-08-28
申请号：MYPI20042576
申请日：2004-06-29
Applicant: KAO CORP
Inventor： FUJII SHIGEO , KITAYAMA HIROAKI
Abstract: A POLISHING COMPOSITION CONTAINING AN -ALUMINA, AN INTERMEDIATE ALUMINA, AN OXIDIZING AGENT AND WATER; A METHOD FOR REDUCING WAVINESS OF A SUBSTRATE TO BE POLISHED, INCLUDING THE STEP OF APPLYING THE POLISHING COMPOSITION TO THE SUBSTRATE TO BE POLISHED; AND A METHOD FOR MANUFACTURING A SUBSTRATE, INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH THE POLISHING COMPOSITION. THE POLISHING COMPOSITION IS SUITABLE FOR POLISHING SUBSTRATES FOR PRECISION PARTS SUCH AS SUBSTRATES FOR MAGNETIC RECORDING MEDIA FOR MAGNETIC DISCS, OPTICAL DISCS, OPTO-MAGNETIC DISCS, AND THE LIKE; PHOTOMASK SUBSTRATES; GLASS FOR LIQUID CRYSTALS; OPTICAL LENSES; OPTICAL MIRRORS; OPTICAL PRISMS; AND SEMICONDUCTOR SUBSTRATES.
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公开(公告)号：MY137247A
公开(公告)日：2009-01-30
申请号：MYPI20034986
申请日：2003-12-24
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO
Abstract: A MICROWAVINESS REDUCING AGENT FOR POLISHING A SUBSTRATE FOR A PRECISION PART, CONTAINING EITHER A SURFACTANT HAVING TWO OR MORE IONIC HYDROPHILIC GROUPS, OR A POLYCARBOXYLIC ACID COMPOUND HAVING 2 TO 15 TOTAL CARBON ATOMS AND HAVING EITHER OH GROUP OR GROUPS OR SH GROUP OR GROUPS, OR A SALT THEREOF; A POLISHING COMPOSITION FOR A SUBSTRATE FOR A PRECISION PART, CONTAINING THE MICROWAVINESS REDUCING AGENT, AN ABRASIVE AND WATER; A POLISHING COMPOSITION COMPRISING WATER, AN ABRASIVE, AN ORGANIC ACID OR A SALT THEREOF, AND A SURFACTANT, WHEREIN THE ORGANIC ACID IS A POLYCARBOXYLIC ACID COMPOUND HAVING 2 TO 15 TOTAL CARBON ATOMS AND HAVING EITHER OH GROUP OR GROUPS OR SH GROUP OR GROUPS, AND WHEREIN THE SURFACTANT HAS TWO OR MORE IONIC HYDROPHILIC GROUPS IN ITS MOLECULE AND HAS A MOLECULAR WEIGHT OF 300 OR MORE; A METHOD OF REDUCING MICROWAVINESS OF A SUBSTRATE FOR A PRECISION PART; AND A METHOD FOR MANUFACTURING A SUBSTRATE FOR A PRECISION PART.
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公开(公告)号：MY135930A
公开(公告)日：2008-07-31
申请号：MYPI20032841
申请日：2003-07-29
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO , HAGIHARA TOSHIYA
Abstract: A POLISHING COMPOSITION COMPRISING 0.03 TO 0.5% BY WEIGHT OF AN ORGANIC ACID OR A SALT THEREOF, AN ABRASIVE AND WATER, WHEREIN THE ABRASIVE HAS A SURFACE POTENTIAL OF FROM -140 TO 200 MV; A ROLL-OFF REDUCING AGENT COMPRISING AN INORGANIC COMPOUND HAVING A PROPERTY OF CONTROLLING A SURFACE POTENTIAL OF AN ABRASIVE IN A POLISHING COMPOSITION, WHEREIN A SURFACE POTENTIAL OF THE ABRASIVE IN A STANDARD POLISHING COMPOSITION IS CONTROLLED TO -110 TO 250 MV BY THE PRESENCE OF THE INORGANIC COMPOUND, WHEREIN THE STANDARD POLISHING COMPOSITION IS PREPARED WHICH COMPRISES 20 PARTS BY WEIGHT OF AN ABRASIVE, THE ABRASIVE BEING HIGH-PURITY ALUMINA HAVING AL2O3 PURITY OF 98.0% BY WEIGHT OR MORE COMPOSED OF α-TYPE CO-RANDOM CRYSTAL, 1 PART BY WEIGHT OF CITRIC ACID, 78 PARTS BY WEIGHT OF WATER AND 1 PART BY WEIGHT OF AN INORGANIC COMPOUND. THE POLISHING COMPOSITION OR THE ROLL-OFF REDUCING AGENT COMPOSITION CAN BE FAVORABLY USED IN POLISHING THE SUBSTRATE FOR PRECISION PARTS.
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公开(公告)号：MY128246A
公开(公告)日：2007-01-31
申请号：MYPI20034003
申请日：2003-10-21
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , FUJII SHIGEO
Abstract: A POLISHING COMPOSITION COMPRISING AN ABRASIVE, AN ACID AND/OR SALT THEREOF, AND WATER, WHEREIN COPPER (CU) IS CONTAINED IN AN AMOUNT OF 1 MG OR LESS PER KG OF THE POLISHING COMPOSITION;A PROCESS FOR REDUCING A SURFACE DEFECT OF A SUBSTRATE COMPRISING APPLYING TO A SUBSTRATE OR A POLISHING PAD A POLISHING COMPOSITION COMPRISING AN ABRASIVE, AN ACID AND/OR SALT THEREOF, AND WATER, WHEREIN COPPER (CU) IS CONTAINED IN AN AMOUNT OF 1 MG OR LESS PER KG OF THE POLISHING COMPOSITION FED TO THE SUBSTRATE OR THE POLISHING PAD; AND A PROCESS FOR MANUFACTURING A SUBSTRATE COMPRISING A POLISHING STEP COMPRISING APPLYING TO A SUBSTRATE OR A POLISHING COMPOSITION. THE POLISHING COMPOSITION OF THE PRESENT INVENTION IS USED FOR POLISHING A SUBSTRATE FOR PRECISION PARTS SUCH AS SUBSTRATES FOR MAGNETIC RECORDING MEDIA SUCH AS MAGNETIC DISKS, OPTICAL DISKS, OPTO-MAGNETIC DISKS, AND THE LIKE;PHOTOMASK SUBSTRATES, OPTICAL LENSES, OPTICAL MIRRORS, OPTICAL PRISMS AND SEMICONDUCTOR SUBSTRATES, CONCRETELY POLISHING A SUBSTRATE FOR MEMORY HARD DISKS, AND ESPECIALLY FINISH POLISHING.
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公开(公告)号：GB2405151A
公开(公告)日：2005-02-23
申请号：GB0416502
申请日：2004-07-23
Applicant: KAO CORP
Inventor： FUJII SHIGEO , KITAYAMA HIROAKI
Abstract: A method for manufacturing a substrate for a magnetic disk, including the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 žm, and an oxidizing agent, and (b) polishing the substrate with a polishing composition B containing silica particles having an average particle size of from 0.005 to 0.1 žm; a substrate for a magnetic disk, obtainable by the method for manufacturing a substrate for a magnetic disk; and a substrate for a magnetic disk having the following surface properties of a long-wavelength waviness of 0.05 nm or more and 0.3 nm or less, and an AFM surface roughness of 0.03 nm or more and 0.2 nm or less. The substrate for a magnetic disk may be suitably used in the manufacture of a hard disk having a high recording density. Especially, a hard disk having a recording density of 50 G bits or more per square inch may be industrially manufactured.
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Patent Agency Ranking
公开(公告)号：MY144163A
公开(公告)日：2011-08-15
申请号：MYPI20055484
申请日：2005-11-24
Applicant: KAO CORP
Inventor： FUJII SHIGEO , SUENAGA KENICHI
IPC: C09G1/02 , B24B37/00 , B24B37/005 , B24B57/02 , C09K3/14
Abstract: 25 ABSTP4CF POLISHING COMPOSITION THE PRESENT INVENTION PROVIDES A POLISHING COMPOSITION CONTAINING AN OIAANIC NITROCEN-COMAINING COMPOUND, AN ORGANIC POLYBASIC ACID, AN ABRASIVE. AND WATER. WHEREIN THE ORGANIC NIIIOGGEN-CONTAININO COMPOUND HAS IN THE 5 MOLECULE TWO OR MORE AMINO GROUPS, TWO OF MORE IMINO GROUPS, OR ONE OF MORE AMINO GROUPS AND ONE OR MORE IMINO GROUPS- A METHOD FOR MANUFACTURING A .TL 7 - SUBSTRATE WITH THE POLISHING COMPOSITION-, AND A METHOD FOR REDUCING SURFACE STAINS OF A SUBSTRATE WITH THE POLISHING COMPOSITION. THE POLISHING COMPOSITION CAN BE SUITABLY USED, FOR EXAMPLE, IN THE MANUFACTURING STEP FOR A SUBSTRATE FOR A 10 HARD DISK SUCH AS A MEMORV HARD DISK.
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公开(公告)号：GB2404921B
公开(公告)日：2007-09-12
申请号：GB0415976
申请日：2004-07-16
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO
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公开(公告)号：GB2405151B
公开(公告)日：2007-05-16
申请号：GB0416502
申请日：2004-07-23
Applicant: KAO CORP
Inventor： FUJII SHIGEO , KITAYAMA HIROAKI
Abstract: A method for manufacturing a substrate for a magnetic disk, including the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 μm, and an oxidizing agent, and (b) polishing the substrate with a polishing composition B containing silica particles having an average particle size of from 0.005 to 0.1 μm; a substrate for a magnetic disk, obtainable by the method for manufacturing a substrate for a magnetic disk; and a substrate for a magnetic disk having the following surface properties of a long-wavelength waviness of 0.05 nm or more and 0.3 nm or less, and an AFM surface roughness of 0.03 nm or more and 0.2 nm or less. The substrate for a magnetic disk may be suitably used in the manufacture of a hard disk having a high recording density. Especially, a hard disk having a recording density of 50 G bits or more per square inch may be industrially manufactured.
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公开(公告)号：GB2395486B
公开(公告)日：2006-08-16
申请号：GB0324148
申请日：2003-10-15
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , FUJII SHIGEO
Abstract: A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition. The polishing composition of the present invention is used for polishing a substrate for precision parts such as substrates for magnetic recording media such as magnetic disks, optical disks, opto-magnetic disks, and the like; photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, concretely polishing a substrate for memory hard disks, and especially finish polishing.
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公开(公告)号：GB2395486A
公开(公告)日：2004-05-26
申请号：GB0324148
申请日：2003-10-15
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , FUJII SHIGEO
IPC: C09G1/02
Abstract: A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition. The polishing composition of the present invention is used for polishing a substrate for precision parts such as substrates for magnetic recording media such as magnetic disks, optical disks, opto-magnetic disks, and the like; photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, concretely polishing a substrate for memory hard disks, and especially finish polishing.
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