公开(公告)号：WO2004078410A3

公开(公告)日：2004-11-04

申请号：PCT/JP2004002680

申请日：2004-03-03

Applicant: KAO CORP ,  EBARA CORP ,  HAGIHARA TOSHIYA ,  WADA YUTAKA ,  AKATSUKA TOMOHIKO ,  SASAKI TATSUYA

Inventor： HAGIHARA TOSHIYA ,  WADA YUTAKA ,  AKATSUKA TOMOHIKO ,  SASAKI TATSUYA

IPC: B24B7/22 ,  B24B37/00 ,  B24B57/00 ,  C09G1/00 ,  C09K3/14 ,  H01L21/304 ,  H01L21/3105

CPC classification number: C09G1/04 ,  B24B7/228 ,  B24B57/00 ,  H01L21/31053

Abstract: An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the agent is provided as a component of a polishing composition used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; a polishing composition which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the polishing composition comprises the above agent, and wherein the polishing composition is used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; and a process for increasing a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, comprising the step of applying the polishing composition to a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin.

Abstract translation: 一种用于提高抛光速率选择率的试剂，其中所述试剂包括有机阳离子化合物，其增加了氮化硅膜的研磨速率与氧化硅膜的研磨速率的比率，其中所述试剂被提供为 与固定研磨抛光工具一起使用的抛光组合物的组分，其包括包含磨料颗粒和树脂的抛光构件; 抛光组合物，其将氮化硅膜的研磨速度与氧化硅膜的研磨速度的比率增加，其中所述抛光组合物包含上述试剂，并且其中所述抛光组合物与固定的研磨抛光工具一起使用，所述固定研磨抛光工具包括 包括磨粒和树脂的抛光构件; 以及提高氮化硅膜的研磨速度与氧化硅膜的研磨速度的比例的方法，其特征在于，包括将研磨用组合物涂布在固定研磨用抛光工具上的工序，所述研磨抛光工具包括研磨材料，所述研磨部件包括磨粒和树脂 。

公开(公告)号：EP1478012A4

公开(公告)日：2005-06-01

申请号：EP03705360

申请日：2003-02-20

Applicant: EBARA CORP ,  KAO CORP

Inventor： WADA YUTAKA ,  AKATSUKA TOMOHIKO ,  SASAKI TATSUYA ,  HAGIHARA TOSHIYA

IPC: B24B7/22 ,  B24B37/04 ,  B24B49/12 ,  B24B53/007 ,  B24B53/02 ,  C09G1/00 ,  H01L21/304 ,  H01L21/3105 ,  B24B37/00 ,  C09K3/14

CPC classification number: B24B53/017 ,  B24B7/228 ,  B24B37/04 ,  B24B37/044 ,  B24B49/12 ,  B24B53/02 ,  C09G1/00 ,  H01L21/31053

Abstract: A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid which contains an anionic surfactant and no abrasive grains. The method can be advantageously employed for polishing an article to be polished, such as a semiconductor wafer, using fixed abrasive grains.

Abstract translation: 本发明涉及一种用固定磨料研磨诸如半导体晶片的工件的抛光方法和抛光液。 在通过将待研磨的工件压靠固定的研磨剂并使工件与固定的研磨剂滑动接触来研磨工件的抛光方法中，在提供包含阴离子表面活性剂的抛光液的同时抛光工件，并且 不含磨粒。

公开(公告)号：EP0779289A4

公开(公告)日：1999-06-02

申请号：EP95909997

申请日：1995-02-27

Applicant: KAO CORP

Inventor： HAGIHARA TOSHIYA ,  NAKAGAWA SHOJI ,  KOBAYASHI YUICHIRO ,  TOGASHI HIROYASU ,  TAIRA KOJI ,  SAKAI AKIMITSU

IPC: C07D317/12 ,  C07D317/22 ,  C07D493/04 ,  C10M105/18 ,  C10M171/00 ,  C07D317/18 ,  C07D319/06

CPC classification number: C07D493/04 ,  C07D317/12 ,  C07D317/22 ,  C10M105/18 ,  C10M171/008 ,  C10M2207/044 ,  C10M2211/022 ,  C10M2211/06 ,  C10N2240/00 ,  C10N2240/02 ,  C10N2240/22 ,  C10N2240/30 ,  C10N2240/50 ,  C10N2240/52 ,  C10N2240/54 ,  C10N2240/56 ,  C10N2240/58 ,  C10N2240/60 ,  C10N2240/66

Abstract: A synthetic lubricating oil containing a cyclic ketal or acetal prepared from at least one polyhydric alcohol selected from among tetra-, hexa-, octa- and decahydric alcohols and at least one member selected from among specified carbonyl compounds and ketals and acetals as reactive derivatives thereof; a refrigerator working fluid composition comprising a hydrofluorocarbon and a refrigerator oil containing the cyclic ketal or acetal; novel compounds among the cyclic acetals; and process for producing the same. The invention can provide an inexpensive synthetic lubricating oil which is excellent in heat and oxidation resistances, does not yield carboxylic acids upon hydrolysis, and is lowly hygroscopic. The invention provides also an inexpensive refrigerator working fluid composition which is excellent in electrical insulation and hygroscopicity and does not yield carboxylic acids upon hydrolysis.

Abstract translation: 本发明涉及一种合成润滑油，其包括通过一种或多种具有不少于4个且不大于10个羟基的多元醇与一种或多种特定羰基化合物的反应获得的环状缩酮或环状缩醛， 或作为所述羰基化合物的反应性衍生物的一种或多种缩酮或缩醛; 一种用于制冷机的工作流体组合物，包括氢氟烃和含有环状缩酮或环状缩醛的冷冻机油; 和上述环状缩醛的新化合物及其制备方法。 本发明提供合成润滑油，它具有良好的热稳定性，良好的抗氧化性，不会由于水解产生羧酸形成和低吸湿性，并且也便宜。 另外，也可以提供一种冷冻机的工作流体组合物，其显示出良好的绝缘性，良好的吸湿性，并且由于水解而没有羧酸形成以及廉价。

公开(公告)号：MY141876A

公开(公告)日：2010-07-16

申请号：MYPI20051185

申请日：2005-03-18

Applicant: KAO CORP

Inventor： YOSHIDA HIROYUKI ,  HONMA YUICHI ,  TAKASHINA SHIGEAKI ,  HAGIHARA TOSHIYA

IPC: C09G1/02 ,  B24B1/00 ,  B24B7/24 ,  B24B37/04 ,  B24D3/02 ,  C09K3/14

Abstract: THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; A METHOD FOR MANUFACTURING A SUBSTRATE INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; AND A METHOD FOR REDUCING SCRATCHES ON A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, INCLUDING THE STEP OF ADJUSTING A ZETA POTENTIAL OF SILICA PARTICLES IN THE POLISHING COMPOSITION TO -15 TO 40 MV. THE POLISHING COMPOSITION CAN BE FAVORABLY USED IN POLISHING THE SUBSTRATE FOR PRECISION PARTS, INCLUDING SUBSTRATES FOR MAGNETIC RECORDING MEDIA SUCH AS MAGNETIC DISCS, OPTICAL DISCS AND OPTO-MAGNETIC DISCS; PHOTOMASK SUBSTRATES; OPTICAL LENSES; OPTICAL MIRRORS; OPTICAL PRISMS; SEMICONDUCTOR SUBSTRATES; AND THE LIKE.

公开(公告)号：DE19983092B4

公开(公告)日：2008-09-04

申请号：DE19983092

申请日：1999-04-02

Applicant: KAO CORP

Inventor： HASHIMOTO JIRO ,  HAGIHARA TOSHIYA ,  NISHIMOTO KAZUHIKO

IPC: C10M105/18 ,  C10M107/34 ,  C10M125/00 ,  C10M125/26 ,  C10M169/04

Abstract: The present invention relates to a cutting oil comprising (a) a polyether compound represented by the formula (I):wherein each of R1 and R2, which may be identical or different, is hydrogen atom or a hydrocarbon group having 1 to 24 carbon atoms, at least one of which is a hydrocarbon group; EO is oxyethylene group; AO is an oxyalkylene group having 3 or 4 carbon atoms; and each of m and n is 1 to 50, wherein a sum of m and n is from 4 to 100; a cutting oil composition comprising the above cutting oil and an abrasive; a cutting method using the above cutting oil composition; and a process of cleaning a wafer, comprising the steps of cleaning a wafer obtainable by cutting an ingot with a wire saw using the above cutting oil composition; heating the resulting waste water to a temperature equal to or higher than a cloud point of a polyether compound represented by the formula (I) contained in the waste water, to allow separation into an oil phase and an aqueous phase; and removing the oil phase comprising the polyether compound from the waste water. According to the present invention, there can be obtained excellent dispersibility of the abrasive, and excellent re-dispersibility, cutting performance and workability when sedimented, and the object to be cut obtained after cutting can be easily cleaned.

公开(公告)号：MY133305A

公开(公告)日：2007-11-30

申请号：MYPI20022987

申请日：2002-08-10

Applicant: KAO CORP

Inventor： OSHIMA YOSHIAKI ,  HAGIHARA TOSHIYA

IPC: C09G1/02 ,  B24B37/00 ,  C09K3/14 ,  G11B5/84

Abstract: A POLISHING COMPOSITION COMPRISING AN ABRASIVE HAVIING AN AVERAGE PRIMARY PARTICLE SIZE OF 200 NM OR LESS, AN OXIDIZING AGENT, AN ACID HAVING A pK1 OF 2 OR LESS AND /OR A SALT THEREOF, AND WATER, WHEREIN THE ACID VALUE (Y) OF THE POLISHING COMPOSITION IS 20MG KOH/G OR LESS 0.2 MG KOH/G OR MORE; A PROCESS FOR REDUCING FINE SCRATCHES OF A SUBSTRATE, COMPRISING POLISHING A SUBSTRATE TO BE POLISHED WITH THE ABOVE-MENTIONED POLISHING COMPOSITION; AND A METHOD FOR MANUFACTURING A SUBSTRATE, COMPRISING POLISHING A SUBSTRATE TO BE POLISHED WITH THE ABOVE-MENTIONED POLISHING COMPOSITION . THE POLISHING COMPOSITION CAN BE SUITABLY USED FOR FINAL POLISHING MEMORY HARD DISK SUBSTRATES AND POLISHING SEMICONDUCTOR ELEMENTS.

公开(公告)号：MY127587A

公开(公告)日：2006-12-29

申请号：MYPI20040041

申请日：2004-01-08

Applicant: KAO CORP

Inventor： SUENAGA KENICHI ,  OSHIMA YOSHIAKI ,  HAGIHARA TOSHIYA

IPC: B24B7/22 ,  C09G1/02 ,  C09K3/14

Abstract: A POLISHING COMPOSITION FOR A SUBSTRATE FOR MEMORY HARD DISK, COMPRISING SILICA PARTICLES IN AN AQUEOUS MEDIUM, WHEREIN THE SILICA PARTICLES SATISFY A SPECIFIED RELATIONSHIP BETWEEN AN AVERAGE PARTICLE SIZE OF THE SILICA PARTICLES ON THE NUMBER BASIS AND A STANDARD DEVIATION ON THE NUMBER BASIS, WHEREIN THE AVERAGE PARTICLE SIZE IS OBTAINED BY A DETERMINATION BY TRANSMISSION ELECTRON MICROSCOPE (TEM) OBSERVATION, AND WHEREIN A PARTICLE SIZE AND A CUMULATIVE VOLUME FREQUENCY IN A RANGE OF PARTICLE SIZES OF FROM 60 TO 120 NM SATISFIES A SPECIFIED RELATIONSHIP; A METHOD OF REDUCING MICROWAVINESS OF A SUBSTRATE FOR MEMORY HARD DISK, COMPRISING THE STEP OF POLISHING AN NI-P PLATED SUBSTRATE FOR MEMORY HARD DISK WITH THE POLISHING COMPOSITION. THE METHOD CAN BE SUITABLY USED FOR THE MANUFACTURE OF A SUBSTRATE FOR PRECISION PARTS, SUCH AS A SUBSTRATE FOR MEMORY HARD DISK.(FIG.1)

公开(公告)号：GB2393447B

公开(公告)日：2006-04-19

申请号：GB0317224

申请日：2003-07-23

Applicant: KAO CORP

Inventor： KITAYAMA HIROAKI ,  FUJII SHIGEO ,  OSHIMA YOSHIAKI ,  HAGIHARA TOSHIYA

IPC: C09G1/02

Abstract: A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa.s at a shearing rate of 1500 s -1 and 25° C.; a roll-off reducing agent comprising a Brönsted acid or a salt thereof, having an action of lowering viscosity so that the amount of viscosity lowered is 0.01 mPa.s or more, wherein the amount of viscosity lowered is expressed by the following equation: (Amount of Viscosity Lowered)=(Viscosity of Standard Polishing Composition)-(Viscosity of Roll-Off Reducing Agent-Containing Polishing Composition), wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al 2 O 3 purity of 98.0% by weight or more composed of alpha-type co-random crystal, 1 part by weight of citric acid, and 79 parts by weight of water; the roll-off reducing agent-containing polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al 2 O 3 purity of 98.0% by weight or more composed of alpha-type co-random crystal, 1 part by weight of citric acid, 78.9 parts by weight of water and 0.1 parts by weight of a roll-off reducing agent; and the viscosity is a viscosity at a shearing rate of 1500 s -1 and 25° C. The polishing composition can be favorably used in polishing the substrate for precision parts.

公开(公告)号：DE69625088T2

公开(公告)日：2003-07-24

申请号：DE69625088

申请日：1996-09-20

Applicant: KAO CORP

Inventor： SAKAI AKIMITSU ,  HAGIHARA TOSHIYA

IPC: C07C69/28 ,  C07C69/30 ,  C07C69/33 ,  C09K5/04 ,  C10M105/38 ,  C10M171/00

Abstract: Ester compounds possessing heat stability in the presence of a metal and prepared from di- to nona- hydric hindered alcohols having 5 to 15 carbon atoms and saturated aliphatic monocarboxylic acids having 3 to 20 carbon atoms or derivatives thereof, characterized in that the proportion of the branched carboxylic acids or derivatives thereof in all the carboxylic acids or derivatives thereof is at least 50 % by mole and the ester compounds have a hydroxyl value of at most 30 mg KOH/g and an acid value after the sealed tube test of at most 10 mg KOH/g: and a lubricating oil composition characterized by containing at least 20 % by weight of the ester compounds. Thus the invention provides ester compounds possessing excellent heat stability in the presence of a metal, and a lubricating oil composition and a hydraulic fluid composition for refrigerators, each composed mainly of the ester compounds.

公开(公告)号：ES2060211T3

公开(公告)日：1994-11-16

申请号：ES91100747

申请日：1991-01-22

Applicant: KAO CORP

Inventor： HAGIHARA TOSHIYA ,  SAKAI AKIMITSU KAO SEIWARYO ,  KITAZAWA KOZO

IPC: C09K5/04 ,  C10M105/42 ,  C10M105/46 ,  C10M171/00 ,  C10N40/30 ,  C10M105/00