22.
    发明专利
    未知

    公开(公告)号:DE69705262D1

    公开(公告)日:2001-07-26

    申请号:DE69705262

    申请日:1997-05-27

    Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.

    26.
    发明专利
    未知

    公开(公告)号:DE60015686D1

    公开(公告)日:2004-12-16

    申请号:DE60015686

    申请日:2000-09-11

    Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer surface finish (11) comprising, in succession, an amorphous metal underlayer (12) a corrosion-resistent metal middle layer (13) and one or more outer layers of precious metal (14). In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni-P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.

    28.
    发明专利
    未知

    公开(公告)号:DE69705262T2

    公开(公告)日:2002-04-18

    申请号:DE69705262

    申请日:1997-05-27

    Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.

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