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公开(公告)号:HK1032562A1
公开(公告)日:2001-07-27
申请号:HK01103046
申请日:2001-04-27
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN
IPC: C25D5/12 , B32B15/01 , C23C18/08 , C25D5/10 , C25D7/00 , H01L23/495 , H01L23/50 , H01R13/03 , B32B , C25D , H01H , H01R
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer surface finish (11) comprising, in succession, an amorphous metal underlayer (12) a corrosion-resistent metal middle layer (13) and one or more outer layers of precious metal (14). In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni-P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.
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公开(公告)号:DE69705262D1
公开(公告)日:2001-07-26
申请号:DE69705262
申请日:1997-05-27
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , KADIJA IGOR VELJKO , FAN CHONGLUN
Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.
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公开(公告)号:CA2306319A1
公开(公告)日:2000-10-30
申请号:CA2306319
申请日:2000-04-20
Applicant: LUCENT TECHNOLOGIES INC
Inventor: MAISANO JOSEPH JOHN JR , ABYS JOSEPH ANTHONY
Abstract: A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits. A process is also described whereby the sodium gold sulfite solution can be solidified by a freeze-drying process.
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公开(公告)号:HK1004817A1
公开(公告)日:1998-12-11
申请号:HK98103990
申请日:1998-05-08
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN , KADIJA IGOR VELJKO
Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.
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公开(公告)号:MY135997A
公开(公告)日:2008-07-31
申请号:MYPI20004397
申请日:2000-09-21
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN
Abstract: IN ACCORDANCE WITH THE INVENTION, A METAL SUBSTRATE (10) IS COATED WITH A MULTILAYER SURFACE FINISH (11) COMPRISING, IN SUCCESSION, AN AMORPHOUS METAL UNDERLAYER (12), A CORROSIONRESISTENT METAL MIDDLE LAYER (13) AND ONE OR MORE OUTER LAYERS (14) OF PRECIOUS METAL. IN AN EXEMPLARY EMBODIMENT THE METAL SUBSTRATE (10) COMPRISES COPPER ALLOY, THE AMORPHOUS METAL UNDERLAYER (12) IS NI-P, THE MIDDLE LAYER (13) IS NICKEL AND THE OUTER LAYER (14) IS PALLADIUM. THE RESULTING STRUCTURE IS PARTICULARLY USEFUL AS AN ELECTRICAL CONNECTOR.(FIG 1)
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公开(公告)号:DE60015686D1
公开(公告)日:2004-12-16
申请号:DE60015686
申请日:2000-09-11
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN
IPC: C25D5/12 , B32B15/01 , C23C18/08 , C25D5/10 , C25D7/00 , H01L23/495 , H01L23/50 , H01R13/03 , B29C70/00 , G11B23/00
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer surface finish (11) comprising, in succession, an amorphous metal underlayer (12) a corrosion-resistent metal middle layer (13) and one or more outer layers of precious metal (14). In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni-P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.
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公开(公告)号:DE60006335D1
公开(公告)日:2003-12-11
申请号:DE60006335
申请日:2000-08-14
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , DULLAGHAN CONOR ANTHONY , FAN CHONGLUN , SMITH BRIAN THOMAS
IPC: C25D3/12 , C25D3/56 , C25D3/62 , C25D5/12 , C25D15/00 , C25D15/02 , H01R13/00 , H01R13/03 , H05K3/24
Abstract: An electrical connector comprises connector contacts having a metal base and a surface finish layer over the base, the surface finish layer being a composite of an electroplated precious metal composition and wear resistant particles dispersed therein. In the preferred embodiment, the precious metal layer is a PdCo alloy and the wear resistant particles are sub-micron sized lubricating particles, e.g. polytetrafluoroethylene particles and a flash coat of gold is provided over the composite layer.
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公开(公告)号:DE69705262T2
公开(公告)日:2002-04-18
申请号:DE69705262
申请日:1997-05-27
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , KADIJA IGOR VELJKO , FAN CHONGLUN
Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.
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29.
公开(公告)号:SG77691A1
公开(公告)日:2001-01-16
申请号:SG1999002769
申请日:1999-06-07
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , BLAIR ALAN , FAN CHONGLUN
IPC: C23C28/00 , C23C28/02 , H01L23/50 , C25D3/50 , C25D3/52 , C25D5/12 , H01L21/48 , H01L21/607 , H01L23/495
Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN50) while at least one material layer has a hardness that is less than about 250 (KHN50).
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30.
公开(公告)号:CA2270303A1
公开(公告)日:1999-12-10
申请号:CA2270303
申请日:1999-04-27
Applicant: LUCENT TECHNOLOGIES INC
Inventor: BLAIR ALAN , FAN CHONGLUN , ABYS JOSEPH ANTHONY
IPC: H01L23/50 , C23C28/00 , C23C28/02 , C25D3/50 , C25D3/52 , C25D5/12 , H01L21/48 , H01L21/607 , H01L23/495 , C25D7/00 , C25D5/10 , C25D5/16
Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN50) while at least one material layer has a hardness that is less than about 250 (KHN50).
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